Power Switch ICs - Power Distribution 36V 6A High Side
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | MODULE |
| 包装说明 | TO-263, SMSIP4/5H,.53,67TB |
| 针数 | 4 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 内置保护 | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
| 驱动器位数 | 1 |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PSSO-G4 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 4 |
| 输出电流流向 | SINK |
| 最大输出电流 | 2 A |
| 标称输出峰值电流 | 9 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TO-263 |
| 封装等效代码 | SMSIP4/5H,.53,67TB |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 8/36 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.03 mm |
| 最大供电电压 | 36 V |
| 最小供电电压 | 5.5 V |
| 标称供电电压 | 13 V |
| 表面贴装 | YES |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.7 mm |
| 端子位置 | SINGLE |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 9.15 mm |
| VN750-B5 | VN750 | VN750S | |
|---|---|---|---|
| 描述 | Power Switch ICs - Power Distribution 36V 6A High Side | Power Switch ICs - Power Distribution 36V 6A High Side | Power Switch ICs - Power Distribution 36V 6A High Side |
| 是否无铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | MODULE | ZFM | SOIC |
| 包装说明 | TO-263, SMSIP4/5H,.53,67TB | PENTAWATT-5 | SOP, SOP8,.25 |
| 针数 | 4 | 5 | 8 |
| Reach Compliance Code | not_compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 内置保护 | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
| 驱动器位数 | 1 | 1 | 1 |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PSSO-G4 | R-PZFM-T5 | R-PDSO-G8 |
| JESD-609代码 | e0 | e3 | e4 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 4 | 5 | 8 |
| 输出电流流向 | SINK | SINK | SINK |
| 最大输出电流 | 2 A | 2 A | 2 A |
| 标称输出峰值电流 | 9 A | 9 A | 9 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TO-263 | ZIP | SOP |
| 封装等效代码 | SMSIP4/5H,.53,67TB | ZIP5,.15,.2,67TB | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | FLANGE MOUNT | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 8/36 V | 8/36 V | 8/36 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 36 V | 36 V | 36 V |
| 最小供电电压 | 5.5 V | 5.5 V | 5.5 V |
| 标称供电电压 | 13 V | 13 V | 13 V |
| 表面贴装 | YES | NO | YES |
| 端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.7 mm | 1.7 mm | 1.27 mm |
| 端子位置 | SINGLE | ZIG-ZAG | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 5.03 mm | - | 1.75 mm |
| 宽度 | 9.15 mm | - | 3.9 mm |
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