Supervisory Circuits
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC20,.20SQ,25 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC20,.20SQ,25 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 3/5,6.5/13 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |
| MAX6891ETP | MAX6889ETJ-T | MAX6891ETP-T | MAX6890ETI-T | MAX6890ETI | MAX6889ETJ | MAX6890ETI+T | MAX6889ETJ+ | MAX6890ETI+ | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits EEPROM-Prog Octal Power-Sup Sequencer | Supervisory Circuits EEPROM-Programmable, Octal/Hex/Quad, Power-Supply Sequencers/Supervisors | IC SEQUENCE/SUPERVISOR 32TQFN | Power Supply Management Circuit, Adjustable, 6 Channel, BICMOS, PQCC28, 5 X 5 MM, TQFN-28 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN | - | QFN | QFN |
| 包装说明 | HVQCCN, LCC20,.20SQ,25 | 5 X 5 MM, TQFN-32 | HVQCCN, LCC20,.20SQ,25 | HVQCCN, LCC28,.2SQ,20 | HVQCCN, LCC28,.2SQ,20 | 5 X 5 MM, TQFN-32 | - | HVQCCN, LCC32,.2SQ,20 | HVQCCN, |
| 针数 | 20 | 32 | 20 | 28 | 28 | 32 | - | 32 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES | YES | - | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PQCC-N20 | S-PQCC-N32 | S-PQCC-N20 | S-PQCC-N28 | S-PQCC-N28 | S-PQCC-N32 | - | S-PQCC-N32 | S-PQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | e3 | e3 |
| 长度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | - | 5 mm | 5 mm |
| 湿度敏感等级 | 1 | - | - | - | 1 | 1 | - | 1 | 1 |
| 信道数量 | 4 | 8 | 4 | 6 | 6 | 8 | - | 8 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 20 | 32 | 20 | 28 | 28 | 32 | - | 32 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | - | HVQCCN | HVQCCN |
| 封装等效代码 | LCC20,.20SQ,25 | LCC32,.2SQ,20 | LCC20,.20SQ,25 | LCC28,.2SQ,20 | LCC28,.2SQ,20 | LCC32,.2SQ,20 | - | LCC32,.2SQ,20 | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 245 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 245 | 245 | - | 260 | 260 |
| 电源 | 3/5,6.5/13 V | 3/5,6.5/13 V | 3/5,6.5/13 V | 3/5,6.5/13 V | 3/5,6.5/13 V | 3/5,6.5/13 V | - | 3/5,6.5/13 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | MATTE TIN |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | - | 5 mm | 5 mm |
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