NBC12429, NBC12429A
3.3V/5V Programmable PLL
Synthesized Clock
Generator
25 MHz to 400 MHz
Description
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MARKING
DIAGRAMS
1 28
The NBC12429 and NBC12429A are general purpose,
Phase−Lock−Loop (PLL) based synthesized clock sources. The VCO
will operate over a frequency range of 200 MHz to 400 MHz. The
VCO frequency is sent to the N−output divider, where it can be
configured to provide division ratios of 1, 2, 4, or 8. The VCO and
output frequency can be programmed using the parallel or serial
interfaces to the configuration logic. Output frequency steps of
125 kHz, 250 kHz, 500 kHz, or 1.0 MHz can be achieved using a
16 MHz crystal, depending on the output dividers. The PLL loop filter
is fully integrated and does not require any external components.
Features
281
PLCC−28
FN SUFFIX
CASE 776
NBC12429xG
AWLYYWW
•
•
•
•
•
•
•
•
•
Best−in−Class Output Jitter Performance,
±20
ps Peak−to−Peak
25 MHz to 400 MHz Programmable Differential PECL Outputs
Fully Integrated Phase−Lock−Loop with Internal Loop Filter
LQFP−32
FA SUFFIX
CASE 873A
NBC12
429x
AWLYYWWG
Parallel Interface for Programming Counter and Output Dividers
During Powerup
•
Minimal Frequency Overshoot
Serial 3−Wire Programming Interface
Crystal Oscillator Interface
Operating Range: V
CC
= 3.135 V to 5.25 V
CMOS and TTL Compatible Control Inputs
1
1
32
QFN32
MN SUFFIX
CASE 488AM
NBC12
429x
AWLYYWWG
G
Pin and Function Compatible with Motorola MC12429 and
MPC9229
•
0°C to 70°C Ambient Operating Temperature (NBC12429)
•
−40°C
to 85°C Ambient Operating Temperature (NBC12429A)
•
Pb−Free Packages are Available
x
= Blank or A
A
= Assembly Location
WL, L = Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 18 of this data sheet.
©
Semiconductor Components Industries, LLC, 2009
January, 2009
−
Rev. 13
1
Publication Order Number:
NBC12429/D
NBC12429, NBC12429A
The following gives a brief description of the functionality of the NBC12429 and NBC12429A Inputs and Outputs. Unless
explicitly stated, all inputs are CMOS/TTL compatible with either pullup or pulldown resistors. The PECL outputs are capable
of driving two series terminated 50
W
transmission lines on the incident edge.
Table 3. PIN FUNCTION DESCRIPTION
Pin Name
INPUTS
XTAL1, XTAL2
S_LOAD*
Crystal Inputs
CMOS/TTL Serial Latch Input
(Internal Pulldown Resistor)
CMOS/TTL Serial Data Input
(Internal Pulldown Resistor)
CMOS/TTL Serial Clock Input
(Internal Pulldown Resistor)
CMOS/TTL Parallel Latch Input
(Internal Pullup Resistor)
These pins form an oscillator when connected to an external series−resonant
crystal.
This pin loads the configuration latches with the contents of the shift registers. The
latches will be transparent when this signal is HIGH; thus, the data must be stable
on the HIGH−to−LOW transition of S_LOAD for proper operation.
This pin acts as the data input to the serial configuration shift registers.
This pin serves to clock the serial configuration shift registers. Data from S_DATA
is sampled on the rising edge.
This pin loads the configuration latches with the contents of the parallel inputs.
The latches will be transparent when this signal is LOW; therefore, the parallel
data must be stable on the LOW−to−HIGH transition of P_LOAD for proper opera-
tion.
These pins are used to configure the PLL loop divider. They are sampled on the
LOW−to−HIGH transition of P_LOAD. M[8] is the MSB, M[0] is the LSB.
These pins are used to configure the output divider modulus. They are sampled
on the LOW−to−HIGH transition of P_LOAD.
Active HIGH Output Enable. The Enable is synchronous to eliminate possibility of
runt pulse generation on the F
OUT
output.
These differential, positive−referenced ECL signals (PECL) are the outputs of the
synthesizer.
The function of this output is determined by the serial configuration bits T[2:0].
The positive supply for the internal logic and output buffer of the chip, and is con-
nected to +3.3 V or +5.0 V.
This is the positive supply for the PLL and is connected to +3.3 V or +5.0 V.
These pins are the negative supply for the chip and are normally all connected to
ground.
The Exposed Pad (EP) on the QFN−32 package bottom is thermally connected to
the die for improved heat transfer out of package. The exposed pad must be at-
tached to a heat−sinking conduit. The pad is electrically connected to GND.
Function
Description
S_DATA*
S_CLOCK*
P_LOAD**
M[8:0]**
N[1:0]**
OE**
OUTPUTS
F
OUT
, F
OUT
TEST
POWER
V
CC
PLL_V
CC
GND
−
CMOS/TTL PLL Loop Divider
Inputs (Internal Pullup Resistor)
CMOS/TTL Output Divider Inputs
(Internal Pullup Resistor)
CMOS/TTL Output Enable Input
(Internal Pullup Resistor)
PECL Differential Outputs
CMOS/TTL Output
Positive Supply for the Logic
Positive Supply for the PLL
Negative Power Supply
Exposed Pad for QFN−32 only
* When left Open, these inputs will default LOW.
** When left Open, these inputs will default HIGH.
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4
NBC12429, NBC12429A
Table 4. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Pb Pkg
PLCC
LQFP
QFN
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Oxygen Index: 28 to 34
Level 1
Level 2
Level 1
Value
75 kW
37.5 kW
> 2 kV
> 150 V
> 1 kV
Pb−Free Pkg
Level 3
Level 2
Level 1
Moisture Sensitivity (Note 1)
UL 94 V−0 @ 0.125 in
2035
Table 5. MAXIMUM RATINGS
Symbol
V
CC
V
I
I
out
T
A
Positive Supply
Input Voltage
Output Current
Operating Temperature Range
Parameter
Condition 1
GND = 0 V
GND = 0 V
Continuous
Surge
NBC12429
NBC12429A
V
I
V
CC
Condition 2
Rating
6
6
50
100
0 to 70
−40
to +85
−65
to +150
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
2S2P
<3 sec @ 248°C
<3 sec @ 260°C
PLCC−28
PLCC−28
PLCC−28
LQFP−32
LQFP−32
LQFP−32
QFN−32
QFN−32
QFN−32
63.5
43.5
22 to 26
80
55
12 to 17
31
27
12
265
265
Unit
V
V
mA
mA
°C
T
stg
q
JA
q
JC
q
JA
q
JC
q
JA
q
JC
T
sol
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Wave Solder
Pb
Pb−Free
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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5
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