MIC5376/7/8
High Performance Low Dropout 150 mA LDO
Features
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4-Lead 1 mm x 1 mm Thin DFN: MIC5376
8-Lead 1.2 mm x 1.2 mm Thin QFN: MIC5377/8
Low-Cost 5-Lead SC-70 Package Available
Low Dropout Voltage: 120 mV at 150 mA
Input Voltage Range: 2.5V to 5.5V
150 mA Guaranteed Output Current
Stable with 0402 Ceramic Capacitors as Low as
1 µF
Low Quiescent Current: 29 µA
Excellent Load/Line Transient Response
Fixed Output Voltages: MIC5376
Adjustable Output Voltages: MIC5377/8
Output Discharge Circuit: MIC5376/8
High Output Accuracy
- ±2% Initial Accuracy
Thermal Shutdown and Current Limit Protection
General Description
The MIC5376, MIC5377, and MIC5378 are advanced,
general purpose linear regulators that offer low dropout
in ultra-small packages. The MIC5376 provides a fixed
output voltage in a 1 mm x 1 mm Thin DFN package
while the MIC5377 and MIC5378 provide adjustable
output voltages in a 1.2 mm x 1.2 mm Thin QFN
package. When the MIC5376 or MIC5378 are disabled,
an internal resistive load is automatically applied to the
output to discharge the output capacitor. The
MIC5376/7/8 are capable of sourcing 150 mA output
current with low dropout, making it an ideal solution for
any portable electronic application.
Ideal
for
battery-powered
applications,
the
MIC5376/7/8 offer 2% initial accuracy, low dropout
voltage (120 mV at 150 mA), and ground current
(typically 29 µA). The MIC5376/7/8 can also be put into
a zero-off-mode current state, drawing virtually no
current when disabled.
The MIC5376 is available in lead-free (RoHS
compliant) 1 mm x 1 mm Thin DFN and SC-70-5
packages. The MIC5377/8 are available in lead-free
(RoHS compliant) 1.2 mm x 1.2 mm Thin QFN and
SC-70-5 packages.
The MIC5376/7/8 have an operating
temperature range of –40°C to 125°C.
junction
Applications
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Mobile Phones
Digital Cameras
GPS, PDAs, PMP, Handhelds
Portable Electronics
Typical Application Circuit
MIC5376-xxYMT
VIN
VOUT
1μF
VBAT
GND
EN
1μF
V
OUT
= 2.8V
2018 Microchip Technology Inc.
DS20006080A-page 1
MIC5376/7/8
Package Types
MIC5376 (Fixed Output)
4-Lead 1 mm x 1 mm TDFN (MT)
(Top View)
MIC5376 (Fixed Output)
5-Lead SC-70 (C5)
(Top View)
VIN
4
EN
3
EN GND VIN
1
2
3
1
VOUT
2
GND
4
NC
5
VOUT
MIC5377/8 (Adjustable Output)
8-Lead 1.2 mm x 1.2 mm TQFN (MT)
(Top View)
MIC5377/8 (Adjustable Output)
5-Lead SC-70 (C5)
(Top View)
EN 1
VIN 2
VOUT 3
8
7 ADJ
6 GND
5 GND
EN GND VIN
1
2
3
4
4
ADJ
5
VOUT
Functional Block Diagram
MIC5376 Block Diagram
VIN
EN
Reference
LDO
Auto
Discharge
VOUT
GND
MIC5377/8 Block Diagram
VIN
EN
Reference
LDO
Auto
Discharge*
*MIC5378 Only
VOUT
ADJ
GND
DS20006080A-page 2
2018 Microchip Technology Inc.
MIC5376/7/8
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (V
IN
) ......................................................................................................................................... 0V to +6V
Enable Voltage (V
EN
) ..........................................................................................................................................0V to V
IN
Power Dissipation (P
D
) (Note
1)
............................................................................................................ Internally Limited
Lead Temperature (Soldering, 5 sec.)................................................................................................................... +260°C
Junction Temperature (T
J
)...................................................................................................................... –40°C to +125°C
Storage Temperature (T
S
)...................................................................................................................... –65°C to +150°C
ESD Rating (Note
2)
.................................................................................................................................................. 2 kV
Operating Ratings ††
Supply Voltage (V
IN
) ..................................................................................................................................... 2.5V to 5.5V
Enable Voltage (V
EN
) ..........................................................................................................................................0V to V
IN
Junction Temperature (T
J
)...................................................................................................................... –40°C to +125°C
Package Thermal Resistance
1 mm x 1 mm TDFN-4 (
JA
) ................................................................................................................................250°C/W
1.2 mm x 1.2 mm TQFN-8 (
JA
)..........................................................................................................................250°C/W
SC-70-5 (
JA
) ...................................................................................................................................................256.5°C/W
† Notice:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
†† Notice:
The device is not guaranteed to function outside its operating ratings.
Note 1:
The maximum allowable power dissipation of any T
A
(ambient temperature) is P
D(MAX)
= (T
J(MAX)
– T
A
)/θ
JA
.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-
ulator will go into thermal shutdown.
2:
Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100pF.
2018 Microchip Technology Inc.
DS20006080A-page 3
MIC5376/7/8
ELECTRICAL CHARACTERISTICS
Electrical Characteristics:
V
IN
= V
EN
= V
OUT
+ 1V; C
IN
= C
OUT
= 1 µF for V
OUT
≥
2.5V, C
IN
= C
OUT
= 2.2 µF for
V
OUT
< 2.5V; I
OUT
= 100 µA; T
J
= +25°C,
bold
values indicate –40°C to +125°C, unless noted.
Note 1
Parameter
Output Voltage Accuracy
Line Regulation
Load Regulation (Note
2)
Dropout Voltage (Note
3)
Ground Pin Current
(Note
4)
Ground Pin Current in
Shutdown
Ripple Rejection
Current Limit
Output Voltage Noise
Auto-Discharge NFET
Resistance
Reference Voltage
Accuracy
Adjust Pin Input Current
Enable Input
Enable Input Voltage
Enable Input Current
Turn-On Time
Note 1:
2:
3:
V
EN
I
EN
t
ON
—
1.2
—
—
—
—
—
0.01
0.01
45
0.2
—
1
1
100
V
µA
µs
Logic low.
Logic high.
V
IL
≤
0.2V
V
IH
≥
1.2V
C
OUT
= 1 µF; I
OUT
= 150 mA
Sym.
V
OUT
∆V
OUT
/
V
OUT
∆V
OUT
/
V
OUT
V
DO
I
GND
I
GND-SHDN
Min.
–2.0
–3.0
—
—
—
—
—
—
—
—
200
—
—
Typ.
—
—
0.02
0.3
45
120
29
0.05
60
50
370
200
30
Max.
2.0
3.0
0.3
1.0
100
200
45
1
—
—
550
—
—
Units
%
%
%
Conditions
Variation from nominal V
OUT
V
IN
= V
OUT
+1V to 5.5V; I
OUT
= 100 µA
I
OUT
= 100 µA to 150 mA
I
OUT
= 50 mA
I
OUT
= 150 mA
I
OUT
= 0 mA
V
EN
≤
0.2V
f = 1 kHz; C
OUT
= 1 µF
f = 10 kHz; C
OUT
= 1 µF
V
OUT
= 0V
mV
µA
µA
dB
mA
PSRR
I
LIM
e
n
R
DS(ON)
µV
RMS
C
OUT
= 1 µF, 10 Hz to 100 kHz
Ω
V
EN
= 0V; V
IN
= 3.6V
Reference Voltage (MIC5377/8)
V
REF
I
ADJ-BIAS
0.97
—
1
0.01
1.03
—
V
µA
—
—
4:
Specification for packaged product only.
Regulation is measured at constant junction temperature using low duty cycle pulse testing.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below
its nominal value measured at 1V differential. For outputs below 2.5V, dropout voltage is the input-to-out-
put differential with the minimum input voltage 2.5V.
Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum
of the load current plus the ground pin current.
DS20006080A-page 4
2018 Microchip Technology Inc.
MIC5376/7/8
TEMPERATURE SPECIFICATIONS
Parameters
Temperature Ranges
Junction Temperature Range
Lead Temperature
Storage Temperature
Package Thermal Resistances
Thermal Resistance, 1x1 TDFN 4-Ld
Thermal Resistance, 1.2x1.2 TQFN
8-Ld
Thermal Resistance, SC-70-5
Note 1:
JA
JA
JA
—
—
—
250
250
256.5
—
—
—
°C/W
°C/W
°C/W
—
—
—
T
J
—
T
S
–40
—
–65
—
—
—
+125
+260
+150
°C
°C
°C
—
Soldering, 5 sec.
—
Sym.
Min.
Typ.
Max.
Units
Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
JA
). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc.
DS20006080A-page 5
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