Chip Monolithic Ceramic Capacitor for General
GRM21BZ7YA475KE15_ (0805, X7R:MURATA, 4.7uF, DC35V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
Reference Sheet
2.MURATA Part NO. System
(Ex.)
GRM
21
(1)L/W
Dimensions
B
(2)T
Dimensions
Z7
(3)Temperature
Characteristics
YA
(4)Rated
Voltage
475
(5)Nominal
Capacitance
K
(6)Capacitance
Tolerance
E15
(7)Murata’s Control
Code
L
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
2.0±0.2
(1)-2 W
1.25±0.2
(2) T
1.25±0.2
e
0.2 to 0.7
(Unit:mm)
g
0.7 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7R(MURATA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-15 to 15 % *
-55 to 125 °C
(25 °C)
DC 35 V
4.7 uF
±10 %
-55 to 125 °C
"* Range of capacitance change rate with 50% rated voltage applied.
(As for detail, please see the No.8 Capacitance Temperature Characteristics.)"
5.Package
mark
L
K
(8) Packaging
f180mm
Reel
EMBOSSED W8P4
f330mm
Reel
EMBOSSED W8P4
Packaging Unit
3000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of Sep.27,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM21BZ7YA475KE15-01
1
■
Specifications and Test Methods
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
V
P-P
or V
O-P
, whichever is larger, should be maintained
within the rated voltage range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using calipers.
Measurement Point :
Test Voltage
:
Applied Time
5
Insulation Resistance(I.R.)
More than 2000MΩ or 50Ω
∙
F (Whichever is smaller)
:
Between the terminations
250% of the rated voltage
1 to 5 s
Between the terminations
DC Rated Voltage
1 min
Charge/discharge current : 50mA max.
Measurement Point
:
Measurement Voltage :
Charging Time
:
Charge/discharge current : 50mA max.
Measurement Temperature :Room Temperature
6
7
Capacitance
Dissipation Factor (D.F.)
Shown in Rated value.
Z7: 0.1 max.
Measurement Temperature :Room Temperature
Capacitance
C≦10μF
(10V min.)
C≦10μF
(6.3V max.)
C＞10μF
Frequency
1.0+/-0.1kHz
1.0+/-0.1kHz
120+/-24Hz
Voltage
1.0+/-0.2Vrms
0.5+/-0.1Vrms
0.5+/-0.1Vrms
8
Temperature
Characteristics
of Capacitance
50% of
the rated
voltage
Z7 : Within ±15%
(-55°C to +125°C)
The capacitance change should be measured after 5 min.
at each specified temp. stage.
In case of applying voltage, the capacitance change should be
each temp. stage.
Capacitance change rate
＝
(C1-C2)/C3
C2:Capacitance value shown in the table at step 4
C3:Capacitance value shown in the table at step 1
C1:Capacitance value shown in the table from step 3 to step 5 measured after 1 min. with applying voltage in equilibration of
Step
1
2
3
4
5
½Initial
measurement
Temperature(C)
25+/-2
25+/-2
-55+/-3(for Z7)
25+/-2
125+/-3(for Z7)
Applying
voltage(V)
No bias
50% of
the rated
voltage
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9
Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
Solder the capacitor on the test substrate shown in Fig.3.
Type
GRM03
GRM15/GRM18
GRM21/GRM31
Applied Force(N)
2
5
10
Holding Time
:
10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
JEMCGS-03414C
2
No
10 Vibration
Item
Appearance
Capacitance
D.F.
Specification
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
Kind of Vibration
Total amplitude
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.3.
:
:
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate
Bending test
Appearance
Capacitance
Change
No defects or abnormalities.
Within +/-10%
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method :
Flexure
Holding Time
Soldering Method
:
:
:
:
:
:
:
:
:
:
:
:
:
:
Shown in Fig.2
1mm
5+/-1s
Reflow soldering
Solder bath method
Solution of rosin ethanol 25(wt)%
80℃ to 120℃ for 10s to 30s
Sn-3.0Ag-0.5Cu
245+/-5℃
2+/-0.5s
Solder bath method
Sn-3.0Ag-0.5Cu
270+/-5℃
10+/-0.5s
24+/-2h
120℃ to 150℃ for 1 min
12 Solderability
95% of the terminations is to be soldered evenly and
continuously.
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
13 Resistance
to
Soldering
Heat
Appearance
Capacitance
Change
D.F.
I.R.
No defects or abnormalities.
Z7
:
Within +/-15%
<GRM03 size min.>
Test Method
Solder
Solder Temp.
Immersion time
Within the specified initial value.
Within the specified initial value.
Exposure Time
Preheat
· Initial measurement
Voltage proof No defects.
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14 Temperature
Sudden Change
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
Capacitance
Change
Z7
: Within ±7.5%
shown in the following table.
Step
1
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp
Max.Operating Temp.+3/-0
Room Temp
Time
(min)
30+/-3
2 to 3
30+/-3
2 to 3
D.F.
Within the specified initial value.
2
3
4
I.R.
Within the specified initial value.
Exposure Time
· Initial measurement
:
24+/-2h
Voltage proof No defects.
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15
High
Temperature
High
Humidity
(Steady)
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Humidity
:
:
:
:
:
40+/-2℃
90%RH to 95%RH
500+/-12h
DC Rated Voltage
24+/-2h
Capacitance
Change
D.F.
Z7
: Within +/-12.5%
Test Time
Applied Voltage
Charge/discharge current : 50mA max.
Z7
: 0.2 max.
Exposure Time
· Initial measurement
I.R.
Z7
: More than 500MΩ or 12.5Ω
∙
F (Whichever is smaller)
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
JEMCGS-03414C
3
No
16 Durability
Item
Appearance
Specification
No defects or abnormalities.
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
:
:
:
:
Max. Operating Temp. +/-3℃
1000+/-12h
150% of the rated voltage
24+/-2h
Capacitance
Change
Z7
: Within +/-12.5%
Test Time
Applied Voltage
Exposure Time
Charge/discharge current : 50mA max.
D.F.
Z7
: 0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
I.R.
Z7
: More than 1000MΩ or 25Ω
∙
F (Whichever is smaller)
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Test method : Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
*1,2：2.0±0.05
Land
f4.5
Type
GRM03
GRM15
GRM18
GRM21
GRM31
a
100
a
0.3
0.4
1.0
1.2
2.2
Dimension (mm)
＊1
＊2
φ1.5
b
c
0.9
0.3
1.5
0.5
Ａ
3.0
1.2
4.0
1.65
0.05以下
5.0
2.0
+0.1
-0
4.0±0.1
3.5±0.05
40
c
c
1.75±0.1
8.0±0.3
b
Ｂ
t
Fig.1
(in mm)
・Kind
of Solder : Sn-3.0Ag-0.5Cu
・Pressurization
method
20
50 min.
Pressurization
speed
1.0mm/s
Capacitor
R5
Pressurize
45
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change,
High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・
Kind of Solder : Sn-3.0Ag-0.5Cu
・
Land Dimensions
Chip Capacitor
Land
Type
GRM03
GRM15
GRM18
GRM21
GRM31
b
a
Solder Resist
a
0.3
0.4
1.0
1.2
2.2
Dimension (mm)
b
0.9
1.5
3.0
4.0
5.0
c
0.3
0.5
1.2
1.65
2.0
c
Fig.3
JEMCGS-03414C
4
Package
GRM Type
1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
Type
GRM01
GRM02
GRM03
2
3
5
2
3/X
5(LWT Dimensions Tolerance:±0.05)
15000(W8P2)
15000(W8P2) 30000(W8P1)
10000(W8P2)
20000(W8P2)
10000(W8P2)
10000(W8P2) 20000(W8P1)
10000(W8P2)
10000(W8P2)
10000(W8P2)
φ180mm reel
Paper Tape
Plastic Tape
Code:D/E
Code:W
Code:L
50000(W4P1)
40000(W4P1)
φ330mm reel
Paper Tape Plastic Tape
Code:J/ F
Code:K
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
40000(W8P2)
50000(W8P2)
GRM15
5(LWT Dimensions Tolerance:±0.1min.)
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
5(LW Dimensions Tolerance:±0.2
and T Dimensions:0.5 +0/-0.1)
GRM18
GRM21
6
9
A/B
6/9
M/X
C
9
A/M
N
C
R/D/E
M
N/R/D
E
S
M
N/C/R/D
E
F
4000
4000
4000
4000
3000
3000
3000
2000
10000
10000
10000
10000
10000
10000
10000
6000
GRM31
4000
3000
2000
2000
1000
1000
1000
500
500
1000
1000
500
300
10000
10000
8000
6000
4000
5000
4000
2000
1500
5000
4000
1500
GRM32
GRM43
GRM55
0.9±0.05
1.2 Dimensions of Tape
(1)GRM01/02 (W4P1 CODE:L)
*1,2：1.0±0.02
φ0.8±0.04
2.0±0.04
*1
*2
＊ 1,2：1.0± 0.02
(in:mm)
φ 0.8±0.04
2.0±
＊1
0.15½0.25
1.8±0.02
4.0±0.05
Ａ
Ａ
Ｂ
Ｂ
0.05以下
0.05 max.
t
Type
GRM01
GRM02
1
2
Dimensions(Chip)
L
W
T
0.25±0.013 0.125±0.013 0.125±0.013
0.4±0.02
0.2±0.02
0.2±0.02
0.4±0.05
0.2±0.05
0.2±0.05
A *3
0.145
0.23
0.26
*3 Nominal value
B *3
0.27
0.43
0.46
t
0.4 max.
0.5 max.
JEMCGP-01796E
5
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