NBXDBA019, NBXHBA019,
NBXSBA019
3.3 V, 125 MHz / 250 MHz
LVPECL Clock Oscillator
The single and dual frequency crystal oscillator (XO) is designed to
meet today’s requirements for 3.3 V LVPECL clock generation
applications. The device uses a high Q fundamental crystal and Phase
Lock Loop (PLL) multiplier to provide selectable 125 MHz or
250 MHz, ultra low jitter and phase noise LVPECL differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1000.
Features
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MARKING
DIAGRAMS
NBXDBA019
125/250
AAWLYYWWG
6 PIN CLCC
LN SUFFIX
CASE 848AB
•
•
•
•
•
•
•
•
•
LVPECL Differential Output
Uses High Q Fundamental Mode Crystal and PLL Multiplier
Ultra Low Jitter and Phase Noise
−
0.4 ps (12 kHz
−
20 MHz)
Selectable Output Frequency
−
125 MHz (default) / 250 MHz
Hermetically Sealed Ceramic SMD Package
RoHS Compliant
Operating Range 3.3 V
±10%
Total Frequency Stability
−
$50
PPM
This is a Pb−Free Device
NBXSBA019
250
AAWLYYWWG
NBXHBA019
125
AAWLYYWWG
Applications
125/250
AA
WL
YY
WW
G
= Output Frequency (MHz)
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
•
Ethernet, Gigabit Ethernet
•
Infiniband
•
Base Stations
V
DD
6
CLK CLK
5 4
ORDERING INFORMATION
Device
NBXDBA019LN1TAG
NBXSBA019LN1TAG
NBXHBA019LN1TAG*
Package
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
Shipping
†
1000/
Tape & Reel
1000/
Tape & Reel
1000/
Tape & Reel
100/
Tape & Reel
100/
Tape & Reel
100/
Tape & Reel
Crystal
PLL
Clock
Multiplier
NBXDBA019LNHTAG
NBXSBA019LNHTAG
1
OE
2
FSEL/NC*
3
GND
NBXHBA019LNHTAG*
Figure 1. Simplified Logic Diagram
*NBXSBA019 and NBXHBA019 only
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Please contact sales office for availability
©
Semiconductor Components Industries, LLC, 2009
October, 2009
−
Rev. 3
1
Publication Order Number:
NBXDBA019/D
NBXDBA019, NBXHBA019, NBXSBA019
OE
FSEL
GND
1
2
3
6
5
4
V
DD
CLK
CLK
OE
NC
GND
1
2
3
6
5
4
V
DD
CLK
CLK
NBXDBA019
NBXSBA019/NBXHBA019
Figure 2. Pin Connections
(Top View)
Table 1. PIN DESCRIPTION
Pin No.
1
2
3
4
5
6
Symbol
OE
I/O
LVTTL/LVCMOS
Control Input
LVTTL/LVCMOS
Control Input
Power Supply
Description
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á ÁÁÁ ÁÁÁÁ
Á
Á Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á ÁÁÁ ÁÁÁÁ
Á
Á Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á ÁÁÁ ÁÁÁÁ
Á
Á Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á ÁÁÁ ÁÁÁÁ
Á
Á Á
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Á
Á Á
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Á
Á Á
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Á Á Á Á Á ÁÁÁ ÁÁÁÁ
Á Á
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Á
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Á
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Á
Á Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Á
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Á
Á Á
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Á Á Á Á Á ÁÁÁ ÁÁÁÁ
Á Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Á Á Á Á ÁÁÁ ÁÁÁÁ
Á
Á Á
FSEL/
NC*
GND
CLK
CLK
V
DD
Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output
Frequency Select pin description Table 3.
Ground 0 V
LVPECL Output
LVPECL Output
Power Supply
Non−Inverted Clock Output. Typically loaded with 50
W
receiver termination resistor to
V
TT
= V
DD
−
2 V.
Inverted Clock Output. Typically loaded with 50
W
receiver termination resistor to
V
TT
= V
DD
−
2 V.
Positive power supply voltage. Voltage should not exceed 3.3 V
±10%.
*NBXSBA019 and NBXHBA019 only.
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
OE Pin
Open
HIGH Level
LOW Level
Output Pins
Active
Active
High Z
Table 3. OUTPUT FREQUENCY SELECT
FSEL Pin
Open
(pin will float high)
HIGH Level
LOW Level
Output Frequency (MHz)
125
125
250
Table 4. ATTRIBUTES
Characteristic
Input Default State Resistor
ESD Protection
Human Body Model
Machine Model
Value
170 kW
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
V
DD
I
out
T
A
T
stg
T
sol
Parameter
Positive Power Supply
LVPECL Output Current
Operating Temperature Range
Storage Temperature Range
Wave Solder
See Figure 6
Condition 1
GND = 0 V
Continuous
Surge
Condition 2
Rating
4.6
25
50
−40
to +85
−55
to +120
260
Units
V
mA
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
NBXDBA019, NBXHBA019, NBXSBA019
Table 6. DC CHARACTERISTICS
(V
DD
= 3.3 V
±
10%, GND = 0 V, T
A
=
−40°C
to +85°C) (Note 2)
Symbol
I
DD
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
V
OUTPP
Characteristic
Power Supply Current
OE and FSEL Input HIGH Voltage
OE and FSEL Input LOW Voltage
Input HIGH Current
Input LOW Current
Output HIGH Voltage
V
DD
= 3.3 V
Output LOW Voltage
V
DD
= 3.3 V
Output Voltage Amplitude
OE
FSEL
OE
FSEL
2000
GND
−
300
−100
−100
−100
−100
V
DD
−1195
2105
V
DD
−1945
1355
660
Conditions
Min.
Typ.
78
Max.
100
V
DD
800
+100
+100
+100
+100
V
DD
−945
2355
V
DD
−1600
1700
Units
mA
mV
mV
mA
mA
mV
mV
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 50 ohm to V
DD
−2
V. See Figure 5.
Table 7. AC CHARACTERISTICS
(V
DD
= 3.3 V
±
10%, GND = 0 V, T
A
=
−40°C
to +85°C) (Note 3)
Symbol
f
CLKOUT
Df
F
NOISE
Characteristic
Output Clock Frequency
Frequency Stability
−
NBXDBA019/NBXSBA019/NBXHBA019
Phase−Noise Performance
f
CLKout
= 125 MHz/250 MHz
(See Figures 3 and 4)
Conditions
FSEL = HIGH
FSEL = LOW
(Note 4)
100 Hz of Carrier
1 kHz of Carrier
10 kHz of Carrier
100 kHz of Carrier
1 MHz of Carrier
10 MHz of Carrier
t
jit
(F)
t
jitter
RMS Phase Jitter
Cycle to Cycle, RMS
Cycle to Cycle, Peak−to−Peak
Period, RMS
Period, Peak−to−Peak
t
OE/OD
t
DUTY_CYCLE
t
R
t
F
t
start
Output Enable/Disable Time
Output Clock Duty Cycle
(Measured at Cross Point)
Output Rise Time (20% and 80%)
Output Fall Time (80% and 20%)
Start−up Time
Aging
1
st
Year
Every Year After 1
st
48
50
250
250
1
12 kHz to 20 MHz
1000 Cycles
1000 Cycles
10,000 Cycles
10,000 Cycles
−112/−105
−123/−116
−131/−124
−131/−124
−139/−133
−161/−158
0.4
1
7
0.6
5
0.9
8
30
4
20
200
52
400
400
5
3
1
Min.
Typ.
125
250
±50
ppm
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
ps
ps
ps
ps
ps
ns
%
ps
ps
ms
ppm
ppm
Max.
Units
MHz
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Measurement taken with outputs terminated with 50 ohm to V
DD
−2
V. See Figure 5.
4. Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration, and first year aging.
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NBXDBA019, NBXHBA019, NBXSBA019
Figure 3. Typical Phase Noise Plot at 125 MHz
Figure 4. Typical Phase Noise Plot at 250 MHz
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NBXDBA019, NBXHBA019, NBXSBA019
Table 8. RELIABILITY COMPLIANCE
Parameter
Shock
Mechanical
Mechanical
Mechanical
Mechanical
Solderability
Vibration
Standard
Method
MIL−STD−833, Method 2002, Condition B
MIL−STD−833, Method 2003
MIL−STD−202, Method 215
MIL−STD−833, Method 2007, Condition A
MIL−STD−833, Method 1011, Condition A
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Á
Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Á
Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Á
Á
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Á
Á
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Á
Á
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Á
Á
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Á
Á
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Á
Á
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Á
Á
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ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Á
Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Á
Á
Solvent Resistance
Thermal Shock
Environment
Environment
Moisture Level Sensitivity
MSL1 260°C per IPC/JEDEC J−STD−020D
NBXxxxxxx
CLK
Driver
Device
CLK
Z
o
= 50
W
50
W
50
W
D
Z
o
= 50
W
D
Receiver
Device
V
TT
V
TT
= V
DD
−
2.0 V
Figure 5. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D
−
Termination of ECL Logic Devices.)
Temperature (°C)
260
217
temp. 260°C
20
−
40 sec. max.
peak
3°C/sec. max.
ramp−up
6°C/sec. max.
cooling
175
150
pre−heat
reflow
60180 sec.
60150 sec.
Time
Figure 6. Recommended Reflow Soldering Profile
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