Analog to Digital Converters - ADC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5.25 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 18 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0244% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | SERIAL, PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.076 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 5.72 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 15.24 mm |
| MAX190BMRG | MAX190AMRG | MAX6841EUKD2-T | MAX6841EUKD4-T | MAX6841EUKD1+T | MAX190BENG-T | MAX190ACNG-T | MAX190BCNG-T | MAX190AENG-T | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | DIP | SOIC | SOIC | - | DIP | DIP | DIP | DIP |
| 包装说明 | CERDIP-24 | CERDIP-24 | MO-178, SOT-23, 5 PIN | MO-178, SOT-23, 5 PIN | - | DIP, | DIP, | DIP, | DIP, |
| 针数 | 24 | 24 | 5 | 5 | - | 24 | 24 | 24 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | - | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5.25 V | 5.25 V | - | - | - | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最长转换时间 | 18 µs | 18 µs | - | - | - | 18 µs | 18 µs | 18 µs | 18 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | - | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | R-PDSO-G5 | R-PDSO-G5 | - | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.0244% | 0.0244% | - | - | - | 0.0244% | 0.0244% | 0.0244% | 0.0244% |
| 模拟输入通道数量 | 1 | 1 | - | - | - | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | - | - | - | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 5 | 5 | - | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | - | 85 °C | 70 °C | 70 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -40 °C | - | -40 °C | - | - | -40 °C |
| 输出位码 | BINARY | BINARY | - | - | - | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | - | - | - | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS | SERIAL, PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | LSSOP | LSSOP | - | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | 240 | 245 | 245 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.076 MHz | 0.076 MHz | - | - | - | 0.076 MHz | 0.076 MHz | 0.076 MHz | 0.076 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | - | - | - | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 5.72 mm | 5.72 mm | 1.45 mm | 1.45 mm | - | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
| 标称供电电压 | 5 V | 5 V | - | - | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | - | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | BICMOS | BICMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 0.95 mm | 0.95 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 1.625 mm | 1.625 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 长度 | - | - | 2.9 mm | 2.9 mm | - | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm |
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