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SMBT3906DW1T1G

产品描述Bipolar Transistors - BJT SS GP XSTR PNP 40V
产品类别分立半导体    晶体管   
文件大小125KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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SMBT3906DW1T1G概述

Bipolar Transistors - BJT SS GP XSTR PNP 40V

SMBT3906DW1T1G规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
厂商名称ON Semiconductor(安森美)
针数6
制造商包装代码419B-02
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time8 weeks
Samacsys DescriptionDual General PurposeTransistor
最大集电极电流 (IC)0.2 A
最小直流电流增益 (hFE)100
JESD-609代码e3
湿度敏感等级1
最高工作温度150 °C
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型PNP
最大功率耗散 (Abs)0.15 W
表面贴装YES
端子面层Tin (Sn)
处于峰值回流温度下的最长时间NOT SPECIFIED
标称过渡频率 (fT)250 MHz

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MBT3906DW1,
SMBT3906DW1
Dual General Purpose
Transistor
The MBT3906DW1 device is a spin−off of our popular
SOT−23/SOT−323 three−leaded device. It is designed for general
purpose amplifier applications and is housed in the SOT−363
six−leaded surface mount package. By putting two discrete devices in
one package, this device is ideal for low−power surface mount
applications where board space is at a premium.
Features
http://onsemi.com
h
FE
, 100−300
Low V
CE(sat)
,
0.4 V
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
Collector
−Base
Voltage
Emitter
−Base
Voltage
Collector Current
Continuous
Electrostatic Discharge
Symbol
V
CEO
V
CBO
V
EBO
I
C
ESD
Value
−40
−40
−5.0
−200
Unit
Vdc
Vdc
Vdc
mAdc
SOT−363/SC−88
CASE 419B
STYLE 1
(3)
(2)
(1)
Q
1
Q
2
(4)
(5)
(6)
MARKING DIAGRAM
6
A2 M
G
G
1
A2 = Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
HBM Class 2
MM Class B
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device
MBT3906DW1T1G
Package
SOT−363
(Pb−Free)
SOT−363
(Pb−Free)
SOT−363
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
3,000 /
Tape & Reel
THERMAL CHARACTERISTICS
Characteristic
Total Package Dissipation (Note 1)
T
A
= 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage
Temperature Range
Symbol
P
D
R
qJA
T
J
, T
stg
Max
150
833
−55
to +150
Unit
mW
°C/W
°C
MBT3906DW1T2G
SMBT3906DW1T1G
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
July, 2013
Rev. 5
1
Publication Order Number:
MBT3906DW1T1/D

 
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