HSMS-2700, 2702, 270B, 270C, 270P
High Performance Schottky Diode
for Transient Suppression
Data Sheet
Description
The HSMS-2700 series of Schottky diodes, commonly
referred to as clipping /clamping diodes, are optimal for
circuit and waveshape preservation applications with
high speed switching. Ultra-low series resistance, R
S
,
makes them ideal for protecting sensitive circuit elements
against higher current transients carried on data lines.
With picosecond switching, the HSMS-270x can respond
to noise spikes with rise times as fast as 1 ns. Low ca-
pacitance minimizes waveshape loss that causes signal
degradation.
Features
•
Ultra-low Series Resistance for Higher Current
Handling
•
Picosecond Switching
•
Low Capacitance
•
Lead-free
Applications
RF and computer designs that require circuit protection,
high-speed switching, and voltage clamping.
HSMS-270x DC Electrical Specifications, T
A
= +25°C
[1]
Part
Number
HSMS-
-2700
-270B
-2702
-270C
-270P
J2
JP
Package
Marking
Code
[2]
J0
Lead
Code
0
B
2
C
P
Configuration
Single
Package
SOT-23
SOT-323
(3-lead SC-70)
SOT-23
Maximum
Forward
Voltage
V
F
(mV)
Minimum
Breakdown Typical
Voltage
Capacitance
V
BR
(V)
C
T
(pF)
Typical
Series
Resistance
R
S
(Ω)
Maximum
Eff. Carrier
Lifetime
τ
(ps)
550
[3]
15
[4]
6.7
[5]
0.65
100
[6]
Series
Bridge Quad
SOT-323
(3-lead SC-70)
SOT-363
(6-lead SC-70)
Notes:
1. T
A
= +25°C, where T
A
is defined to be the temperature at the package pins where contact is made to the circuit board.
2. Package marking code is laser marked.
3. I
F
= 100 mA; 100% tested
4. I
R
= 100
μA;
100% tested
5. V
F
= 0; f =1 MHz
6. Measured with Karkauer method at 20 mA; guaranteed by design.
Package Lead Code Identification (Top View)
SINGLE
3
SERIES
3
BRIDGE QUAD
6
5 4
1
0, B
2
1
2, C
2
1
2
3
Absolute Maximum Ratings, T
A
= 25ºC
Absolute Maximum
[1]
Symbol
I
F
I
F-peak
P
T
P
INV
T
J
T
STG
θ
JC
Parameter
DC Forward Current
Peak Surge Current (1μs pulse)
Total Power Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance, junction to lead
Unit
mA
A
mW
V
°C
°C
°C/W
HSMS-2700/-2702
350
1.0
250
15
150
-65 to 150
500
HSMS-270B/270C/270P
750
1.0
825
15
150
-65 to 150
150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
0.08 pF
SPICE Parameters
Parameter
BV
CJO
EG
Unit
V
pF
eV
A
A
Ω
V
Value
25
6.7
0.55
10E-4
1.4E-7
1.04
0.65
0.6
2
0.5
2 nH
R
S
IBV
IS
N
RS
PB
PT
M
SPICE model
2
Typical Performance
300
100
I
F
– FORWARD CURRENT (mA)
I
F
– FORWARD CURRENT (mA)
500
100
T
J
– JUNCTION TEMPERATURE ( C)
0.7
0.8
160
Max. safe junction temp.
140 T
A
= +75 C
T
A
= +25 C
120 T
A
= –25 C
100
80
60
40
20
0
0
50
100
150
200
250
300
350
I
F
– FORWARD CURRENT (mA)
10
10
1
1
0.1
0.01
0
0.1
0.2
0.3
T
A
= +75 C
T
A
= +25 C
T
A
= –25 C
0.4
0.5
0.6
V
F
– FORWARD VOLTAGE (V)
0.1
0.01
0
0.1
0.2
0.3
0.4
T
A
= +75 C
T
A
= +25 C
T
A
= –25 C
0.5
0.6
V
F
– FORWARD VOLTAGE (V)
Figure 1. Forward Current vs. Forward Voltage at
Temperature for HSMS-2700 and HSMS-2702.
Figure 2. Forward Current vs. Forward Voltage at
Temperature for HSMS-270B and HSMS-270C.
Figure 3. Junction Temperature vs. Forward Current
as a Function of Heat Sink Temperature for the
HSMS-2700 and HSMS-2702.
Note: Data is calculated from SPICE parameters.
160
Max. safe junction temp.
140 T
A
= +75 C
T
A
= +25 C
120 T = –25 C
A
100
80
60
40
20
0
0
150
300
450
600
750
I
F
– FORWARD CURRENT (mA)
7
6
C
T
– TOTAL CAPACITANCE (pF)
5
4
3
2
1
0
5
10
15
20
V
F
– REVERSE VOLTAGE (V)
T
J
– JUNCTION TEMPERATURE ( C)
Figure 4. Junction Temperature vs. Current as a
Function of Heat Sink Temperature for HSMS-270B
and HSMS-270C.
Note: Data is calculated from SPICE parameters.
Figure 5. Total Capacitance vs. Reverse Voltage.
3
Package Dimensions
Outline SOT-23
e2
Device Orientation
For Outlines SOT-23/323
REEL
e1
CARRIER
TAPE
E
XXX
e
E1
USER
FEED
DIRECTION
L
COVER
TAPE
B
C
TOP
VIEW
4 mm
END VIE W
D
DIMENSIONS (mm)
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
A
8 mm
ABC
ABC
ABC
ABC
A1
Notes:
XXX-package marking
Drawings are not to scale
Note:
"AB"
represents package marking code.
"C"
represents date code.
Tape Dimensions and Product Orientation
For Outline SOT-23
P
D
Recommended PCB Pad Layout
For Avago’s SOT-23 Products
P
2
E
P
0
0.039
1
0.039
1
F
W
0.079
2.0
0.035
0.9
t1
D
1
9° MAX
Ko
8° MAX
13.5° MAX
0.031
0.8
Dimensions in
inches
mm
A
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
8.00 +0.30 –0.10
0.229
±
0.013
3.50
±
0.05
2.00
±
0.05
B
0
SIZE (INCHES)
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315 +0.012 –0.004
0.009
±
0.0005
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
4
Package Dimensions
Outline SOT-323 (SC-70 3 Lead)
e1
Recommended PCB Pad Layout
For Avago’s SC70 3L/SOT-323 Products
0.026
E
XXX
e
E1
0.079
L
B
D
SYMBOL
A
A1
B
C
D
E1
e
e1
E
L
0.039
0.022
Dimensions in inches
C
DIMENSIONS (mm)
MIN.
MAX.
0.80
1.00
0.00
0.10
0.15
0.40
0.08
0.25
1.80
2.25
1.10
1.40
0.65 typical
1.30 typical
1.80
2.40
0.26
0.46
A
A1
Notes:
XXX-package marking
Drawings are not to scale
Outline SOT-363 (SC-70 6 Lead)
DIMENSIONS (mm)
HE
E
e
D
SYMBOL
E
D
HE
A
A2
A1
e
b
c
L
MIN.
MAX.
1.15
1.35
1.80
2.25
1.80
2.40
0.80
1.10
0.80
1.00
0.00
0.10
0.650 BCS
0.15
0.30
0.08
0.25
0.10
0.46
A1
A2
A
c
b
L
5
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