电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

5962-8764001WA

产品描述Latches PPCN# 1500013 - Transfer to Micross
产品类别模拟混合信号IC    驱动程序和接口   
文件大小533KB,共12页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
下载文档 详细参数 选型对比 全文预览

5962-8764001WA在线购买

供应商 器件名称 价格 最低购买 库存  
5962-8764001WA - - 点击查看 点击购买

5962-8764001WA概述

Latches PPCN# 1500013 - Transfer to Micross

5962-8764001WA规格参数

参数名称属性值
厂商名称Microchip(微芯科技)
包装说明DIP,
Reach Compliance Codecompliant
ECCN代码EAR99
内置保护TRANSIENT
接口集成电路类型LATCH BASED PERIPHERAL DRIVER
JESD-30 代码R-GDIP-T22
JESD-609代码e0
长度27.178 mm
功能数量8
端子数量22
最高工作温度125 °C
最低工作温度-55 °C
输出电流流向SINK
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度5.08 mm
标称供电电压5 V
表面贴装NO
技术BICMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度10.16 mm
Base Number Matches1

文档预览

下载PDF文档
MIC5800/5801
4/8-Bit Parallel-Input Latched Drivers
General Description
The MIC5800/5801 latched drivers are high-voltage, high-
current integrated circuits comprised of four or eight
CMOS data latches, a bipolar Darlington transistor driver
for each latch, and CMOS control circuitry for the common
CLEAR, STROBE, and OUTPUT ENABLE functions.
The bipolar/MOS combination provides an extremely low-
power latch with maximum interface flexibility. MIC5800
contains four latched drivers; MIC5801 contains eight
latched drivers.
Data input rates are greatly improved in these devices.
With a 5V supply, they will typically operate at better than
5MHz. With a 12V supply, significantly higher speeds are
obtained. The CMOS inputs are compatible with standard
CMOS, PMOS, and NMOS circuits. TTL or DTL circuits
may require the use of appropriate pull-up resistors. The
bipolar outputs are suitable for use with relays, solenoids,
stepping motors, LED or incandescent displays, and other
high-power loads. Both units have open-collector outputs
and integral diodes for inductive load transient
suppression. The output transistors are capable of sinking
500mA and will sustain at least 50V in the OFF state.
Because of limitations on package power dissipation, the
simultaneous operation of all drivers at maximum rated
current can only be accomplished by a reduction in duty
cycle. Outputs may be paralleled for higher load current
capability.
Datasheets and support documentation are available on
Micrel’s web site at:
www.micrel.com.
Features
4.4MHz Minimum Data Input Rate
High-Voltage, Current Sink Outputs
Output Transient Protection
CMOS, PMOS, NMOS, and TTL Compatible Inputs
Internal Pull-Down Resistors
Low-Power CMOS Latches
Functional Diagram
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 •
http://www.micrel.com
June 29, 2015
Revision 2.0

5962-8764001WA相似产品对比

5962-8764001WA MIC5801YV-TR MIC5800YM-TR MIC5801BWM
描述 Latches PPCN# 1500013 - Transfer to Micross Latches Crystals 32.768 KHz 12.5pF Latches Obsolete; Replace with MIC5801YWM (RoHS)
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
包装说明 DIP, QCCJ, LDCC28,.5SQ SOIC-14 SOP,
Reach Compliance Code compliant compliant compliant compliant
内置保护 TRANSIENT TRANSIENT TRANSIENT TRANSIENT
接口集成电路类型 LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER
JESD-30 代码 R-GDIP-T22 S-PQCC-J28 R-PDSO-G14 R-PDSO-G24
长度 27.178 mm 11.48 mm 8.65 mm 15.4 mm
功能数量 8 8 4 8
端子数量 22 28 14 24
最高工作温度 125 °C 85 °C 85 °C 85 °C
最低工作温度 -55 °C -40 °C -40 °C -40 °C
输出电流流向 SINK SINK SINK SINK
封装主体材料 CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP QCCJ SOP SOP
封装形状 RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 IN-LINE CHIP CARRIER SMALL OUTLINE SMALL OUTLINE
座面最大高度 5.08 mm 4.57 mm 1.75 mm 2.65 mm
标称供电电压 5 V 5 V 5 V 5 V
表面贴装 NO YES YES YES
技术 BICMOS BIMOS BIMOS BIMOS
温度等级 MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 THROUGH-HOLE J BEND GULL WING GULL WING
端子节距 2.54 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL QUAD DUAL DUAL
宽度 10.16 mm 11.48 mm 3.9 mm 7.5 mm
ECCN代码 EAR99 - EAR99 EAR99
JESD-609代码 e0 e3 e3 -
端子面层 TIN LEAD Matte Tin (Sn) Matte Tin (Sn) - annealed -
寻找硬件开发人员进行项目外包
由于有一个项目涉及到硬件开发的东西,现寻找武汉市(最好在武昌这边)有丰富的硬件开发经验的人进行项目合作,具体要求如下: 1、熟悉ARM7及单片机开发; 2、有设计PCB板的能力,最后设计过A ......
yuhaishan 嵌入式系统
am335x用sd卡烧录时,烧录不成功,以下是打印信息,请问应该如何操作
U-Boot 2014.04-00014-g47880f5 (Apr 22 2014 - 13:23:54) I2C: ready DRAM: 512 MiB NAND: 0 MiB MMC: OMAP SD/MMC: 0, OMAP SD/MMC: 1 *** Warning - readenv() failed, using default ......
kevinyang DSP 与 ARM 处理器
gsm modem拔通电话后如何继续拔号?
比如:我拔通10000号,使用 ATD10000; 拔通后,不知道如何继续拔"1"键,继续使用ATD1;没有作用。请大家赐教! ...
gjenny 嵌入式系统
EEWORLD大学堂----半导体元件物理 施敏 台湾交通大学
半导体元件物理 施敏 台湾交通大学:https://training.eeworld.com.cn/course/5729 本课程的内容由浅而深循序渐进,从基础的物理和电容器结构的基本运作,接续讨论MOSFET及NVSM之结构与操作, ......
抛砖引玉 模拟电子
USB IssueBulkTransfer异步模式的理解
一、该函数中的第二个参数在MS自带的Print驱动中设为DefaultTransferComplete,也就是SetEvent,但是之后没有见WaitForSingleObject; 二、.\WINCE500\PUBLIC\COMMON\OAK\DRIVERS\USB\USBD\usb ......
pkvpk 嵌入式系统
makefile的问题,请大侠帮忙指点一下,多谢
makefile文件有这样一句,我想事先看看APP_PRJ是什么内容,应该怎么做,多谢 APP_LIB = $(APP_PRJ)/lib...
uranus0903 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1395  2300  1334  2001  2277  38  17  19  54  1 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved