Bipolar Transistors - BJT Small-Signal BJT
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | SMALL OUTLINE, R-CDSO-N3 |
| 针数 | 3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大集电极电流 (IC) | 0.05 A |
| 集电极-发射极最大电压 | 60 V |
| 配置 | SINGLE |
| 最小直流电流增益 (hFE) | 225 |
| JESD-30 代码 | R-CDSO-N3 |
| JESD-609代码 | e0 |
| 元件数量 | 1 |
| 端子数量 | 3 |
| 最高工作温度 | 200 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 极性/信道类型 | NPN |
| 最大功率耗散 (Abs) | 0.36 W |
| 认证状态 | Qualified |
| 参考标准 | MIL-19500/376 |
| 表面贴装 | YES |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 晶体管元件材料 | SILICON |
| Base Number Matches | 1 |

| Jantxv2N2484UB | JANTXV2N2484UA | 2N2484UB | Jantx2N2484 | JAN2N2484UA | |
|---|---|---|---|---|---|
| 描述 | Bipolar Transistors - BJT Small-Signal BJT | Bipolar Transistors - BJT Small-Signal BJT | Small Signal Bipolar Transistor, 0.05A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, CERSOT-3 | Small Signal Bipolar Transistor, 0.05A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, TO-206AA, TO-18, 3 PIN | Bipolar Transistors - BJT Small-Signal BJT |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SMALL OUTLINE, R-CDSO-N3 | SMALL OUTLINE, R-XDSO-N4 | HERMETIC SEALED, CERAMIC, CERSOT-3 | TO-18, 3 PIN | SMALL OUTLINE, R-XDSO-N4 |
| 针数 | 3 | 4 | 3 | 3 | 4 |
| Reach Compliance Code | compliant | compliant | unknown | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大集电极电流 (IC) | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A |
| 集电极-发射极最大电压 | 60 V | 60 V | 60 V | 60 V | 60 V |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 最小直流电流增益 (hFE) | 225 | 225 | 225 | 225 | 225 |
| JESD-30 代码 | R-CDSO-N3 | R-XDSO-N4 | R-XDSO-N3 | O-MBCY-W3 | R-XDSO-N4 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 3 | 4 | 3 | 3 | 4 |
| 最高工作温度 | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | METAL | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CYLINDRICAL | SMALL OUTLINE |
| 极性/信道类型 | NPN | NPN | NPN | NPN | NPN |
| 认证状态 | Qualified | Qualified | Not Qualified | Not Qualified | Qualified |
| 表面贴装 | YES | YES | YES | NO | YES |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | WIRE | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | BOTTOM | DUAL |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 最大功率耗散 (Abs) | 0.36 W | 0.36 W | 0.36 W | - | 0.36 W |
| 参考标准 | MIL-19500/376 | MIL-19500/376 | - | MIL-19500/376 | MIL-19500/376 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | - | - | 1 |
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