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MAX1259EPE

产品描述Battery Management Battery Manager
产品类别电源/电源管理    电源电路   
文件大小951KB,共8页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX1259EPE概述

Battery Management Battery Manager

MAX1259EPE规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码DIP
包装说明DIP, DIP16,.3
针数16
Reach Compliance Codenot_compliant
ECCN代码EAR99
可调阈值NO
模拟集成电路 - 其他类型POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码R-PDIP-T16
JESD-609代码e0
长度19.175 mm
湿度敏感等级1
信道数量1
功能数量1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP16,.3
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)240
认证状态Not Qualified
座面最大高度4.572 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间20
宽度7.62 mm

文档预览

下载PDF文档
MAX1259
General Description
Features
Battery Manager
The MAX1259 battery manager provides backup-battery
switching for CMOS RAM, microprocessors, or other low-
power logic ICs. It automatically switches to the backup
battery when the primary power supply is interrupted.
Low-loss switches guarantee an input-to-output differ-
ential of only 200mV while supplying 250mA from the
primary power supply or 15mA from the battery.
Battery discharge during shipping does not occur in the
MAX1259, since the backup battery can be disconnected
by strobing the RST input.
A battery-fail output signal indicates when the backup bat-
tery is below +2V, and a power-fail output signal indicates
when the primary power supply is low. The MAX1259
monitors the backup battery, warns of impending power
failures, and switches the memory to the battery when
failures occur. The MAX1259 is pincompatible with the
DS1259, but consumes three times less supply current.
Commercial, extended, and military temperature range
devices are available.
Switches to Backup Battery if Power Fails
Consumes Less than 100nA of Battery Current
Power-Fail Output Signals Primary Power-Supply
Loss
Battery Monitor Indicates Low Battery
Battery Can Be Disconnected to Prevent Discharge
During Shipping
Battery Automatically Reconnected when V
CC
is
Applied
Pin-Compatible with the DS1259
Supply Current Three Times Lower than DS1259
Available in Extended-Industrial and Military
Temperature Ranges
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX1259C/D
0°C to +70°C
Dice*
MAX1259CPE
0°C to +70°C
16 PDIP
MAX1259CWE
0°C to +70°C
16 Wide SO
MAX1259EPE
-40°C to +85°C
16 PDIP
MAX1259EWE
-40°C to +85°C
16 Wide SO
MAX1259MJE
-55°C to +125°C
16 CERDIP
*Contact factory for dice specifications.
Note:
Devices in PDIP and SO packages are available in both
leadedPb) and lead(Pb)-free packaging. Specify lead-free by
adding the “+” symbol at the end of the part number when
ordering. Lead-free not available for CERDIP package.
Applications
Battery Backup for CMOS RAM
Uninterruptible Power Supplies
Computers
Controllers
Functional Diagram
V
CCI
V
CCO
Pin Configuration
TOP VIEW
N.C.
1
16
V
CCI
V
CCI
N.C.
V
CCO
V
CCO
PF
V
BATT
V
BATT
2
15
RESET
LOGIC
MAX1259
RST
BF
3
14
N.C.
4
13
PF
BAT
5
12
RST
6
11
BF
GND
7
10
N.C.
REF
MAX1259
GND
8
9
N.C.
BAT
GND
DIP/SO
19-4638; Rev 3; 9/14

MAX1259EPE相似产品对比

MAX1259EPE MAX1259CWE- MAX1259CWE MAX1259C-D- MAX1259CWE-T MAX1259MJE
描述 Battery Management Battery Manager Battery Management BATTERY MANAGER Battery Management Battery Management Battery Backup Switchover Battery Manager Battery Management Battery Backup Switchover Battery Manager
是否无铅 含铅 - 含铅 - 含铅 含铅
是否Rohs认证 不符合 - 不符合 - 不符合 不符合
零件包装代码 DIP - SOIC - SOIC DIP
包装说明 DIP, DIP16,.3 - SOP, SOP16,.4 - SOP, SOP16,.4 DIP, DIP16,.3
针数 16 - 16 - 16 16
Reach Compliance Code not_compliant - not_compliant - not_compliant not_compliant
ECCN代码 EAR99 - EAR99 - EAR99 EAR99
可调阈值 NO - NO - NO NO
模拟集成电路 - 其他类型 POWER SUPPLY MANAGEMENT CIRCUIT - POWER SUPPLY MANAGEMENT CIRCUIT - POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码 R-PDIP-T16 - R-PDSO-G16 - R-PDSO-G16 R-GDIP-T16
JESD-609代码 e0 - e0 - e0 e0
湿度敏感等级 1 - 1 - 1 1
信道数量 1 - 1 - 1 1
功能数量 1 - 1 - 1 1
端子数量 16 - 16 - 16 16
最高工作温度 85 °C - 70 °C - 70 °C 125 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY CERAMIC, GLASS-SEALED
封装代码 DIP - SOP - SOP DIP
封装等效代码 DIP16,.3 - SOP16,.4 - SOP16,.4 DIP16,.3
封装形状 RECTANGULAR - RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 IN-LINE - SMALL OUTLINE - SMALL OUTLINE IN-LINE
峰值回流温度(摄氏度) 240 - 240 - 245 240
认证状态 Not Qualified - Not Qualified - Not Qualified Not Qualified
座面最大高度 4.572 mm - 2.65 mm - 2.65 mm 5.842 mm
最大供电电压 (Vsup) 5.5 V - 5.5 V - 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V - 4.5 V - 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V - 5 V - 5 V 5 V
表面贴装 NO - YES - YES NO
技术 CMOS - CMOS - CMOS CMOS
温度等级 INDUSTRIAL - COMMERCIAL - COMMERCIAL MILITARY
端子面层 Tin/Lead (Sn85Pb15) - Tin/Lead (Sn85Pb15) - Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 THROUGH-HOLE - GULL WING - GULL WING THROUGH-HOLE
端子节距 2.54 mm - 1.27 mm - 1.27 mm 2.54 mm
端子位置 DUAL - DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 20 - 20 - NOT SPECIFIED 20
宽度 7.62 mm - 7.5 mm - 7.5 mm 7.62 mm
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