DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
μ
PC8187TB
SILICON MMIC HI-IP
3
FREQUENCY UP-CONVERTER
FOR WIRELESS TRANSCEIVER
DESCRIPTION
The
μ
PC8187TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless
transceiver. This IC is higher operating frequency, lower distortion and higher conversion gain than conventional
μ
PC8163TB.
This IC is manufactured using NEC’s 30 GHz f
max
UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
• High output frequency
• Supply voltage
• Higher IP
3
: f
RFout
= 0.8 to 2.5 GHz
: V
CC
= 2.7 to 3.3 V
: OIP
3
= +10 dBm @ f
RFout
= 1.9 GHz
• High-density surface mounting : 6-pin super minimold package
APPLICATION
• TDMA, PCS, CDMA etc.
ORDERING INFORMATION
Part Number
Package
6-pin super minimold
Marking
C3G
Supplying Form
•
Embossed tape 8 mm wide.
•
Pin 1, 2, 3 face the tape perforation side.
•
Qty 3 kpcs/reel.
μ
PC8187TB-E3-A
Remark
To order evaluation samples, please contact your local sales office.
(Part number for sample order:
μ
PC8187TB-A)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Document No. P15106EJ2V0DS00 (2nd edition)
Date Published January 2001 N CP(K)
The mark
shows major revised points.
μ
PC8187TB
CONTENTS
1.
2.
3.
4.
PIN CONNECTIONS.............................................................................................................................3
SERIES PRODUCTS............................................................................................................................3
BLOCK DIAGRAM ...............................................................................................................................3
SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE
SYSTEM) ...............................................................................................................................................4
PIN EXPLANATION..............................................................................................................................5
ABSOLUTE MAXIMUM RATINGS......................................................................................................6
RECOMMENDED OPERATING RANGE............................................................................................6
ELECTRICAL CHARACTERISTICS ....................................................................................................6
OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY .........................................7
5.
6.
7.
8.
9.
10. TEST CIRCUITS...................................................................................................................................8
10.1 TEST CIRCUIT 1 (f
RFout
= 0.83 GHz) .........................................................................................................8
10.2 TEST CIRCUIT 2 (f
RFout
= 1.9 GHz) ...........................................................................................................9
10.3 TEST CIRCUIT 3 (f
RFout
= 2.4 GHz) .........................................................................................................10
11. TYPICAL CHARACTERISTICS..........................................................................................................12
11.1 f
RFout
= 0.83 GHz ........................................................................................................................................13
11.2 f
RFout
= 1.9 GHz ..........................................................................................................................................17
11.3 f
RFout
= 2.4 GHz ..........................................................................................................................................21
12. S-PARAMETERS FOR EACH PORT...............................................................................................25
13. S-PARAMETERS FOR MATCHED RF OUTPUT ...........................................................................26
14. PACKAGE DIMENSIONS...................................................................................................................28
15. NOTE ON CORRECT USE ..............................................................................................................29
16. RECOMMENDED SOLDERING CONDITIONS................................................................................29
2
Data Sheet P15106EJ2V0DS
μ
PC8187TB
1. PIN CONNECTIONS
(Top View)
3
2
1
(Bottom View)
4
5
6
4
5
6
3
2
1
Pin No.
1
2
3
4
5
6
Pin Name
IFinput
GND
LOinput
GND
V
CC
RFoutput
2. SERIES PRODUCTS (T
A
= +25°C, V
CC
= V
PS
= V
RFout
= 3.0 V, Z
S
= Z
L
= 50
Ω
)
I
CC
(mA)
15
9
9
5
16.5
f
RFout
(GHz)
0.8 to 2.5
0.4 to 2.0
0.8 to 2.5
0.4 to.2.0
0.8 to 2.0
CG (dB)
@RF 0.9 GHz
Note
11
9
9.5
6
9
@RF 1.9 GHz
11
7
8.5
4
5.5
@RF 2.4 GHz
10
−
8.0
−
−
Part Number
μ
PC8187TB
μ
PC8106TB
μ
PC8172TB
μ
PC8109TB
μ
PC8163TB
C3G
Part Number
P
O(sat)
(dBm)
@RF 0.9 GHz
Note
+4
−2
+0.5
−5.5
+0.5
@RF 1.9 GHz
+2.5
−4
0
−7.5
−2
@RF 2.4 GHz
+1
−
−0.5
−
−
@RF 0.9 GHz
Note
+10
+5.5
+7.5
+1.5
+9.5
OIP
3
(dBm)
@RF 1.9 GHz
+10
+2.0
+6.0
−1.0
+6.0
@RF 2.4 GHz
+8.5
−
+4.0
−
−
μ
PC8187TB
μ
PC8106TB
μ
PC8172TB
μ
PC8109TB
μ
PC8163TB
Note
f
RFout
= 0.83 GHz @
μ
PC8163TB and
μ
PC8187TB
Remark
Typical performance. Please refer to
8. ELECTRICAL CHARACTERISTICS
in detail.
To know the associated product, please refer to each latest data sheet.
3. BLOCK DIAGRAM
(Top View)
LOinput
GND
V
CC
RFoutput
GND
IFinput
Data Sheet P15106EJ2V0DS
3
μ
PC8187TB
4. SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM)
Low Noise Tr.
RX
DEMOD.
I
Q
SW
VCO
÷N
PLL
PLL
I
0˚
TX
PA
Phase
shifter
90˚
μ
PC8187TB
Q
4
Data Sheet P15106EJ2V0DS
μ
PC8187TB
5. PIN EXPLANATION
Pin
No.
1
Pin
Name
IFinput
Applied
Voltage
(V)
−
Pin
Voltage
(V)
Note
1.2
Function and Explanation
This pin is IF input to double bal-
anced mixer (DBM). The input is
designed as high impedance.
The circuit contributes to sup-
press spurious signal. Also this
symmetrical circuit can keep
specified performance insensitive
to process-condition distribution.
For above reason, double bal-
anced mixer is adopted.
GND pin. Ground pattern on the
board should be formed as wide
as possible. Track Length should
be kept as short as possible to
minimize ground impedance.
Local input pin. Recommendable
input level is
−10
to 0 dBm.
Supply voltage pin.
This pin is RF output from DBM.
This pin is designed as open
collector. Due to the high imped-
ance output, this pin should be
externally equipped with LC
matching circuit to next stage.
3
Equivalent Circuit
5
6
2
4
GND
GND
−
1
3
5
6
LOinput
V
CC
RFoutput
−
2.7 to 3.3
Same
bias as
V
CC
through
external
inductor
2.1
−
−
2
Note
Each pin voltage is measured at V
CC
= V
RFout
= 2.8 V.
Data Sheet P15106EJ2V0DS
5
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