DATASHEET
HCS154MS
Radiation Hardened 4 to 16 Line Decoder/Demultiplexer
The Intersil HCS154MS is a Radiation Hardened 4 to 16
line Decoder/Demultiplexer with two enable inputs. A
high on either enable input forces the output to a high
state. The Demultiplexing function is performed by
using the four input lines A0 to A3 to select the desired
output states.
The HCS154MS utilizes advanced CMOS/SOS
technology to achieve high-speed operation. This
device is a member of radiation hardened, high-speed,
CMOS/SOS Logic Family.
The HCS154MS is supplied in a 24 lead Ceramic
flatpack (K suffix) or a SBDIP Package (D suffix).
FN2479
Rev 3.00
January 6, 2011
Features
•
•
•
•
•
•
•
•
•
•
•
•
3 Micron Radiation Hardened SOS CMOS
Total Dose 200k RAD (Si)
SEP Effective LET No Upsets: >100 MEV-cm
2
/mg
Single Event Upset (SEU) Immunity < 2 x 10
-9
Errors/Bit-Day (Typ)
Dose Rate Survivability: >1 x 10
12
Rads (Si)/s
Dose Rate Upset >10
10
RAD(Si)/s 20ns Pulse
Cosmic Ray Upset Immunity < 2 x 10
-9
Errors/Gate
Day (Typ)
Latch-Up Free Under Any Conditions
Military Temperature Range: -55
o
C to +125
o
C
Significant Power Reduction Compared to LSTTL
ICs
DC Operating Voltage Range: 4.5V to 5.5V
Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
• Input Current Levels Ii
5µA at VOL, VOH
Pin Configurations
24 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T24
TOP VIEW
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
1
2
3
4
5
6
7
8
9
24 VCC
23 A0
22 A1
21 A2
20 A3
19 E2
18 E1
17 Y15
16 Y14
15 Y13
14 Y12
13 Y11
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
GND
24 LEAD CERAMIC METAL SEAL
FLATPACK PACKAGE (FLATPACK)
MIL-STD-1835 CDFP4-F24
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
A0
A1
A2
A3
E2
E1
Y15
Y14
Y13
Y12
Y11
Y9 10
Y10 11
GND 12
Ordering Information
ORDERING
NUMBER
INTERNAL
MKT. NUMBER
PART
MARKING
TEMP. RANGE
(°C)
SCREENING
LEVEL
PACKAGE
PKG.
DWG. #
D24.6
5962R9572901VJC HCS154DMSR
5962R9572901VXC HCS154KMSR
Q 5962R95 72901VJC -55
o
C to +125
o
C Intersil Class S 24 Ld SBDIP
Equivalent
Q 5962R95 72901VXC -55
o
C to +125
o
C Intersil Class S 24 Ld Ceramic Flatpack K24.A
Equivalent
FN2479 Rev 3.00
January 6, 2011
Page 1 of 8
HCS154MS
Functional Diagram
TABLE 1. TRUTH TABLE
INPUTS
E1
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
E2
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
H
A3
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
X
X
X
A2
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
X
X
X
A1
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
X
X
X
A0
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
X
X
X
Y0
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Y1
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Y2
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Y3
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Y4
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Y5
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
Y6
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
OUTPUTS
Y7
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
Y8
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
Y9
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
Y10 Y11 Y12 Y13 Y14 Y15
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
NOTE: H = High Level, L = Low Level, X = Immaterial
FN2479 Rev 3.00
January 6, 2011
Page 2 of 8
HCS154MS
Absolute Maximum Ratings
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
Input Voltage Range, All Inputs . . . . . . . -0.5V to VCC +0.5V
DC Input Current, Any One Input
10mA
DC Drain Current, Any One Output
25mA
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG) . . . . . . -65°C to +150°C
Lead Temperature (Soldering 10sec) . . . . . . . . . . . +265°C
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . +175°C
ESD Classification. . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Reliability Information
Thermal Resistance
JA
JC
SBDIP Package . . . . . . . . . . . . . . 63°C/W
23°C/W
Ceramic Flatpack Package . . . . . . . 87°C/W
23°C/W
Maximum Package Power Dissipation at +125
o
C Ambient
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . 0.79W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . 0.57W
If device power exceeds package dissipation capability,
provide heat sinking or derate linearly at the following rate:
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . 15.9mW/°C
Ceramic Flatpack Package . . . . . . . . . . . . . . . 11.5mW/°C
Operating Conditions
Supply Voltage . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at 4.5V VCC (TR, TF) . . . . . 100ns
MaxOperating Temperature Range (T
A
) . . . -55°C to +125°C
Input Low Voltage (VIL) . . . . . . . . . . . . 0.0V to 30% of VCC
Input High Voltage (VIH) . . . . . . . . . . . . 70% of VCC to VCC
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
DC Electrical Specifications
SYMBOL
ICC
PARAMETERS
Quiescent Current
CONDITIONS
(Note 1)
VCC = 5.5V,
VIN = VCC or GND
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V
GROUP A
SUBGROUPS
1
2, 3
1
2, 3
1
2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1
2, 3
7, 8A, 8B
LIMITS
TEMPERATURE
+25°C
+125°C, -55°C
+25°C
+125°C, -55°C
+25°C
+125°C, -55°C
+25°C, +125°C, -55°C
+25°C, +125°C, -55°C
MIN MAX UNITS
-
-
4.8
4.0
-4.8
-4.0
-
-
40
750
-
-
-
-
0.1
0.1
-
-
0.5
5.0
-
µA
µA
mA
mA
mA
mA
V
V
V
V
µA
µA
-
IOL
Output Current
(Sink)
Output Current
(Source)
IOH
VOL
Output Voltage Low VCC = 4.5V, VIH = 3.15V,
IOL = 50A, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOL = 50A, VIL = 1.65V
VOH
Output Voltage
High
VCC = 4.5V, VIH = 3.15V,
IOH = -50A, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOH = -50A, VIL = 1.65V
+25°C, +125°C, -55°C VCC
-0.1
+25°C, +125°C, -55°C VCC
-0.1
+25°C
+125°C, -55°C
+25°C, +125°C, -55°C
-
-
-
IIN
Input Leakage
Current
Noise Immunity
Functional Test
VCC = 5.5V, VIN = VCC or
GND
VCC = 4.5V,
VIH = 0.70(VCC), (Note 2)
VIL = 0.30(VCC)
FN
NOTES:
1. All voltages reference to device GND.
2. For functional tests, VO
4.0V is recognized as a logic “1”, and VO
0.5V is recognized as a logic “0”.
FN2479 Rev 3.00
January 6, 2011
Page 3 of 8
HCS154MS
AC Electrical Specifications
SYMBOL
TPLH
PARAMETER
Address to Output
CONDITIONS
(Notes 3, 4)
VCC = 4.5V
GROUP A
SUBGROUPS
9
10, 11
TPHL
VCC = 4.5V
9
10, 11
TPLH TPHL Enable to Output
VCC = 4.5V
9
10, 11
NOTES:
3. All voltages referenced to device GND.
4. AC measurements assume RL = 500, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC.
LIMITS
TEMPERATURE
+25°C
+125°C, -55°C
+25°C
+125°C, -55°C
+25°C
+125°C, -55°C
MIN
2
2
2
2
2
2
MAX
29
34
27
31
27
27
UNITS
ns
ns
ns
ns
ns
ns
Electrical Specifications
The following parameters are controlled via design or process parameters. Min and Max
Limits are guaranteed but not directly tested. These parameters are characterized upon
initial design release and upon design changes which affect these characteristics.
LIMITS
SYMBOL
CPD
PARAMETER
Capacitance Power
Dissipation
Input Capacitance
CONDITIONS
VCC = 5.0V, f = 1MHz
NOTES
1
1
TEMPERATURE
+25°C
+125°C, -55°C
+25°C
+125°C
+25°C
+125°C
MIN
-
-
-
-
-
-
MAX
66
74
10
10
15
22
UNITS
pF
pF
pF
pF
ns
ns
CIN
VCC = 5.0V, f = 1MHz
1
1
TTHL
TTLH
Output Transition
Time
VCC = 4.5V
1
1
DC Post Radiation Electrical Performance Characteristics
CONDITIONS
(Notes 5, 6)
VCC = 5.5V, VIN = VCC or GND
VCC = 4.5V, VIN = VCC or GND,
VOUT = 0.4V
VCC = 4.5V, VIN = VCC or GND,
VOUT = VCC -0.4V
VCC = 4.5V and 5.5V, VIH = 0.70(VCC),
VIL = 0.30(VCC), IOL = 50A
VCC = 4.5V or 5.5V, VIH = 0.70(VCC),
VIL = 0.30(VCC), IOH = -50A
VCC = 5.5V, VIN = VCC or GND
VCC = 4.5V, VIH = 0.70(VCC),
VIL = 0.30(VCC), (Note 7)
VCC = 4.5V
VCC = 4.5V
VCC = 4.5V
200k RAD
LIMITS
TEMPERATURE
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
MIN
-
4.0
-4.0
-
VCC
-0.1
-
-
2
2
2
MAX
0.75
-
-
0.1
-
5
-
34
31
27
UNITS
mA
mA
mA
V
V
µA
-
ns
ns
ns
SYMBOL
ICC
IOL
IOH
VOL
VOH
IIN
FN
TPLH
TPHL
PARAMETERS
Quiescent Current
Output Current (Sink)
Output Current
(Source)
Output Voltage Low
Output Voltage High
Input Leakage Current
Noise Immunity
Functional Test
Address to Output
TPLH TPHL Enable to Output
NOTES:
5. All voltages referenced to device GND.
6. AC measurements assume RL = 500, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC.
7. For functional tests, VO
4.0V is recognized as a logic “1”, and VO
0.5V is recognized as a logic “0”.
FN2479 Rev 3.00
January 6, 2011
Page 4 of 8
HCS154MS
TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25°C)
PARAMETER
ICC
IOL/IOH
GROUP B SUBGROUP
5
5
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
Initial Test (Preburn-In)
Interim Test
I
(Postburn-In)
Interim Test
II
(Postburn-In)
PDA
Interim Test
III
(Postburn-In)
PDA
Final Test
Group A (Note 8)
Group B
Subgroup B-5
Subgroup B-6
Group D
NOTE:
8. Alternate Group A testing in accordance with Method 5005 of MIL-STD-883 may be exercised.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
Group E Subgroup 2
TEST
METHOD
5005
PRE RAD
1, 7, 9
POST RAD
See “DC Post Radiation
Electrical Performance
Characteristics” table on page 4
PRE RAD
1, 9
READ AND RECORD
POST RAD
See “DC Post Radiation Electrical
Performance Characteristics” table
on page 4 (Note 9)
METHOD
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
Sample/5005
Sample/5005
Sample/5005
Sample/5005
GROUP A SUBGROUPS
1, 7, 9
1, 7, 9
1, 7, 9
1, 7, 9, Deltas
1, 7, 9
1, 7, 9, Deltas
2, 3, 8A, 8B, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11,
Deltas
1, 7, 9
1, 7, 9
Subgroups 1, 2, 3, 9, 10, 11
ICC, IOL/H
READ AND RECORD
ICC, IOL/H
ICC, IOL/H
ICC, IOL/H
DELTA LIMIT
12A
-15% of 0 Hour
NOTE:
9. Except FN test which will be performed 100% Go/No-Go.
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
OSCILLATOR
OPEN
GROUND
1/2 VCC = 3V
0.5V
VCC = 6V
0.5V
50kHz
25kHz
STATIC BURN-IN I TEST CONDITIONS (Note 10)
1 - 11, 13 - 17
12, 18 - 23
-
24
-
-
STATIC BURN-IN II TEST CONNECTIONS (Note 10)
1 - 11, 13 - 17
12
-
18 - 24
-
-
DYNAMIC BURN-IN I TEST CONNECTIONS (Note 11)
-
NOTES:
10. Each pin except VCC and GND will have a resistor of 10k
5% for static burn-in.
11. Each pin except VCC and GND will have a resistor of 1k
5% for dynamic burn-in.
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
1 - 11, 13 - 17
GROUND
12
VCC = 5V
0.5V
18 - 24
12, 18 - 21
1 - 11, 13 - 17
24
23
22
NOTE: Each pin except VCC and GND will have a resistor of 47k
5% for irradiation testing. Group E, Subgroup 2, sample size
is 4 dice/wafer 0 failures.
FN2479 Rev 3.00
January 6, 2011
Page 5 of 8
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