Operating Temperature Range ......................... -40°C to +105°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TQFN
Junction-to-Case Thermal Resistance (θ
JC
) .................1°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
)...........27°C/W
TQFP
Junction-to-Case Thermal Resistance (θ
JC
) .................2°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
)........27.6°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
ADC Electrical Specifications
(V
AVDD
= 4.75V to 5.25V, V
DVDD
= 3.3V, V
AVDDIO
= +12.0V, V
AGND
= V
DGND
= 0V, V
AVSSIO
= -2.0V, V
DACREF
= 2.5V, V
ADCREF
= 2.5V
(Internal), f
S
= 400ksps, 10V analog input range set to range 1 (0 to +10V). T
A
= -40ºC to +105ºC, unless otherwise noted. Typical values
are at T
A
= +25ºC.) (Note 2)
PARAMETER
DC ACCURACY (Note 3)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Offset Error Drift
Gain Error
Gain Error Drift
Channel-to-Channel Offset
Matching
Channel-to-Channel Gain
Matching
±0.01
1
2
INL
DNL
No missing codes over temperature
±0.5
±0.002
±11
12
±2.5
±1
±8
Bits
LSB
LSB
LSB
LSB/ºC
LSB
LSB/ºC
LSB
LSB
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
www.maximintegrated.com
Maxim Integrated
│
3
MAX11300
PIXI, 20-Port Programmable Mixed-Signal I/O with
12-Bit ADC, 12-Bit DAC, Analog Switches, and GPIO
Electrical Characteristics (continued)
ADC Electrical Specifications
(V
AVDD
= 4.75V to 5.25V, V
DVDD
= 3.3V, V
AVDDIO
= +12.0V, V
AGND
= V
DGND
= 0V, V
AVSSIO
= -2.0V, V
DACREF
= 2.5V, V
ADCREF
= 2.5V
(Internal), f
S
= 400ksps, 10V analog input range set to range 1 (0 to +10V). T
A
= -40ºC to +105ºC, unless otherwise noted. Typical values
are at T
A
= +25ºC.) (Note 2)
PARAMETER
Signal-to-Noise Plus Distortion
Signal to Noise
Total Harmonic Distortion
Spurious-Free Dynamic Range
Crosstalk
SYMBOL
SINAD
SNR
THD
SFDR
CONDITIONS
fS = 400ksps, fIN = 10kHz
fS = 400ksps, fIN = 10kHz
fS = 400ksps, fIN = 10kHz
fS = 400ksps, fIN = 10kHz
MIN
TYP
70
71
-75
75
-85
MAX
UNITS
dB
dB
dB
dB
dB
DYNAMIC PERFORMANCE (Single-Ended Inputs)
fS = 100ksps, fIN = 10kHz
DYNAMIC PERFORMANCE (Differential Inputs)
Signal-to-Noise Plus Distortion
Signal to Noise
Total Harmonic Distortion
Spurious-Free Dynamic Range
Crosstalk
CONVERSION RATE
ADCCONV[1:0] = 00
Throughput (Note 4)
ADCCONV[1:0] = 01
ADCCONV[1:0] = 10
ADCCONV[1:0] = 11
ADCCONV[1:0] = 00
Acquisition Time
t
ACQ
ADCCONV[1:0] = 01
ADCCONV[1:0] = 10
ADCCONV[1:0] = 11
ANALOG INPUT (All Ports)
Range 1
Absolute Input Voltage (Note 5)
V
PORT
Range 2
Range 3
Range 4
Input Resistance
Range 1, 2, 3
Range 4
0
-5
-10
0
70
50
SINAD
SNR
THD
SFDR
fS = 400ksps, fIN = 10kHz
fS = 400ksps, fIN = 10kHz
fS = 400ksps, fIN = 10kHz
fS = 400ksps, fIN = 10kHz
fS = 100ksps, fIN = 10kHz
71
72
-82
82
-85
200
250
333
400
3.5
2.5
1.5
1.0
10
+5
0
2.5
100
75
130
100
dB
dB
dB
dB
dB
ksps
μs
V
kΩ
kΩ
www.maximintegrated.com
Maxim Integrated
│
4
MAX11300
PIXI, 20-Port Programmable Mixed-Signal I/O with
12-Bit ADC, 12-Bit DAC, Analog Switches, and GPIO
REF Electrical Specifications
(V
AVDD
= 4.75V to 5.25V, V
DVDD
= 3.3V, V
AVDDIO
= +12.0V, V
AGND
= V
DGND
= 0V, V
AVSSIO
= -2.0V, V
DACREF
= 2.5V, V
ADCREF
= 2.5V
(Internal), f
S
= 400ksps, 10V analog input range set to range 1 (0 to +10V). T
A
= -40ºC to +105ºC, unless otherwise noted. Typical values
are at T
A
= +25ºC.) (Note 2)
PARAMETER
ADC INTERNAL REFERENCE
Reference Output Voltage
REF Output Tempco (Note 6)
Capacitor Bypass at ADC_INT_
REF
DAC INTERNAL REFERENCE
Reference Output Voltage
REF Output Tempco (Note 6)
Capacitor Bypass at DAC_REF
ADC EXTERNAL REFERENCE
Reference Input Range
DAC EXTERNAL REFERENCE
Reference Input Range
1.25
2.5
V
2
2.75
V
T
C-VREF
4.7
Internal references at T
A
= +25°C
2.494
2.5
±10
2.506
±25
10
V
ppm/°C
µF
T
C-VREF
4.7
Internal references at T
A
= +25°C
2.494
2.5
±10
2.506
±25
10
V
ppm/°C
µF
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GPIO Electrical Specifications
(V
AVDD
= 5.0V, V
DVDD
= 3.3V, V
AVDDIO
= +12.0V, V
AGND
= V
DGND
= 0V, V
AVSSIO
= -2.0V, V
DACREF
= 2.5V, V
ADCREF
= 2.5V (Internal),
f
S
= 400ksps, 10V analog input range set to range 1 (0 to +10V). T
A
= -40ºC to +105ºC, unless otherwise noted. Typical values are at T
A
= +25ºC.) (Note 2)
PARAMETER
Programmable Input Logic
Threshold
Input High Voltage
Input Low Voltage
Hysteresis
Programmable Output Logic Level
Propagation Delay from GPI Input
to GPO Output in Unidirectional
Level Translating Mode
Input High Voltage
Input Low Voltage
On-Resistance
V
IH
V
IL
From V
AVSSIO
+2.50V to V
AVDDIO
- 2.50V
V
OLVL
0
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GPIO EXCEPT IN BIDIRECTIONAL LEVEL TRANSLATION MODE
V
ITH
V
IH
V
IL
±30
V
DACREF
2
4x
0.3
V
ITH
+
0.3
V
ITH
- 0.3
V
DACREF
V
V
V
mV
V
Midscale threshold, 5V logic swing
µs
BIDIRECTIONAL LEVEL TRANSLATION PATH AND ANALOG SWITCH
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