FIFO 16K X 18, SYNCHRONOUS FIFO
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, BGA100,10X10,32 |
| 针数 | 100 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 6.5 ns |
| 其他特性 | CAN ALSO BE CONFIGURED AS 32768 X 9 |
| 备用内存宽度 | 9 |
| 最大时钟频率 (fCLK) | 100 MHz |
| 周期时间 | 10 ns |
| JESD-30 代码 | S-PBGA-B100 |
| 长度 | 10 mm |
| 内存密度 | 294912 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 18 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16KX18 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA100,10X10,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.4 mm |
| 最大待机电流 | 0.015 A |
| 最大压摆率 | 0.035 mA |
| 最大供电电压 (Vsup) | 3.45 V |
| 最小供电电压 (Vsup) | 3.15 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| Base Number Matches | 1 |
| SN74V273-10GGM | SN74V293-7GGM | SN74V283-7GGM | SN74V283-10GGM | SN74V263 | SN74V283 | SN74V293 | SN74V263-6PZA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO 16K X 18, SYNCHRONOUS FIFO | FIFO 65536 x 18 Synch FIFO Memory | FIFO 32768 x 18 Synch FIFO Memory | FIFO 32768 x 18 Synch FIFO Memory | SN74V263 8192 x 18 Synchronous FIFO Memory | SN74V283 32768 x 18 Synchronous FIFO Memory | SN74V293 65536 x 18 Synchronous FIFO Memory | 逻辑类型：- 额外特性：- 8192 x 18 同步 FIFO 存储器 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | - | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | - | - | - | QFP |
| 包装说明 | LFBGA, BGA100,10X10,32 | LFBGA, BGA100,10X10,32 | LFBGA, BGA100,10X10,32 | LFBGA, BGA100,10X10,32 | - | - | - | LQFP, QFP80,.64SQ |
| 针数 | 100 | 100 | 100 | 100 | - | - | - | 80 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | - | - | - | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - | EAR99 |
| Is Samacsys | N | N | N | N | - | - | - | N |
| 最长访问时间 | 6.5 ns | 5 ns | 5 ns | 6.5 ns | - | - | - | 4.5 ns |
| 其他特性 | CAN ALSO BE CONFIGURED AS 32768 X 9 | CAN ALSO BE CONFIGURED AS 131072 X 9 | CAN ALSO BE CONFIGURED AS 65536 X 9 | CAN ALSO BE CONFIGURED AS 65536 X 9 | - | - | - | CAN ALSO BE CONFIGURED AS 16384 X 9 |
| 备用内存宽度 | 9 | 9 | 9 | 9 | - | - | - | 9 |
| 最大时钟频率 (fCLK) | 100 MHz | 133 MHz | 133 MHz | 100 MHz | - | - | - | 166 MHz |
| 周期时间 | 10 ns | 7.5 ns | 7.5 ns | 10 ns | - | - | - | 6 ns |
| JESD-30 代码 | S-PBGA-B100 | S-PBGA-B100 | S-PBGA-B100 | S-PBGA-B100 | - | - | - | S-PQFP-G80 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm | - | - | - | 14 mm |
| 内存密度 | 294912 bit | 1179648 bit | 589824 bit | 589824 bit | - | - | - | 147456 bit |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | - | - | - | OTHER FIFO |
| 内存宽度 | 18 | 18 | 18 | 18 | - | - | - | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | - | - | - | 1 |
| 端子数量 | 100 | 100 | 100 | 100 | - | - | - | 80 |
| 字数 | 16384 words | 65536 words | 32768 words | 32768 words | - | - | - | 8192 words |
| 字数代码 | 16000 | 64000 | 32000 | 32000 | - | - | - | 8000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | - | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | - | - | - | 70 °C |
| 组织 | 16KX18 | 64KX18 | 32KX18 | 32KX18 | - | - | - | 8KX18 |
| 可输出 | YES | YES | YES | YES | - | - | - | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | - | - | - | LQFP |
| 封装等效代码 | BGA100,10X10,32 | BGA100,10X10,32 | BGA100,10X10,32 | BGA100,10X10,32 | - | - | - | QFP80,.64SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - | - | - | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - | - | - | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - | - | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | - | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | - | - | - | 1.6 mm |
| 最大待机电流 | 0.015 A | 0.015 A | 0.015 A | 0.015 A | - | - | - | 0.015 A |
| 最大压摆率 | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | - | - | - | 0.035 mA |
| 最大供电电压 (Vsup) | 3.45 V | 3.45 V | 3.45 V | 3.45 V | - | - | - | 3.45 V |
| 最小供电电压 (Vsup) | 3.15 V | 3.15 V | 3.15 V | 3.15 V | - | - | - | 3.15 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | - | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | - | - | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - | - | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | - | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | - | - | - | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | - | - | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | - | - | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm | - | - | - | 14 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
