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LNK6766K

产品描述Aluminum Organic Polymer Capacitors 10volts 100uF 20%
产品类别模拟混合信号IC    信号电路   
文件大小2MB,共24页
制造商Power Integrations
官网地址https://www.powerint.cn
标准
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LNK6766K概述

Aluminum Organic Polymer Capacitors 10volts 100uF 20%

LNK6766K规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Power Integrations
包装说明HSOP,
Reach Compliance Codecompliant
Factory Lead Time14 weeks
模拟集成电路 - 其他类型ANALOG CIRCUIT
JESD-30 代码R-PDSO-G11
长度10.16 mm
功能数量1
端子数量11
封装主体材料PLASTIC/EPOXY
封装代码HSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG
峰值回流温度(摄氏度)260
座面最大高度2.49 mm
表面贴装YES
端子形式GULL WING
端子节距1.78 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度8.89 mm

文档预览

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LinkSwitch-HP
Family
Energy Efficient, High-Power Off-Line Switcher
with Accurate Primary-Side Regulation (PSR)
Product Highlights
EcoSmart
- Energy Efficient
Multi-mode control maximizes efficiency over full load range
No-load consumption below 30 mW at 230 VAC (LNK67xx)
>75% efficiency with 1 W input at 230 VAC
>50% efficiency with 0.1 W input at 230 VAC
High Design Flexibility for Low System Cost
Dramatically simplifies power supply designs
Eliminates optocoupler and all secondary control circuitry
±5% or better output voltage tolerance
132 kHz operation reduces transformer and power supply size
Accurate programmable current limit
Compensation over line limits overload power
Frequency jittering reduces EMI filter cost
Fully integrated soft-start for minimum start-up stress
725 V MOSFET simplifies meeting derating requirements
(LNK677x)
650 V MOSFET for lowest system cost (LNK676x/LNK666x)
Fast transient response family option (LNK666x)
Extensive Protection Features
Auto-restart limits power delivery to 3% during overload faults
Output short-circuit protection (SCP)
Output overload/over-current protection (OPP, OCP)
Optional extended shutdown delay time
Output overvoltage protection (OVP), auto-restart or latching
Line brown-in/out protection (line UV)
Line overvoltage (OV) shutdown extends line surge withstand
Accurate thermal shutdown (OTP), hysteretic or latching
Advanced Green Package Options
eSIP
-7C package:
Vertical orientation for minimum PCB footprint
Simple heat sink mounting using clip or adhesive pad
eSOP
-12B package:
Low profile surface mounted for ultra-slim designs
Heat transfer to PCB via exposed pad and SOURCE pins
Supports either wave or IR reflow soldering
eDIP
-12B package:
Low profile through-hole mounted for ultra-slim designs
Heat transfer to PCB via exposed pad or optional metal heat sink
Extended creepage to DRAIN pin
Heat sink is connected to SOURCE for low EMI
Halogen free and RoHS compliant
Typical Applications
LCD Monitor and TV
Adapter
Appliances
Embedded power supplies (DVD, set-top box)
Industrial
CONTROL
Figure 1.
Typical Application Schematic.
Exposed
Pad
Exposed
Pad
eSIP-7C (E Package)
Figure 2.
Package Options.
eSOP-12B (K Package)
eDIP-12B (V Package)
Output Power Table
230 VAC ±15%
Product
4
85-265 VAC
Adapter
9W
12 W
13 W
11 W
15 W
20 W
13 W
18 W
26 W
15 W
22 W
40 W
19 W
27 W
55 W
21 W
30 W
63
3
W
25 W
36 W
72
3
W
Open
Frame
15 W
21 W
27 W
20 W
28 W
36 W
22 W
31 W
45 W
26 W
37 W
68
3
W
30 W
43 W
90
3
W
34 W
48 W
104
3
W
39 W
56 W
118
3
W
Heat Sink
PCB-W
1
PCB-R
2
Metal
PCB-W
1
PCB-R
2
Metal
PCB-W
1
PCB-R
2
Metal
PCB-W
1
PCB-R
2
Metal
PCB-W
1
PCB-R
2
Metal
PCB-W
1
PCB-R
2
Metal
PCB-W
1
PCB-R
2
Metal
Adapter
15 W
21 W
21 W
16 W
22 W
30 W
19 W
26 W
40 W
21 W
30 W
60 W
25 W
36 W
85
3
W
29 W
41 W
98
3
W
33 W
47 W
111
3
W
LNK6xx3K/V
LNK6xx3K
LNK6xx3E
LNK6xx4K/V
LNK6xx4K
LNK6xx4E
LNK6xx5K/V
LNK6xx5K
LNK6xx5E
LNK6xx6K/V
LNK6xx6K
LNK6xx6E
LNK6xx7K/V
LNK6xx7K
LNK6xx7E
LNK6xx8K/V
LNK6xx8K
LNK6xx8E
LNK6xx9K/V
LNK6xx9K
LNK6xx9E
Open
Frame
25 W
35 W
35 W
28 W
39 W
47 W
30 W
42 W
59
3
W
34 W
48 W
88
3
W
41 W
59 W
117
3
W
47 W
68 W
135
3
W
54 W
77 W
153
3
W
Table 1. Output Power Table.
Notes:
1. PCB heat sink with wave soldering.
2. PCB heat sink with IR reflow soldering (exposed pad thermally connected to PCB).
3. Maximum power specified based on proper thermal dissipation.
4. Packages: E: eSIP-7C, K: eSOP-12B, V: eDIP-12B. See Table 2 for all device options.
June 2015
www.power.com
This Product is Covered by Patents and/or Pending Patent Applications.

 
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