电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MMBZ5231ELT1G

产品描述RF Connectors / Coaxial Connectors U.FL RECEPTACLE SMT GLD M CONT REEL
产品类别分立半导体    二极管   
文件大小154KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 选型对比 全文预览

MMBZ5231ELT1G在线购买

供应商 器件名称 价格 最低购买 库存  
MMBZ5231ELT1G - - 点击查看 点击购买

MMBZ5231ELT1G概述

RF Connectors / Coaxial Connectors U.FL RECEPTACLE SMT GLD M CONT REEL

MMBZ5231ELT1G规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
厂商名称ON Semiconductor(安森美)
零件包装代码SOT-23
包装说明R-PDSO-G3
针数3
制造商包装代码318-08
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time1 week
Samacsys Confidence3
Samacsys StatusReleased
Samacsys PartID225788
Samacsys Pin Count3
Samacsys Part CategoryDiode
Samacsys Package CategorySOT23 (3-Pin)
Samacsys Footprint NameSOT-23 (TO-236) CASE 318-08
Samacsys Released Date2015-08-13 08:54:09
Is SamacsysN
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
最大动态阻抗17 Ω
JEDEC-95代码TO-236
JESD-30 代码R-PDSO-G3
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量3
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
极性UNIDIRECTIONAL
最大功率耗散0.225 W
认证状态Not Qualified
标称参考电压5.1 V
表面贴装YES
技术ZENER
端子面层Tin (Sn)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间40
最大电压容差5.1%
工作测试电流20 mA
Base Number Matches1

文档预览

下载PDF文档
MMBZ52xxELT1G Series,
SZMMBZ52xxELT1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Features
www.onsemi.com
3
Cathode
1
Anode
225 mW Rating on FR−4 or FR−5 Board
Zener Voltage Range
2.4 V to 91 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
Peak Power
225 W (8 x 20
ms)
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Pb−Free Packages are Available
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MARKING
DIAGRAM
3
1
2
SOT−23
CASE 318
STYLE 8
1
Bxx M
G
G
Bxx
xx
M
G
= Device Code
= (Refer to page 2)
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1)
@ T
L
25°C
Total Power Dissipation on FR−5 Board,
(Note 2) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 3) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
P
pk
P
D
Max
225
Unit
W
ORDERING INFORMATION
Device
MMBZ52xxELT1G
SZMMBZ52xxELT1G
225
1.8
556
300
2.4
417
−65
to
+150
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
3000 / Tape &
Reel
3000 / Tape &
Reel
10000 / Tape &
Reel
R
qJA
P
D
MMBZ52xxELT3G
R
qJA
T
J
, T
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2003
October, 2016
Rev. 8
1
Publication Order Number:
MMBZ5221ELT1/D

MMBZ5231ELT1G相似产品对比

MMBZ5231ELT1G MMBZ5253ELT1G MMBZ5248ELT1G
描述 RF Connectors / Coaxial Connectors U.FL RECEPTACLE SMT GLD M CONT REEL Zener Diodes 225 W E-RATED ZENER 25V Audio Transformers / Signal Transformers MID-SN6501 TI Driver Toroid .475mH 5VDC
Brand Name ON Semiconductor ON Semiconductor ON Semiconductor
是否无铅 不含铅 不含铅 不含铅
包装说明 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
针数 3 3 3
制造商包装代码 318-08 318-08 318-08
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
Factory Lead Time 1 week 1 week 1 week
配置 SINGLE SINGLE SINGLE
二极管元件材料 SILICON SILICON SILICON
二极管类型 ZENER DIODE ZENER DIODE ZENER DIODE
最大动态阻抗 17 Ω 35 Ω 21 Ω
JEDEC-95代码 TO-236 TO-236 TO-236
JESD-30 代码 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
JESD-609代码 e3 e3 e3
元件数量 1 1 1
端子数量 3 3 3
最高工作温度 150 °C 150 °C 150 °C
最低工作温度 -65 °C -65 °C -65 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 260 NOT SPECIFIED 260
极性 UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
最大功率耗散 0.225 W 0.225 W 0.225 W
标称参考电压 5.1 V 25 V 18 V
表面贴装 YES YES YES
技术 ZENER ZENER ZENER
端子面层 Tin (Sn) Tin (Sn) Tin (Sn)
端子形式 GULL WING GULL WING GULL WING
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 NOT SPECIFIED 40
最大电压容差 5.1% 5% 5%
工作测试电流 20 mA 5 mA 7 mA
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美) -
零件包装代码 SOT-23 - SOT-23
湿度敏感等级 1 - 1
认证状态 Not Qualified - Not Qualified
Base Number Matches 1 - 1

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1589  2135  883  491  1511  40  20  50  47  46 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved