Serializers u0026 Deserializers - Serdes
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC48,.27SQ,20 |
| 针数 | 48 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 差分输出 | YES |
| 驱动器位数 | 3 |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LINE DRIVER |
| 接口标准 | EIA-644; TIA-644 |
| JESD-30 代码 | S-XQCC-N48 |
| JESD-609代码 | e0 |
| 长度 | 7 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 端子数量 | 48 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC48,.27SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7 mm |
| MAX9209ETM-T | MAX9213ETM | MAX9209ETM | MAX9213ETM-T | MAX9209EUM+TD | |
|---|---|---|---|---|---|
| 描述 | Serializers u0026 Deserializers - Serdes | Serializers u0026 Deserializers - Serdes | Serializers & Deserializers - Serdes | Serializers & Deserializers - Serdes | IC SERIALIZER PROG 48-TSSOP |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | QFN | QFN | QFN | TSSOP |
| 包装说明 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | TSSOP, TSSOP48,.3,20 |
| 针数 | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 差分输出 | YES | YES | YES | YES | YES |
| 驱动器位数 | 3 | 3 | 3 | 3 | 3 |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
| 接口标准 | EIA-644; TIA-644 | EIA-644; TIA-644 | EIA-644; TIA-644 | EIA-644; TIA-644 | EIA-644; TIA-644 |
| JESD-30 代码 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | R-PDSO-G48 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e3 |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm | 12.5 mm |
| 功能数量 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | TSSOP |
| 封装等效代码 | LCC48,.27SQ,20 | LCC48,.27SQ,20 | LCC48,.27SQ,20 | LCC48,.27SQ,20 | TSSOP48,.3,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | 245 | 245 | 240 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.1 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Matte Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 6.1 mm |
| 湿度敏感等级 | 1 | 1 | 1 | - | 3 |
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