MMBD7000L, SMMBD7000L
Dual Switching Diode
Features
•
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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MAXIMUM RATINGS (EACH DIODE)
Rating
Reverse Voltage
Forward Current
Forward Surge Current
(60 Hz @ 1 cycle)
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
Symbol
V
R
I
F
I
FSM
I
FRM
Value
100
200
1.6
0.5
Unit
V
mA
A
A
1
ANODE
3
CATHODE/ANODE
2
CATHODE
SOT−23 (TO−236)
CASE 318
STYLE 11
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR− 5 Board
(Note 1)T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction to
Ambient
Total Device Dissipation
Alumina Substrate, (Note 2)
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
Symbol
P
D
Max
225
1.8
R
qJA
P
D
556
300
Unit
mW
mW/°C
°C/W
mW
M5C
M
G
1
M5C MG
G
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
2.4
R
qJA
417
T
J
, T
stg
−55 to +150
mW/°C
°C/W
°C
ORDERING INFORMATION
Device
MMBD7000LT1G
SMMBD7000LT1G
MMBD7000LT3G
SMMBD7000LT3G
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
1. FR− 5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 1994
1
June, 2017 − Rev. 8
Publication Order Number:
MMBD7000LT1/D
MMBD7000L, SMMBD7000L
CURVES APPLICABLE TO EACH DIODE
100
I F, FORWARD CURRENT (mA)
T
A
= 85°C
10
10
T
A
= 150°C
I R , REVERSE CURRENT (
m
A)
T
A
= -40°C
1.0
T
A
= 125°C
T
A
= 25°C
1.0
0.1
T
A
= 85°C
T
A
= 55°C
0.01
T
A
= 25°C
0.1
0.2
0.4
0.6
0.8
1.0
1.2
V
F
, FORWARD VOLTAGE (VOLTS)
0.001
0
10
20
30
40
50
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
0.68
Figure 3. Leakage Current
I
FSW
, FORWARD SURGE MAX CURRENT (A)
0
2.0
4.0
6.0
8.0
25
C D , DIODE CAPACITANCE (pF)
0.64
20
15
0.60
10
0.56
5
0.52
V
R
, REVERSE VOLTAGE (VOLTS)
0
0.001
0.01
0.1
1
10
t
p
, PULSE ON TIME (ms)
100
1000
Figure 4. Capacitance
Figure 5. Forward Surge Current
www.onsemi.com
3
MMBD7000L, SMMBD7000L
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
0.25
3
E
1
2
HE
L
3X
b
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
DIM
A
A1
b
c
D
E
e
L
L1
H
E
T
MIN
0.89
0.01
0.37
0.08
2.80
1.20
1.78
0.30
0.35
2.10
0
°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.14
0.20
2.90
3.04
1.30
1.40
1.90
2.04
0.43
0.55
0.54
0.69
2.40
2.64
−−−
10
°
MIN
0.035
0.000
0.015
0.003
0.110
0.047
0.070
0.012
0.014
0.083
0
°
INCHES
NOM
0.039
0.002
0.017
0.006
0.114
0.051
0.075
0.017
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.008
0.120
0.055
0.080
0.022
0.027
0.104
10
°
e
TOP VIEW
L1
VIEW C
A
A1
SIDE VIEW
SEE VIEW C
c
END VIEW
STYLE 11:
PIN 1. ANODE
2. CATHODE
3. CATHODE−ANODE
RECOMMENDED
SOLDERING FOOTPRINT*
2.90
3X
0.90
3X
0.80
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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