HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 1/3
H1N5817
thru
H1N5819
1.0 AMP. SCHOTTKY BARRIER RECTIFIERS
Features
•
Low Forward Voltage Drop
•
High Current Capability
•
High Reliability
•
High Surge Current Capability
Maximum Ratings
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz,
resistive or inductive load. For capacitive load, derate current by 20%.
Type Number
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
0.375"(9.5mm) Lead Length @ TL=90°C
Peak Forward Surge Current, 8.3ms Single Half
Sine-wave Superimposed on Rated Load (JEDEC
method)
Maximum Instantaneous Forward Voltage @ 1A
Maximum Instantaneous Forward Voltage @ 3A
Maximum DC Reverse Current At Rated DC
Blocking Voltage
Typical Thermal Resistance
(Note 1)
RθJA
Typical Junction Capacitance
(Note 2)
Operating Temperature Range Tj
Storage Temperature Range TSTG
0.45
0.750
H1N5817 H1N5818 H1N5819
20
14
20
30
21
30
1
25
0.550
0.875
1 (@ Ta=25°C)
10 (@ Ta=100°C)
50
110
-65 to +125
-65 to +125
0.600
0.900
40
28
40
Units
V
V
V
A
A
V
V
mA
mA
°C
/W
pF
°C
°C
Note 1: Thermal resistance from junction to ambient vertical PC Board Mounting, 0.375”(9.5mm) lead length.
Note 2: Measured at 1Mhz and applied reverse voltage of 4V D.C.
H1N5817, H1N5818, H1N5819
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Fig.1 - Maximum Forward Current Derating Curve
1.00
1000
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 2/3
Fig.2 - Typical Junction Capactitance
Average Forward Current (A)
0.75
0.50
Capacitance (pF)
0
25
50
75
100
o
100
0.25
0.00
125
150
175
10
0.1
1
10
100
Lead Temperature ( C)
Reverse Voltage (V)
Fig.3 - Typical Forward Characteristics
100
30
Fig.4 - Maximum Non-Repetitive Forward Surge Current
Instantaneous Forward Current (A)
.
H1N5817
10
H1N5818,H1N5819
Peak Forward Surge Current (A)
25
20
8.3ms Single Half Sine
Wave JIDIC Method
15
1
Tj=25
o
C
Pulse Width=300us
1% Duty Cycle
0.1
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
10
5
0
1
10
100
Forward Soltage (V)
Number Of Cycles At 60Hz
H1N5817, H1N5818, H1N5819
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
DO-41 Dimension
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 3/3
E
A
B
C
D
DO-41 Molded Plastic Package
HSMC Package Code: L
*: Typical
DIM
A
B
C
Inches
Min.
Max.
0.0280 0.0340
1.0000
-
0.1600 0.2050
Millimeters
Min.
Max.
0.71
0.86
25.40
-
4.10
5.20
DIM
D
E
Inches
Min.
Max.
1.0000
-
0.0800 0.1070
Millimeters
Min.
Max.
25.40
-
2.00
2.70
Notes:
1.Dimension and tolerance based on our Spec. dated May 28,1998.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy ; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H1N5817, H1N5818, H1N5819
HSMC Product Specification
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