电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-B0202AA-02-8660-G

产品描述Resistor Networks u0026 Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
下载文档 详细参数 全文预览

WBC-B0202AA-02-8660-G在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-B0202AA-02-8660-G - - 点击查看 点击购买

WBC-B0202AA-02-8660-G概述

Resistor Networks u0026 Arrays

WBC-B0202AA-02-8660-G规格参数

参数名称属性值
产品种类
Product Category
Resistor Networks & Arrays
制造商
Manufacturer
TT Electronics plc

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
市场上是不是应该有这样一款FPGA(CPLD)开发板
一个开发板包含FPGA(CPLD)+微处理器+USB PHY芯片包含一个USB口和若干个I/O口 USB接到电脑上,通过上位机程序设置不同I/O的用途 执行配置后进入工作模式 例如开发板可以把P1,P2,P3,P4配 ......
littleshrimp FPGA/CPLD
STM32芯片的USB中文资料与实验程序谁有?
STM32芯片的USB中文资料与实验程序谁有?能贡献一下吗?...
LINZI stm32/stm8
CC2640R2内部Bootloader烧写程序
给大家介绍一种利用芯片内部Bootloader烧写程序的方法,进入Boot模式,用普通的串行接口就可以进行固件的引导,FLASH的擦写,Program,不花费额外成本。 而且这个bootloader是放在ROM里的,不会 ......
火辣西米秀 微控制器 MCU
用EK-LM3S811-ND制作的 万年历、温湿度计
这是用TI研讨会送的EK-LM3S811-ND做的一个简单的时钟万年历、带有温湿度显示、时间设置、整点报时功能,显示使用了128X64的LCD,时钟芯片为DS1302,温湿度传感器用的是SHT10。屏幕背光定时关闭 ......
buruno 微控制器 MCU
中嵌教育 让你在竞争中占据优势
中嵌教育是西南地区最大的嵌入式技术工程师实训基地,是专业的嵌入式技术培训、咨询、推广机构,通过CESE中国嵌入式系统工程师权威认证,为学员提供专业的嵌入式技术人才服务平台.至今已成功开办多 ......
darkgrass 嵌入式系统
【 ST NUCLEO-H743ZI测评】_by dsjsjf
@dsjsjf 【 ST NUCLEO-H743ZI测评】(1)初识ST NUCLEO-H743ZI 【 ST NUCLEO-H743ZI测评】(2)以太网测试 【 ST NUCLEO-H743ZI测评】(3)以太网转串口测试 【 ST NUCLEO-H743ZI测评】(4 ......
okhxyyo stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 353  800  958  698  1568  3  37  30  43  54 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved