CM1692
Praetorian
)
L-C LCD and
Camera EMI Filter Array
with ESD Protection
Features
•
Four, Six and Eight Channels of EMI Filtering with Integrated
•
•
•
•
http://onsemi.com
•
•
ESD Protection
Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C)
Network
±15
kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
Greater than 30 dB Attenuation (Typical) at 1 GHz
0.50 mm Thick
mDFN
Package with 0.40 mm Lead Pitch:
♦
4−channel = 8−lead
mDFN
♦
6−channel = 12−lead
mDFN
♦
8−channel = 16−lead
mDFN
Tiny
mDFN
Package Size:
♦
8−lead: 1.70 mm x 1.35 mm
♦
12−lead: 2.50 mm x 1.35 mm
♦
16−lead: 3.30 mm x 1.35 mm
These Devices are Pb−Free and are RoHS Compliant
UDFN8
DE SUFFIX
CASE 517BC
UDFN12
DE SUFFIX
CASE 517BD
UDFN16
DE SUFFIX
CASE 517BE
ELECTRICAL SCHEMATIC
Filter
+
ESDn*
GND
1 of 4, 6 or 8 EMI/RFI Filter Channels
with Integrated ESD Protection
* See Package/Pinout Diagrams for expanded pin information.
17 nH
12 pF
12 pF
Filter
+
ESDn*
Applications
•
LCD and Camera Data Lines in Mobile Handsets
•
Wireless Handsets
•
LCD and Camera Modules
MARKING DIAGRAM
P92 MG
G
1
1
P92
P926
P928
M
G
P926 MG
G
1
= CM1692−04DE
= CM1692−06DE
= CM1692−08DE
= Date Code
= Pb−Free Package
P928 MG
G
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
CM1692−04DE
CM1692−06DE
CM1692−08DE
Package
mDFN−8
(Pb−Free)
mDFN−12
(Pb−Free)
mDFN−16
(Pb−Free)
Shipping
†
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2011
April, 2011
−
Rev. 4
1
Publication Order Number:
CM1692/D
CM1692
PACKAGE / PINOUT DIAGRAMS
Top View
(Pins Down View)
8 7 6 5
Bottom View
(Pins Up View)
1 2 3 4
Top View
(Pins Down View)
12 11 10 9 8 7
Bottom View
(Pins Up View)
1 2 3 4 5 6
Pin 1
Marking
P92
GND
PAD
Pin 1
Marking
P926
GND
PAD
1 2 3 4
8 7 6 5
CM1692−04DE
8 Lead
mDFN
Package
Top View
(Pins Down View)
16 15 14 13 12 11 10 9
1 2 3 4 5 6
12 11 10 9 8 7
CM1692−06DE
12 Lead
mDFN
Package
Bottom View
(Pins Up View)
1 2 3 4 5 6 7 8
Pin 1
Marking
P928
GND
PAD
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
CM1692−08DE
16 Lead
mDFN
Package
Table 1. PIN DESCRIPTIONS
Device Pin(s)
−04
1
2
3
4
−
−
−
−
−06
1
2
3
4
5
6
−
−
GND PAD
−08
1
2
3
4
5
6
7
8
Name
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
GND
Description
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 7
Filter + ESD Channel 8
Device Ground
Device Pin(s)
−04
8
7
6
5
−
−
−
−
−
−06
12
11
10
9
8
7
−
−
−
−08
16
15
14
13
12
11
10
9
−
Name
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
−
Description
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Filter + ESD Channel 7
Filter + ESD Channel 8
http://onsemi.com
2
CM1692
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
Current per Inductor
DC Package Power Rating
Rating
−65
to +150
30
500
Units
°C
mA
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
–40 to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
L
C
TOTAL
C
V
DIODE
I
LEAK
V
SIG
Parameter
Channel Inductance
Total Channel Capacitance
Capacitance C1
Stand−off Voltage
Diode Leakage Current (Reverse Bias)
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
Contact Discharge per
IEC 61000−4−2 Standard, Level 4
Dynamic Resistance
Positive
Negative
Roll−off Frequency at
−6
dB Attenuation
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
At 2.5 V DC Reverse Bias,
1 MHz, 30 mV AC
At 2.5 V DC Reverse Bias,
1 MHz, 30 mV AC
I
DIODE
= 10
mA
V
DIODE
= 3.3 V
(Note 3)
I
LOAD
= 10 mA
I
LOAD
=
−10
mA
(Notes 2 and 3)
5.6
−1.5
±15
18.8
Conditions
Min
Typ
17
23.5
11.8
6.0
0.1
6.8
−0.8
1.0
9.0
−0.4
28.2
Max
Units
nH
pF
pF
V
mA
V
V
ESD
kV
R
DYN
2.3
0.9
400
W
f
C
MHz
1. T
A
= 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is
measured at pin C1). Unused pins are left open.
http://onsemi.com
3
CM1692
PERFORMANCE INFORMATION
Typical Diode Capacitance vs. Input Voltage
Capacitance (Normalized)
DC Voltage (V)
Figure 1. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5 V DC and 255C)
0 dB
−10
dB
−20
dB
−30
dB
−40
dB
−50
dB
3
10
100
FREQUENCY (MHz)
1000
2000
6000
Figure 2. Typical Performance Curve
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4
CM1692
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC−01
ISSUE O
D
2X
0.10 C
2X
0.10 C
0.05 C
8X
0.05 C
NOTE 4
DETAIL A
8X
L
8X
K
e
e/2
BOTTOM VIEW
0.50
0.25
8X
ÉÉ
ÉÉ
D2
1
8
PIN ONE
REFERENCE
E
A1
ALTERNATE
CONSTRUCTIONS
TOP VIEW
DETAIL B
A
(A3)
L1
DETAIL A
SIDE VIEW
A1
C
SEATING
PLANE
E2
8X
b
0.10 C A B
0.05 C
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
ÉÉ
ÇÇ
A
B
EXPOSED Cu
MOLD CMPD
A3
DETAIL B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.70 BSC
1.10
1.30
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
L
L
ALTERNATE TERMINAL
CONSTRUCTIONS
RECOMMENDED
SOLDERING FOOTPRINT*
1.40
PACKAGE
OUTLINE
8X
0.40
1.55
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
嵌入式系统
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