CM1457
4-, 6-, 8-Channel EMI Filter
Array with ESD Protection
Description
The CM1457 is an inductor-based (L-C) EMI filter array with ESD
protection, which integrates four, six, or eight filters in a CSP form
factor with 0.40 mm pitch. Each EMI filter channel of the CM1457 is
implemented with the component value of 6 pF
−
35 nH – 4.7 pF
−
35 nH – 1.8 pF. The cut-off frequency at
−3
dB attenuation is
300 MHz and can be used in applications where the data rates are as
high as 160 Mbps, while providing greater than
−35
dB attenuation
over the 800 MHz to 2.7 GHz frequency range. The parts include ESD
diodes on every I/O pin and provide a high level of protection against
electrostatic discharge (ESD). The ESD protection diodes connected
to the external filter ports are designed and characterized to safely
dissipate ESD strikes of
±15
kV, which is beyond the maximum
requirement of the IEC61000−4−2 international standard.
This device is particularly well suited for wireless handsets, mobile
LCD modules and PDAs because of its small package format and
easy-to-use pin assignments. In particular, the CM1457 is ideal for
EMI filtering and protecting data and control lines for the LCD display
and camera interface in mobile handsets.
The CM1457 incorporates
OptiGuard
which results in improved
reliability at assembly. It is manufactured with a 0.40 mm pitch and
0.25 mm CSP solder ball to provide up to 28% board space savings vs.
competing CSP devices with 0.50 mm pitch and 0.30 mm CSP solder
ball.
Features
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WLCSP10
CP SUFFIX
CASE 567BJ
WLCSP15
CP SUFFIX
CASE 567BR
WLCSP20
CP SUFFIX
CASE 567BV
BLOCK DIAGRAM
Cn*
(External
Pins)
GND
(Pins
B1−B4)
35 nH 35 nH
6 pF
4.7 pF
1.8 pF
An*
(Internal
Pins)
MARKING DIAGRAM
N57 w
N57 yww
N57 yyww
CM1457−08
20−Bump CSP
•
Four, Six or Eight Channels of EMI Filtering
•
±15
kV ESD Protection (IEC 61000−4−2, Contact Discharge) at
•
•
•
•
External Pins
Greater than
−40
dB of Attenuation at 1 GHz
MIL−STD−883 International ESD Standard
Chip Scale Package (CSP) with 0.40 mm Pitch and 0.25 mm CSP
Solder Ball which Features Extremely Low Parasitic Inductance
for Optimum Filter and ESD Performance
OptiGuard
Coating for Improved Reliability at Assembly
These Devices are Pb−Free and are RoHS Compliant
CM1457−06
CM1457−04
10−Bump CSP 15−Bump CSP
N57
N57
N57
w/yww/yyww
= CM1457−04CP
= CM1457−06CP
= CM1457−08CP
= date code
ORDERING INFORMATION
Device
CM1457−04CP
CM1457−06CP
CM1457−08CP
Package
CSP−10
(Pb−Free)
CSP−15
(Pb−Free)
CSP−20
(Pb−Free)
Shipping
†
3500/Tape & Reel
3500/Tape & Reel
3500/Tape & Reel
Applications
•
LCD and Camera Data Lines in Mobile Handsets
•
I/O Port Protection for Mobile Handsets, Notebook Computers,
•
•
•
•
PDAs, etc.
EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers
Wireless Handsets
Handheld PCs/PDAs
LCD and Camera Modules
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2013
May, 2013
−
Rev. 6
1
Publication Order Number:
CM1457/D
CM1457
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
DC current per Inductor
DC Package Power Rating
Rating
−65
to +150
15
0.5
Units
°C
mA
W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
−40
to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
L
TOT
R
TOT
C
TOT_0V
C
TOT_2.5V
V
ST
I
LEAK
V
SIG
Parameter
Total Channel Inductance
Total Channel DC Resistance
Total Channel Capacitance, 0 V bias
Total Channel Capacitance, 2.5 V bias
Stand−off Voltage
Diode Leakage Current
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
a) Contact Discharge per IEC 61000−4−2 standard,
Level 4
(External Pins)
b) Contact Discharge per IEC 61000−4−2 standard,
Level 4
(Internal Pins)
Cut−off Frequency
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
0 V dc; 1 MHz, 30 mV rms
2.5 V dc; 1 MHz,
30 mV rms
I = 10
mA
V
IN
= +3.3 V
I
LOAD
= 10 mA
I
LOAD
=
−10
mA
(Notes 2 and 3)
5.6
−1.5
±15
±2
MHz
5.5
0.1
6.8
−0.8
0.5
9.0
−0.4
Conditions
Min
Typ
70
45
20
12.5
24
Max
Units
nH
W
pF
pF
V
mA
V
V
ESD
kV
f
C
300
1. T
A
= 25
°
C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Unused pins are left open.
APPLICATION INFORMATION
Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by
ON Semiconductor.
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3
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