Encoders, Decoders, Multiplexers u0026 Demultiplexers ANALOG MULTIPLEXERS/DEMUL
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 针数 | 16 |
| 制造商包装代码 | 751B-05 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 1 week |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 1200 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 最大信号电流 | 0.025 A |
| 表面贴装 | YES |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| NLV14052BDG | BLU0603ER-2290-BB101W | NLV14053BDR2G | NLV14052BDR2G | NLV14051BDR2G | |
|---|---|---|---|---|---|
| 描述 | Encoders, Decoders, Multiplexers u0026 Demultiplexers ANALOG MULTIPLEXERS/DEMUL | Fixed Resistor, Thin Film, 0.1W, 229ohm, 75V, 0.1% +/-Tol, 100ppm/Cel, 0603, | Encoders, Decoders, Multiplexers u0026 Demultiplexers ANALOG MULTIPLEXERS/DEMUL | Encoders, Decoders, Multiplexers u0026 Demultiplexers ANALOG MULTIPLEXERS/DEMUL | Tantalum Capacitors - Solid SMD 16volt 10uF 10% ESR=3Ohms |
| Brand Name | ON Semiconductor | - | ON Semiconductor | ON Semiconductor | - |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - |
| 针数 | 16 | - | 16 | 16 | - |
| 制造商包装代码 | 751B-05 | - | 751B-05 | 751B-05 | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | - |
| Factory Lead Time | 1 week | - | 51 weeks | 1 week | - |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | - | SPDT | DIFFERENTIAL MULTIPLEXER | - |
| JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | - |
| JESD-609代码 | e3 | e3 | e3 | e3 | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | - |
| 信道数量 | 4 | - | 2 | 4 | - |
| 功能数量 | 1 | - | 3 | 1 | - |
| 端子数量 | 16 | 2 | 16 | 16 | - |
| 最大通态电阻 (Ron) | 1200 Ω | - | 1200 Ω | 1200 Ω | - |
| 最高工作温度 | 125 °C | 155 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | - | SOP | SOP | - |
| 封装等效代码 | SOP16,.25 | - | SOP16,.25 | SOP16,.25 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | SMT | SMALL OUTLINE | SMALL OUTLINE | - |
| 电源 | 5/15 V | - | 5/15 V | 5/15 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - |
| 最大信号电流 | 0.025 A | - | 0.025 A | 0.025 A | - |
| 表面贴装 | YES | - | YES | YES | - |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - |
| 技术 | CMOS | THIN FILM | CMOS | CMOS | - |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | - |
| 端子面层 | Tin (Sn) | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) | Tin (Sn) | - |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | - |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | - |
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