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HSMS-2825-BLKG

产品描述Multilayer Ceramic Capacitors MLCC - SMD/SMT 0805 47uF 6.3volts *Derate Voltage/Temp
产品类别分立半导体    二极管   
文件大小159KB,共5页
制造商Broadcom(博通)
标准
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HSMS-2825-BLKG概述

Multilayer Ceramic Capacitors MLCC - SMD/SMT 0805 47uF 6.3volts *Derate Voltage/Temp

HSMS-2825-BLKG规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Broadcom(博通)
包装说明R-PDSO-G4
Reach Compliance Codecompliant
ECCN代码EAR99
外壳连接CATHODE
配置SEPARATE, 2 ELEMENTS
最大二极管电容0.2 pF
二极管元件材料SILICON
二极管类型MIXER DIODE
最大正向电压 (VF)0.34 V
频带C BAND
JESD-30 代码R-PDSO-G4
JESD-609代码e4
湿度敏感等级1
元件数量2
端子数量4
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
认证状态Not Qualified
最大反向电流0.1 µA
反向测试电压1 V
表面贴装YES
技术SCHOTTKY
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

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HSMS-282Y
RF Schottky Barrier Diodes In Surface Mount SOD-523 Package
Data Sheet
Description
The HSMS-282Y of Avago Technologies is a RF Schottky
Barrier Diode, featuring low series resistance, low forward
voltage at all current levels and good RF characteristics.
The device is housed in a miniature low cost surface
mount SOD-523 package. This miniature package is
particularly useful in the application where board space
is the major concern.ApplicationsThe HSMS-282Y is spe-
cially designed for both analog and digital applications.
The typical applications are mixing, detecting, switching,
sampling, clamping and wave shaping.
Table 1. Absolute Maximum Ratings
[1]
at Tc = +25°C
Symbol
I
F
P
IV
T
J
T
STG
qjb
Parameter
Forward Current (1 µs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
[2]
Unit
Amp
V
°C
°C
°C/W
Max Rating
1
15
150
-65 to 150
175
Features
Space saving SOD-523 package
Low Turn-On Voltage
Low Series Resistance
Tape and Reel Options Available
MSL 1 & Lead Free
Package Marking and Pin Connections
cathode
Y?
Anode
Note: Package marking provides orientation and identification
“Y” = Device Code
“?” = Month code indicates the month of manufacture
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. Thermal Resistance is measured from junction to board using IR
microscopy method.

 
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