July 09, 2008
IRS2530D(S)
DIM8
IC Features
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Dimming ballast control plus half-bridge driver
Closed-loop lamp current dimming control
Internal non-ZVS protection
Internal crest factor protection
Programmable preheat time
Fixed dead-time (2.0μs typ.)
Lamp insert auto-restart
Internal bootstrap MOSFET
Internal 15.6V zener clamp diode on Vcc
Micropower startup (250μA)
Latch immunity and ESD protection
TM
DIMMING BALLAST CONTROL IC
Product Summary
Topology
V
OFFSET
V
OUT
I
O+
& I
O-
(typical)
Deadtime (typical)
Half-Bridge
600 V
V
CC
180mA & 260mA
2.0μs
Package Types
Ballast System Features
Single chip dimming solution
Simple lamp current dimming control method
Single lamp current sensing resistor required
No half-bridge current-sensing resistor required
No external protection circuits required (fully
PDIP8
SO8
internal)
Flash-free lamp start at all dimming levels
Large reduction in component count
Typical applications
Easy to use for fast design cycle time
•
Linear dimming ballast (down to 10%)
Increased manufacturability and reliability
•
3-way dimming ballast
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Multi-level switch dimming ballast
Typical Connection Diagram
L
AC
LINE
INPUT
N
F1
LF
BR1
RVCC1
RVCC2
RLIM1
CF
CBUS
CVCC1
RLIM2
VCC
VB
1
8
RHO
HO
CBS
CSNUB
RLO
MLS
DCP2
RLMP2
RLMP1
CH2
CRES
LRES:B
CH1
MHS
LRES:A
CDC
IRS2530D
CVCC2
CDIM
COM
2
DIM
7
6
5
3
CVCO
VCO
VS
SPIRAL
CFL LAMP
4
CPH RVCO
RDIM1
CFB
LO
(+)
1-10V
DIM
INPUT
(-)
RFB
DCP1
LRES:C
RDIM2
RCS
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© 2008 International Rectifier
1
IRS2530D(S)
Table of Contents
Description
Qualification Information
Absolute Maximum Ratings
Recommended Operating Conditions
Electrical Characteristics
Input/Output Pin Equivalent Circuit Diagram
Lead Definitions
Lead Assignments
State Diagram
Application Information and Additional Details
Package Details
Tape and Reel Details
Part Marking Information
Ordering Information
Page
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© 2008 International Rectifier
2
IRS2530D(S)
Description
This IC takes full advantage of IR’s patented ballast and high-voltage technologies to realize a simple, high-
performance dimming ballast solution. A single high-voltage pin senses the half-bridge current and voltage
to perform necessary ballast protection functions. The DC dim input voltage reference and the AC lamp
current feedback have been coupled together allowing a single pin to be used for dimming. Combining these
high-voltage control algorithms together with a simple dimming method in a single 8-pin IC results in a large
reduction in component count, an increase in manufacturability and reliability, a reduced design cycle time,
while maintaining high dimming ballast system performance
Block Diagram
Bootstrap
MOSFET
VCC 1
UVLO
COM 2
Driver
Logic
8
High-Side
Half-bridge
Driver
7
6
VB
HO
VS
1uA
VCO 4
Voltage
Controlled
Oscillator
Fault
Logic
Crest
Factor
Protection
Half-bridge
Voltage
Sensing
Dimming
Control
Non-ZVS
Protection
Low-Side
Half-bridge
Driver
5
LO
DIM
3
Restart
Logic
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© 2008 International Rectifier
3
IRS2530D(S)
†
Qualification Information
Qualification Level
Moisture Sensitivity Level
Machine Model
ESD
Human Body Model
IC Latch-Up Test
RoHS Compliant
†
††
†††
Industrial
††
Comments: This family of ICs has passed JEDEC’s Industrial
qualification. IR’s Consumer qualification level is granted by
extension of the higher Industrial level.
MSL2
†††
SOIC8
(per IPC/JEDEC J-STD-020C)
Not applicable
PDIP8
(non-surface mount package style)
Class C
(per JEDEC standard EIA/JESD22-A115)
Class 3A
(per EIA/JEDEC standard JESD22-A114)
Class I, Level A
(per JESD78A)
Yes
Qualification standards can be found at International Rectifier’s web site
http://www.irf.com/
Higher qualification ratings may be available should the user have such requirements. Please contact
your International Rectifier sales representative for further information.
Higher MSL ratings may be available for the specific package types listed here. Please contact your
International Rectifier sales representative for further information.
www.irf.com
© 2008 International Rectifier
4
IRS2530D(S)
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All
voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead.
The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air
conditions.
Symbol
VB
VS
VHO
VLO
VVCO
VDIM
ICC
IOMAX
dV
S
/dt
PD
PD
R
θJA
R
θJA
TJ
TS
TL
†
Definition
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Floating Output Voltage
Low-Side Output Voltage
VCO Input Voltage
DIM Input Voltage
Supply Current
Maximum allowable current at LO, HO and PFC due to
external power transistor Miller effect.
Allowable VS Pin Voltage Slew Rate
Maximum Power Dissipation @ TA
≤
+25ºC, 8-Pin DIP
Maximum Power Dissipation @ TA
≤
+25ºC, 8-Pin SOIC
Thermal Resistance, Junction to Ambient, 8-Pin DIP
Thermal Resistance, Junction to Ambient, 8-Pin SOIC
Junction Temperature
Storage Temperature
Lead Temperature (Soldering, 10 seconds)
†
††
Min.
-0.3
VB - 25
VS - 0.3
-0.3
-0.3
-0.3
---
-500
-50
---
---
---
---
-55
-55
---
Max.
625
VB + 0.3
VB + 0.3
VCC + 0.3
6
VCC + 0.3
20
500
50
1.0
0.625
85
128
150
150
300
Units
V
mA
V/ns
W
ºC/W
ºC
This IC contains a zener clamp structure between the chip VCC and COM which has a nominal
breakdown voltage of 15.6V. This supply pin should not be driven by a DC, low impedance power
source greater than the VCLAMP specified in the Electrical Characteristics section.
This IC contains a zener clamp structure between the chip VCO and COM which has a nominal
breakdown voltage of 7.25V. This pin should not be driven by a DC, low impedance power source
greater than the VVCOMAX specified in the Electrical Characteristics section.
††
www.irf.com
© 2008 International Rectifier
5
NXP MCU
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