Operating Temperature Range ..........................-40ºC to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65ºC to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 2)
Side-Wettable QFND
Junction-to-Ambient Thermal Resistance (θ
JA
) ......... 37°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ............ 2.8°C/W
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ......... 29°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ............ 1.7°C/W
Note 1:
Self-protected against transient voltages exceeding these limits for ≤ 50ns under normal operation and loads up to the
maximum rated output current.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
SUP
= 14V, V
PV1
= V
BIAS
, V
PV2
= V
PV3
= V
OUT1
; T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
= +25°C under normal conditions, unless otherwise noted.) (Note 3)
PARAMETER
Supply Voltage Startup
Threshold
Supply Voltage Range
Supply Current
Oscillator Frequency
SYNC Input Frequency
Range
Spread-Spectrum Range
BIAS Regulator Voltage
PV_ POR
V
BIAS
V
SSEN
= V
GND
V
SSEN
= V
BIAS
6V ≤ V
SUP
≤ 42V, no switchover
V
BIAS
falling
Hysteresis
4.6
2.5
SYMBOL
V
SUP,STARTUP
V
SUP
I
SUP
f
SW
V
SUP
rising
Normal operation, after Buck 1 startup
V
EN1
= V
EN2
= V
EN3
= 0V
V
EN1
= 5V, V
EN2
= V
EN3
= 0V (no load)
2.0
1.7
0
+6
5.0
2.7
0.45
5.4
2.9
CONDITIONS
MIN
4.25
3.5
4
20
2.1
TYP
4.5
MAX
4.75
36
15
40
2.2
2.4
UNITS
V
V
µA
MHz
MHz
%
V
V
www.maximintegrated.com
Maxim Integrated
│
2
MAX16993
Step-Down Controller with
Dual 2.1MHz Step-Down DC-DC Converters
Electrical Characteristics (continued)
(V
SUP
= 14V, V
PV1
= V
BIAS
, V
PV2
= V
PV3
= V
OUT1
; T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
= +25°C under normal conditions, unless otherwise noted.) (Note 3)
按照官网上的说的方法安装按Energia，但是连空文件都变不了，出现错误提示error #34。"sketch_jul10a.cpp", line 4: error #34: invalid line number1 error detected in the compilation of "s ......
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
51单片机
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