Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................ -40°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1:
Signals on COM_ and NO_ exceeding V+ or V- are clamped by internal diodes.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........39°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................6°C/W
WLP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........46°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V+ = 1.6V to 5V, V- = (V+ - 5.5V) to 0V, V
L
= 0V to 5.5V (Notes 3, 4), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are
at V+ = 2.5V, V- = -2.5V, V
L
= 2.5V, T
A
= +25°C.) (Note 5)
PARAMETER
POWER SUPPLY
V+ Supply
V- Supply
V
L
Supply
V+ Supply Current
V
L
Supply Current
ANALOG SWITCH (Note 6)
Analog Signal Range
V
COM_,
V
NO_
I
COM_
= 10mA, V+ = 2.5V,
V- = -2.5V, V
NO_
= V- or V+
I
COM_
= 10mA, V+ = 3.0V,
V- = 0V, V
NO_
= 1.5V
I
COM_
= 10mA, V+ = 2.5V,
V- = -2.5V, V
NO_
= V- or V+
I
COM_
= 10mA, V+ = 3.0V,
V- = 0V , V
NO_
= 1.5V
0.5
1.35
V-
1
V+
3
Ω
5
1.25
Ω
V
V+
V-
V
L
I+
I
VL
V- > -2.5V
V- ≤ -2.5V
T
A
= +25°C
T
A
= +25°C
1.6
V+ - 5.5
0
0
1
1.5
5.5
0
5.5
V- + 8
5
5
V
V
V
µA
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
On-Resistance
R
ON
On-Resistance Match Between
Channels (Note 7)
ΔR
ON
www.maximintegrated.com
Maxim Integrated │ 2
MAX14724
Serial-Controlled 8:4 Matrix Switch Multiplexer
Electrical Characteristics (continued)
(V+ = 1.6V to 5V, V- = (V+ - 5.5V) to 0V, V
L
= 0V to 5.5V (Notes 3, 4), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are
at V+ = 2.5V, V- = -2.5V, V
L
= 2.5V, T
A
= +25°C.) (Note 5)
PARAMETER
On-Resistance Flatness
(Note 8, 9)
NO_ Off-Leakage Current
COM_ Off-Leakage Current
COM_ On-Leakage Current
DIGITAL I/O
Input Logic-High
Input Logic-Low
V
L
Shutdown Threshold High
V
L
Shutdown Threshold Low
Input Leakage Current
Digital Input Capacitance
Output Logic-Low (I
2
C Mode)
Output Logic-Low (SPI Mode)
Output Logic-High (SPI Mode)
DYNAMIC PERFORMANCE
Turn-Off Time
Break-Before-Make Time
Turn-On Time
Bandwidth -3dB
t
OFF
t
BBM
t
ON
BW
Q
COM_
,
Q
NO_
C
NO_OFF
C
COM_OFF
C
ON
V+ = 2.5V, V- = -2.5V, R
L
= 100Ω,
C
L
= 35pF, V
NO_
= 1V, Figure 2
V+ = 2.5V, V- = -2.5V, R
L
= 100Ω,
C
L
= 35pF, V
NO_
= 1V, Figure 2
V+ = 2.5V, V- = -2.5V, R
L
= 100Ω,
C
L
= 35pF, V
NO_
= 1V, Figure 2
R
S
= R
L
= 50Ω, V
NO_
= 0.5V
P-P
,
C
L
= 5pF, Figure 3
Initial condition: V
IN
= V
OUT
= GND.
C
IN
= 1nF, C
OUT
= 1nF, Figure 4,
(Note 10)
V
NO_
= 0V, f = 1MHz, Figure 5
V
COM_
= 0V, f = 1MHz, Figure 5
V
COM_
= V
NO_
= 0V, f = 1MHz,
V+ - V- = 5V, Figure 5
C
L
= 5pF, R
L
= 50Ω, f = 1MHz,
V
NO_
= 1V
RMS
, V+ - V- = 5V,
Figure 3
0
0.6
500
1
50
2
µs
ns
µs
MHz
V
OL_I2C
V
OL_SPI
V
OH_SPI
I
SINK
= 3mA
I
SINK
= 200µA
I
SOURCE
= 200µA
0.85 x V
L
V
IH
V
IL
V
LIH
V
LIL
I
IH
, I
IL
V
IN
= 0V, V+, or V-
-1
+0.005
1
0.4
0.15 x V
L
SCL/SCK, SDA/DI, I
2
C/CS, ADD/DO
SCL/SCK, SDA/DI, I
2
C/CS, ADD/DO
1.6
0.4
+1
0.7 x V
L
0.3 x V
L
V
V
V
V
µA
pF
V
V
V
SYMBOL
R
ON_FLAT
CONDITIONS
V+ = 2.5V, V- = -2.5V,
I
COM_
= 10mA, V
COM_
= -2.5V,
-1.25V, 0V, 1.25V, 2.5V
T
A
= 25°C, Figure 1 (Note 9)
T
A
= 125°C, Figure 1 (Note 9)
T
A
= 25°C, Figure 1 (Note 9)
T
A
= 125°C, Figure 1 (Note 9)
T
A
= 25°C, Figure 1 (Note 9)
T
A
= 125°C, Figure 1 (Note 9)
-0.25
-0.25
-0.25
MIN
TYP
0.2
+0.005
+0.5
+0.005
+1.0
+0.005
+1.5
+0.25
+0.25
MAX
0.5
+0.25
UNITS
Ω
µA
µA
µA
µA
µA
µA
Charge Injection
NO_ Off-Capacitance
COM_ Off-Capacitance
Switch On-Capacitance
Off-Isolation
-15
50
85
125
-60
pC
pF
pF
pF
dB
www.maximintegrated.com
Maxim Integrated │ 3
MAX14724
Serial-Controlled 8:4 Matrix Switch Multiplexer
Electrical Characteristics (continued)
(V+ = 1.6V to 5V, V- = (V+ - 5.5V) to 0V, V
L
= 0V to 5.5V (Notes 3, 4), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are
at V+ = 2.5V, V- = -2.5V, V
L
= 2.5V, T
A
= +25°C.) (Note 5)
PARAMETER
Crosstalk
SYMBOL
CONDITIONS
C
L
= 5pF, R
L
= 50Ω, f = 1MHz,
V
NO_
= 1V
RMS
, V+ - V- = 5V,
Figure 3
R
L
= 600Ω, f = 20Hz
to 20kHz,
V
NO_
= 0.5V
P-P
,
DC bias = (V+ + V-)/2
MIN
TYP
-65
MAX
UNITS
dB
Total Harmonic Distortion Plus
Noise
THD+N
V+ - V- ≥ 3V
0.1
%
SPI TIMING CHARACTERISTICS (Figure 14, Note 4)
SCLK Clock Period
SCLK Pulse-Width High
SCLK Pulse-Width Low
CS
Fall to SCLK Rise Time
DI Hold Time
DI Setup Time
Output Data Propagation
Delay
DO Rise and Fall Times
CS
Hold Time
I
2
C TIMING (Figure 6, Note 4)
I
2
C Serial-Clock Frequency
Bus Free Time Between STOP
and START Conditions
START Condition Setup Time
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
f
SCL
t
BUF
t
SU:STA
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
SU:DAT
t
HD:DAT
Write setup time,
V
L
= (V+ - V-) ≥ 1.8V
Write setup time,
V
L
= (V+ - V-) = 1.6V
Write hold time
1.3
0.6
0.6
0.6
1.3
0.6
100
ns
130
0
ns
400
kHz
µs
µs
µs
µs
µs
µs
t
CH
+ t
CL
t
CH
t
CL
t
CSS
t
DH
t
DS
t
DO
t
FT
t
CSH
C
L
= 15pF, (V+ - V-) ≥ 2.7V and
V
L
≥ 2.7V
C
L
= 15pF, V
L
≤ 2.7V
C
L
= 15pF
60
10
95
35
45
15
15
15
50
125
ns
ns
ns
ns
ns
ns
ns
ns
ns
Data Valid to SCL Rise Time
Data Hold Time to SCL Fall
www.maximintegrated.com
Maxim Integrated │ 4
MAX14724
Serial-Controlled 8:4 Matrix Switch Multiplexer
Electrical Characteristics (continued)
(V+ = 1.6V to 5V, V- = (V+ - 5.5V) to 0V, V
L
= 0V to 5.5V (Notes 3, 4), T
A
= -40°C to +85°C, unless otherwise noted. Typical values are
at V+ = 2.5V, V- = -2.5V, V
L
= 2.5V, T
A
= +25°C.) (Note 5)
PARAMETER
ESD PROTECTION
All COM_ and NO_ pins
All COM_ and NO_ pins
All COM_ and NO_ pins
All Other Pins
Note
Note
Note
Note
Note
Note
Note
Note
3:
4:
5:
6:
Human Body Model (HBM)
IEC 61000-4-2 Air Gap Discharge
IEC 61000-4-2 Contact Discharge
Human Body Model (HBM)
±30
±15
±10
±2
kV
kV
kV
kV
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
L
maximum operating voltage is 5.5V if V- is greater than -2.5V, otherwise the V
L
maximum operating voltage is (V- + 8V)
V
L
has to be greater than 1.6V for proper I
2
C and SPI communication and timing.
All devices are 100% production tested at T
A
= +25°C. Specifications over temperature are guaranteed by design.
(V+ - V-) has to be greater than 2.5V for good analog performance since on-resistance varies greatly when (V+ - V-) < 2.5V
(see On-Resistance in
Typical Operating Characteristics).
7:
ΔR
ON
= R
ON(MAX)
– R
ON(MIN)
.
8:
Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the
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