Buffers u0026 Line Drivers
| 参数名称 | 属性值 |
| 产品种类 Product Category | Buffers & Line Drivers |
| 制造商 Manufacturer | Maxim(美信半导体) |
| Number of Input Lines | 4 Input |
| 电源电压-最大 Supply Voltage - Max | 5.5 V, - 5.5 V |
| 电源电压-最小 Supply Voltage - Min | + 2.375 V, - 2.375 V |
| 最小工作温度 Minimum Operating Temperature | - 40 C |
| 最大工作温度 Maximum Operating Temperature | + 85 C |
| 安装风格 Mounting Style | SMD/SMT |
| 封装 / 箱体 Package / Case | QFN-EP-32 |
| Function | Line Receiver |
| 高度 Height | 0.89 mm |
| 长度 Length | 5 mm |
| 工作电源电流 Operating Supply Current | 180 mA |
| Receiver Signal Type | Differential |
| 宽度 Width | 5 mm |
| MAX9402EGJ-T | MAX9405EHJ-T | MAX9400EHJ- | MAX9402EHJ-T | MAX9405EGJ | MAX9402EHJ- | MAX9393EHJ | |
|---|---|---|---|---|---|---|---|
| 描述 | Buffers u0026 Line Drivers | Buffers u0026 Line Drivers | Buffers u0026 Line Drivers | Buffers & Line Drivers Undefined - IC BUFF/RCVR DIFF QUAD 32TQFP | Buffers & Line Drivers | Buffers & Line Drivers Undefined - IC BUFF/RCVR DIFF QUAD 32TQFP | Analog & Digital Crosspoint ICs |
| 是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 | - | 不符合 |
| 零件包装代码 | - | QFP | - | QFP | QFN | - | QFP |
| 包装说明 | - | HTFQFP, TQFP32,.28SQ | - | 5 X 5 MM, 1 MM HEIGHT, TQFP-32 | 5 X 5 MM, 0.90 MM HEIGHT, EXPOSED PAD, QFN-32 | - | 5 X 5 MM, 1 MM HEIGHT, MS-026, TQFP-32 |
| 针数 | - | 32 | - | 32 | 32 | - | 32 |
| Reach Compliance Code | - | not_compliant | - | not_compliant | not_compliant | - | not_compliant |
| ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | - | EAR99 |
| JESD-30 代码 | - | S-PQFP-G32 | - | S-PQFP-G32 | S-CQCC-N32 | - | S-PQFP-G32 |
| JESD-609代码 | - | e0 | - | e0 | e0 | - | e0 |
| 长度 | - | 5 mm | - | 5 mm | 5 mm | - | 5 mm |
| 湿度敏感等级 | - | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | - | 4 | - | 4 | 4 | - | 2 |
| 端子数量 | - | 32 | - | 32 | 32 | - | 32 |
| 最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY |
| 封装代码 | - | HTFQFP | - | HTFQFP | HVQCCN | - | TFQFP |
| 封装等效代码 | - | TQFP32,.28SQ | - | TQFP32,.28SQ | LCC32,.2SQ,20 | - | TQFP32,.28SQ |
| 封装形状 | - | SQUARE | - | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | - | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | - | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | - | 240 | - | 245 | 245 | - | 245 |
| 电源 | - | 2.5/5 V | - | 2.5/5 V | 2.5/5 V | - | 3.3 V |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 1.2 mm | - | 1.2 mm | 1 mm | - | 1.2 mm |
| 表面贴装 | - | YES | - | YES | YES | - | YES |
| 技术 | - | BIPOLAR | - | BIPOLAR | BIPOLAR | - | BIPOLAR |
| 温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | - | GULL WING | NO LEAD | - | GULL WING |
| 端子节距 | - | 0.5 mm | - | 0.5 mm | 0.5 mm | - | 0.5 mm |
| 端子位置 | - | QUAD | - | QUAD | QUAD | - | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | - | 5 mm | - | 5 mm | 5 mm | - | 5 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
