Desktop 3rd Generation Intel
®
Core™ Processor Family, Desktop
Intel
®
Pentium
®
Processor Family,
and Desktop Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2
November 2013
Document Number: 326764-008
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No computer system can provide absolute security under all conditions. Intel
®
Trusted Execution Technology (Intel
®
TXT) requires
a computer system with Intel
®
Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code
Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor,
an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing
Group and specific software for some uses. For more information, see
http://www.intel.com/technology/security/
Intel
®
Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor
(VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary
depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible
with all operating systems. Please check with your application vendor.
Intel
®
Active Management Technology requires the computer system to have an Intel(R) AMT-enabled chipset, network hardware
and software, as well as connection with a power source and a corporate network connection. Setup requires configuration by the
purchaser and may require scripting with the management console or further integration into existing security frameworks to
enable certain functionality. It may also require modifications of implementation of new business processes. With regard to
notebooks, Intel AMT may not be available or certain capabilities may be limited over a host OS-based VPN or when connecting
wirelessly, on battery power, sleeping, hibernating or powered off. For more information, see
http://www.intel.com/technology/
platform-technology/intel-amt/
Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-
enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For
more information including details on which processors support HT Technology, see
http://www.intel.com/info/hyperthreading.
“Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost
Technology performance varies depending on hardware, software and overall system configuration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see
http://www.intel.com/
technology/turboboost.”
Enhanced Intel SpeedStep
®
Technology See the
Processor Spec Finder
or contact your Intel representative for more information.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,
not across different processor families. See
www.intel.com/products/processor_number for details.
64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device
drivers and applications enabled for Intel® 64 architecture. Performance will vary depending on your hardware and software
configurations. Consult with your system vendor for more information.
Intel, Pentium, Celeron, Intel Core, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2013, Intel Corporation. All rights reserved.
2
Datasheet, Volume 1
Contents
1
Introduction
.............................................................................................................. 9
1.1
Processor Feature Details ................................................................................... 11
1.1.1 Supported Technologies .......................................................................... 11
1.2
Interfaces ........................................................................................................ 11
1.2.1 System Memory Support ......................................................................... 11
1.2.2 PCI Express* ......................................................................................... 12
1.2.3 Direct Media Interface (DMI).................................................................... 14
1.2.4 Platform Environment Control Interface (PECI) ........................................... 14
1.2.5 Processor Graphics ................................................................................. 14
1.2.6 Intel
®
Flexible Display Interface (Intel
®
FDI) ............................................. 15
1.3
Power Management Support ............................................................................... 15
1.3.1 Processor Core....................................................................................... 15
1.3.2 System ................................................................................................. 15
1.3.3 Memory Controller.................................................................................. 15
1.3.4 PCI Express* ......................................................................................... 16
1.3.5 Direct Media Interface (DMI).................................................................... 16
1.3.6 Processor Graphics Controller (GT) ........................................................... 16
1.3.7 Thermal Management Support ................................................................. 16
1.4
Processor SKU Definitions................................................................................... 16
1.5
Package ........................................................................................................... 17
1.6
Processor Compatibility ...................................................................................... 18
1.7
Terminology ..................................................................................................... 19
1.8
Related Documents ........................................................................................... 22
Interfaces................................................................................................................
23
2.1
System Memory Interface .................................................................................. 23
2.1.1 System Memory Technology Supported ..................................................... 23
2.1.2 System Memory Timing Support............................................................... 24
2.1.3 System Memory Organization Modes......................................................... 25
2.1.3.1 Single-Channel Mode................................................................. 25
2.1.3.2 Dual-Channel Mode – Intel
®
Flex Memory Technology Mode ........... 25
2.1.4 Rules for Populating Memory Slots ............................................................ 26
2.1.5 Technology Enhancements of Intel
®
Fast Memory Access (Intel
®
FMA).......... 27
2.1.5.1 Just-in-Time Command Scheduling.............................................. 27
2.1.5.2 Command Overlap .................................................................... 27
2.1.5.3 Out-of-Order Scheduling ............................................................ 27
2.1.6 Data Scrambling .................................................................................... 27
2.1.7 DDR3 Reference Voltage Generation ......................................................... 27
2.2
PCI Express* Interface....................................................................................... 28
2.2.1 PCI Express* Architecture ....................................................................... 28
2.2.1.1 Transaction Layer ..................................................................... 29
2.2.1.2 Data Link Layer ........................................................................ 29
2.2.1.3 Physical Layer .......................................................................... 29
2.2.2 PCI Express* Configuration Mechanism ..................................................... 30
2.2.3 PCI Express* Port................................................................................... 31
2.2.3.1 PCI Express* Lanes Connection .................................................. 31
2.3
Direct Media Interface (DMI)............................................................................... 32
2.3.1 DMI Error Flow....................................................................................... 32
2.3.2 Processor / PCH Compatibility Assumptions................................................ 32
2.3.3 DMI Link Down ...................................................................................... 32
2.4
Processor Graphics Controller (GT) ...................................................................... 33
2
Datasheet, Volume 1
3
2.5
2.6
3
3D and Video Engines for Graphics Processing ............................................33
2.4.1.1 3D Engine Execution Units ..........................................................33
2.4.1.2 3D Pipeline ...............................................................................34
2.4.1.3 Video Engine ............................................................................34
2.4.1.4 2D Engine ................................................................................35
2.4.2 Processor Graphics Display ......................................................................36
2.4.2.1 Display Planes ..........................................................................36
2.4.2.2 Display Pipes ............................................................................37
2.4.2.3 Display Ports ............................................................................37
2.4.3 Intel
®
Flexible Display Interface (Intel
®
FDI) .............................................37
2.4.4 Multi Graphics Controllers Multi-Monitor Support .........................................37
Platform Environment Control Interface (PECI) ......................................................38
Interface Clocking..............................................................................................38
2.6.1 Internal Clocking Requirements ................................................................38
2.4.1
Technologies............................................................................................................39
3.1
Intel
®
Virtualization Technology (Intel
®
VT) ..........................................................39
3.1.1 Intel
®
Virtualization Technology (Intel
®
VT) for
IA-32, Intel
®
64 and Intel
®
Architecture
(Intel
®
VT-x) Objectives ..........................................................................39
3.1.2 Intel
®
Virtualization Technology (Intel
®
VT) for
IA-32, Intel
®
64 and Intel
®
Architecture
(Intel
®
VT-x) Features ............................................................................40
3.1.3 Intel
®
Virtualization Technology (Intel
®
VT) for Directed
I/O (Intel
®
VT-d) Objectives ....................................................................40
3.1.4 Intel
®
Virtualization Technology (Intel
®
VT) for Directed
I/O (Intel
®
VT-d) Features.......................................................................41
3.1.5 Intel
®
Virtualization Technology (Intel
®
VT) for Directed
I/O (Intel
®
VT-d) Features Not Supported..................................................41
3.2
Intel
®
Trusted Execution Technology (Intel
®
TXT) .................................................42
3.3
Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) ....................................42
3.4
Intel
®
Turbo Boost Technology ............................................................................43
3.4.1 Intel
®
Turbo Boost Technology Frequency..................................................43
3.4.2 Intel
®
Turbo Boost Technology Graphics Frequency.....................................43
3.5
Intel
®
Advanced Vector Extensions (Intel
®
AVX)....................................................44
3.6
Security and Cryptography Technologies...............................................................44
3.6.1 Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) ........44
3.6.2 PCLMULQDQ Instruction ..........................................................................44
3.6.3 RDRAND Instruction ................................................................................45
3.7
Intel
®
64 Architecture x2APIC .............................................................................45
3.8
Supervisor Mode Execution Protection (SMEP) .......................................................46
3.9
Power Aware Interrupt Routing (PAIR)..................................................................46
Power Management
.................................................................................................47
4.1
Advanced Configuration and Power Interface
(ACPI) States Supported.....................................................................................48
4.1.1 System States........................................................................................48
4.1.2 Processor Core / Package Idle States.........................................................48
4.1.3 Integrated Memory Controller States .........................................................48
4.1.4 PCI Express* Link States .........................................................................49
4.1.5 Direct Media Interface (DMI) States ..........................................................49
4.1.6 Processor Graphics Controller States .........................................................49
4.1.7 Interface State Combinations ...................................................................49
4.2
Processor Core Power Management ......................................................................50
4.2.1 Enhanced Intel
®
SpeedStep
®
Technology ..................................................50
4.2.2 Low-Power Idle States.............................................................................50
4.2.3 Requesting Low-Power Idle States ............................................................52
4
4
Datasheet, Volume 1
4.3
4.4
4.5
4.6
4.7
5
6
Core C-states ........................................................................................ 52
4.2.4.1 Core C0 State........................................................................... 52
4.2.4.2 Core C1 / C1E State .................................................................. 53
4.2.4.3 Core C3 State........................................................................... 53
4.2.4.4 Core C6 State........................................................................... 53
4.2.4.5 C-State Auto-Demotion ............................................................. 53
4.2.5 Package C-States ................................................................................... 54
4.2.5.1 Package C0 .............................................................................. 55
4.2.5.2 Package C1/C1E ....................................................................... 55
4.2.5.3 Package C3 State...................................................................... 56
4.2.5.4 Package C6 State...................................................................... 56
Integrated Memory Controller (IMC) Power Management ........................................ 56
4.3.1 Disabling Unused System Memory Outputs ................................................ 56
4.3.2 DRAM Power Management and Initialization ............................................... 57
4.3.2.1 Initialization Role of CKE ............................................................ 58
4.3.2.2 Conditional Self-Refresh ............................................................ 58
4.3.2.3 Dynamic Power Down Operation ................................................. 59
4.3.2.4 DRAM I/O Power Management .................................................... 59
4.3.3 DDR Electrical Power Gating (EPG) ........................................................... 59
PCI Express* Power Management ........................................................................ 60
DMI Power Management..................................................................................... 60
Graphics Power Management .............................................................................. 60
4.6.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)
(also known as CxSR) ............................................................................. 60
4.6.2 Intel
®
Graphics Performance Modulation Technology (Intel
®
GPMT) .............. 60
4.6.3 Graphics Render C-State ......................................................................... 60
4.6.4 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .................................. 61
4.6.5 Intel
®
Graphics Dynamic Frequency.......................................................... 61
Graphics Thermal Power Management .................................................................. 61
4.2.4
Thermal Management
.............................................................................................. 63
Signal Description
................................................................................................... 65
6.1
System Memory Interface Signals........................................................................ 66
6.2
Memory Reference and Compensation Signals ....................................................... 67
6.3
Reset and Miscellaneous Signals.......................................................................... 68
6.4
PCI Express*-based Interface Signals .................................................................. 69
6.5
Intel
®
Flexible Display (Intel
®
FDI) Interface Signals ............................................. 69
6.6
Direct Media Interface (DMI) Signals.................................................................... 70
6.7
Phase Lock Loop (PLL) Signals ............................................................................ 70
6.8
Test Access Points (TAP) Signals ......................................................................... 70
6.9
Error and Thermal Protection Signals ................................................................... 71
6.10 Power Sequencing Signals .................................................................................. 72
6.11 Processor Power Signals ..................................................................................... 73
6.12 Sense Signals ................................................................................................... 73
6.13 Ground and Non-Critical to Function (NCTF) Signals ............................................... 74
6.14 Processor Internal Pull-Up / Pull-Down Resistors.................................................... 74
Electrical Specifications
........................................................................................... 75
7.1
Power and Ground Lands.................................................................................... 75
7.2
Decoupling Guidelines ........................................................................................ 75
7.2.1 Voltage Rail Decoupling........................................................................... 75
7.3
Processor Clocking (BCLK[0], BCLK#[0]) .............................................................. 76
7.3.1 Phase Lock Loop (PLL) Power Supply......................................................... 76
7.4
VCC Voltage Identification (VID).......................................................................... 76
7.5
System Agent (SA) V
CC
VID................................................................................ 80
7.6
Reserved or Unused Signals................................................................................ 80
7
Datasheet, Volume 1
5
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