RS-232 Interface IC
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | SSOP |
包装说明 | 5.30 MM, 0.65 MM PITCH, SSOP-28 |
针数 | 28 |
Reach Compliance Code | not_compliant |
接口集成电路类型 | INTERFACE CIRCUIT |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 10.2 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 |
认证状态 | Not Qualified |
座面最大高度 | 1.99 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 5.29 mm |
MAX3131CAI-T | MAX3130EAI- | MAX3130CAI- | MAX3131EAI | MAX3130EAI | MAX3130CAI-T | MAX3131EAI- | MAX3131CAI | |
---|---|---|---|---|---|---|---|---|
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是否无铅 | 含铅 | - | - | 不含铅 | 含铅 | 含铅 | - | 含铅 |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
厂商名称 | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
零件包装代码 | SSOP | - | - | SSOP | SSOP | SSOP | - | SSOP |
包装说明 | 5.30 MM, 0.65 MM PITCH, SSOP-28 | - | - | 5.30 MM, 0.65 MM PITCH, SSOP-28 | 5.30 MM, 0.65 MM PITCH, SSOP-28 | 5.30 MM, 0.65 MM PITCH, SSOP-28 | - | 5.30 MM, 0.65 MM PITCH, SSOP-28 |
针数 | 28 | - | - | 28 | 28 | 28 | - | 28 |
Reach Compliance Code | not_compliant | - | - | not_compliant | not_compliant | not_compliant | - | not_compliant |
接口集成电路类型 | INTERFACE CIRCUIT | - | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT |
JESD-30 代码 | R-PDSO-G28 | - | - | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | - | R-PDSO-G28 |
JESD-609代码 | e0 | - | - | e0 | e0 | e0 | - | e0 |
长度 | 10.2 mm | - | - | 10.2 mm | 10.2 mm | 10.2 mm | - | 10.2 mm |
湿度敏感等级 | 1 | - | - | 1 | 1 | 1 | - | 1 |
功能数量 | 1 | - | - | 1 | 1 | 1 | - | 1 |
端子数量 | 28 | - | - | 28 | 28 | 28 | - | 28 |
最高工作温度 | 70 °C | - | - | 85 °C | 85 °C | 70 °C | - | 70 °C |
封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | SSOP | - | - | SSOP | SSOP | SSOP | - | SSOP |
封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | - | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 | - | - | NOT SPECIFIED | 240 | 245 | - | 245 |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
座面最大高度 | 1.99 mm | - | - | 1.99 mm | 1.99 mm | 1.99 mm | - | 1.99 mm |
最大供电电压 | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
最小供电电压 | 3 V | - | - | 3 V | 3 V | 3 V | - | 3 V |
标称供电电压 | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
表面贴装 | YES | - | - | YES | YES | YES | - | YES |
温度等级 | COMMERCIAL | - | - | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) | - | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | - | - | GULL WING | GULL WING | GULL WING | - | GULL WING |
端子节距 | 0.65 mm | - | - | 0.65 mm | 0.65 mm | 0.65 mm | - | 0.65 mm |
端子位置 | DUAL | - | - | DUAL | DUAL | DUAL | - | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | 20 | NOT SPECIFIED | - | NOT SPECIFIED |
宽度 | 5.29 mm | - | - | 5.29 mm | 5.29 mm | 5.29 mm | - | 5.29 mm |
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