Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Operating Voltage Range
SYMBOL
V
CC
V
CC
= 5.5V, no load
V
CC
Supply Current
I
CC
V
CC
= 3.6V, no load
V
CC
= 2.5V, no load
V
CC
= 1.8V, no load
V
CC
Reset Threshold
(See Reset Thresholds table)
Reset Threshold Tempco
V
CC
to Reset Delay
T
A
= +25°C
V
TH
T
A
= -40°C to +125°C
∆V
TH
/°C
V
CC
falling at 10mV/µs from V
TH
+ 100mV
to V
TH
- 100mV
D1
D2
Reset Timeout Period
MAX6381–MAX6389
(See Reset Timeout table)
D3
t
RP
D5
D6
D4
D7
MR
timeout period
Reset Timeout Period
MAX6390
t
RP
V
CC
timeout period
V
IL
V
TH
< 4V
MR
Input Voltage
V
IH
V
IL
V
IH
V
TH
> 4V
0.7 x
V
CC
0.8
2.4
D4
D7
D4
D7
1
20
140
280
560
1120
1200
140
150
1120
1200
V
TH
-
1.5%
V
TH
-
2.5%
CONDITIONS
MIN
1.0
7
6
4
3
V
TH
V
TH
60
35
2
40
280
560
1120
2240
2400
280
300
2240
2400
0.3 x
V
CC
V
ms
ms
TYP
MAX
5.5
13
11
7
6
V
TH
+
1.5%
V
V
TH
+
2.5%
ppm/°C
µs
µA
UNITS
V
2
SC70/µDFN, Single/Dual Low-Voltage,
Low-Power µP Reset Circuits
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= full range, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
MR
Minimum Input Pulse Width
MR
Glitch Rejection
MR
to Reset Delay
MR
Internal Pullup Resistance
MAX6381–MAX6389
MAX6390
T
A
= +25°C
RESET IN Input Threshold
V
THRST
T
A
= 0°C to +85°C
T
A
= -40°C to +125°C
RESET IN to RESET Delay
RESET IN Input Leakage Current
Open-Drain
RESET
Output
Voltage
Open-Drain
RESET
Output
Leakage Current
I
RESET IN
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset asserted
V
OL
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset asserted
V
CC
≥
1.0V, I
SINK
= 80µA, reset asserted
I
LKG
V
CC
> V
TH
,
RESET
not asserted
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset asserted
V
OL
Push-Pull
RESET
Output Voltage
V
OH
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset asserted
V
CC
≥
1.0V, I
SINK
= 80µA, reset asserted
V
CC
≥
4.5V, I
SOURCE
= 800µA, reset not
asserted
V
CC
≥
2.5V, I
SOURCE
= 500µA, reset not
asserted
V
CC
≥
4.5V, I
SOURCE
= 800µA, reset asserted
V
CC
≥
2.5V, I
SOURCE
= 500µA, reset asserted
V
OH
V
CC
≥
1.8V, I
SOURCE
= 150µA, reset asserted
Push-Pull RESET Output Voltage
V
CC
≥
1.0V, I
SOURCE
= 1µA, reset asserted
V
CC
≥
4.5V, I
SINK
= 3.2mA, reset not
asserted
V
OL
V
CC
≥
2.5V, I
SINK
= 1.2mA, reset not
asserted
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.4
0.3
V
RESETIN
falling at 4mV/µs from
V
THRST
+ 40mV to V
THRST
- 40mV
-50
32
500
1.245
1.232
1.219
4.5
±1
+50
0.4
0.3
0.3
1.0
0.4
0.3
0.3
V
µA
V
SYMBOL
CONDITIONS
MIN
1
100
200
63
1560
1.27
100
3000
1.295
1.308
1.321
µs
nA
V
TYP
MAX
UNITS
µs
ns
ns
kΩ
Ω
MAX6381–MAX6390
V
Note 1:
Specifications over temperature are guaranteed by design, not production tested.
主题：自备终端(BYOD)发展趋势;用员工自己的移动设备来控制对工作设施及设备的使用，会对信息安全产生怎样的影响;在不使公司有安全风险或不损害员工隐私的前提下，有哪些方式能安全地实现这样的设施及设备使用。 自备终端(Bring Your Own Device，简称BYOD)，即企业允许员工离职时保留自己的手机，这种做法正日益流行。如今智能手机功能也越来越多，我们不仅能用自己的手机访问电脑、网...[详细]
与云数据库相比，小型计算机是专门为网络边缘的去中心化坚固计算而构建的。通过将应用程序、分析和处理服务移动到更靠近数据生成源的位置，业务运营可以获得改进的实时计算应用程序性能。 l 从奔腾到酷睿i5的可扩展CPU性能 l 智能电源点火管理和CAN总线网络支持 l 无线局域网和广域网LTE连接 l 丰富的I/O可扩展性，包括PoE、PCI、PCIe、COM l 适用于宽工作温度和宽电压输入的坚固...[详细]
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
