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5962-8770103RA

产品描述Digital to Analog Converters - DAC CMOS Buffered Multiplying 8-Bit
产品类别模拟混合信号IC    转换器   
文件大小29KB,共5页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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5962-8770103RA概述

Digital to Analog Converters - DAC CMOS Buffered Multiplying 8-Bit

5962-8770103RA规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码DIP
包装说明CERAMIC, DIP-20
针数20
Reach Compliance Codenot_compliant
ECCN代码3A001.A.2.C
转换器类型D/A CONVERTER
输入位码BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY
输入格式PARALLEL, 8 BITS
JESD-30 代码R-GDIP-T20
JESD-609代码e0
最大线性误差 (EL)0.3906%
湿度敏感等级1
位数8
功能数量2
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装等效代码DIP20,.3
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)240
电源5/15 V
认证状态Not Qualified
筛选级别MIL-STD-883
标称供电电压5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间20
Base Number Matches1

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下载PDF文档
SCOPE:
IMPROVED, QUAD, SPST ANALOG SWITCHES
Generic Number
DG411A(x)/883B
DG412A(x)/883B
DG413A(x)/883B
Device Type
01
02
03
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
K
L
Z
Mil-Std-1835
GDIP1-T16 or CDIP2-T16
CDFP4-F16
CQCC1-N20
Case Outline
Package Code
16 LEAD CERDIP
J16
16 LEAD FLATPACK
F16
20-Pin Ceramic LCC
L20
Absolute Maximum Ratings
Voltage Referenced to V
-
V
+
to V
-
.............................................................................................................................. 44V
GND ................................................................................................................................... 25V
V
L
...................................................................................................... (GND-0.3V) to V
+
+0.3V)
Digital Inputs, V
S
, V
D
1/ ........................................................................ .(V
-
-2V) to (V
+
+2V)
or 30mA whichever occurs first.
Continuous Current, Any terminal .................................................................................. 30mA
Peak Current, S or D (Pulsed at 1ms, 10% duty cycle max) ......................................... 100mA
Lead Temperature (soldering, 10 seconds) ...............................................................…..... +300°C
Storage Temperature ........................................................................................... -65°C to +150°C
Continuous Power Dissipation .........................................................................…….... T
A
=+70°C
16 lead CERDIP(derate 10.0mW/°C above +70°C) ...............................................…….. 800mW
16 lead FLATPACK(derate 6.1mW/°C above +70°C) .........................................…….... 485mW
20 lead LCC (derate 9.1 mW/°C above +70°C) ..................................................……..... 727mW
Junction Temperature T
J
....................................................................................………. +150°C
Thermal Resistance, Junction to Case,
ΘJC:
Case Outline 16 lead CERDIP...............................................................……..... 50°C/W
Case Outline 16 lead FLATPACK .........................................................……... 65°C/W
Case Outline 20 lead LCC .....................................................................…….... 20°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
Case Outline 16 lead CERDIP.............................................................……..... 100°C/W
Case Outline 16 lead FLATPACK .......................................................……... 165°C/W
Case Outline 20 lead LCC ...................................................................…….... 110°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) ........................................................………... -55°C to
+125°C
Positive Supply Voltage (V
+
) ...............................................................................………... +15V
Negative Supply Voltage (V
-
) ..............................................................................……….... -15V
V
INL
(max) .............................................................................................................………... 0.8V
V
INH
(min) .............................................................................................................……….... 2.4V
Logic Supply Voltage (V
L
) ....................................................................................……….. +5V
1/ Signals on S, D or IN exceeding V
+
or V
-
are clamped by internal diodes. Limit forward current to
maximum current ratings.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of DG411/412/413A /883B
19-0048
Page 2 of
Rev. D
7
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