GBU15J thru GBU15M
Single Phase Glass Passivated Silicon
Bridge Rectifier
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• High case dielectric strength of 1500 V
RMS
• Glass passivated chip junction
• Ideal for printed circuit boards
• High surge overload rating
• High temperature soldering guaranteed: 260⁰C/ 10
seconds, 0.375 (9.5mm) lead length
• Not ESD Sensitive
GBU Package
V
RRM
= 600 V -1000 V
I
O
= 15 A
Mechanical Data
Case: Molded plastic body over passivated junctions
Terminals: Plated leads, solderable per MIL-STD-750 Method 2026.
Mounting position: Any
Maximum ratings at Tc = 25 °C, unless otherwise specified
Parameter
Repetitive peak reverse voltage
RMS reverse voltage
DC blocking voltage
Operating temperature
Storage temperature
Symbol
V
RRM
V
RMS
V
DC
T
j
T
stg
Conditions
GBU15J
600
420
600
-55 to 150
-55 to 150
GBU15K
800
560
800
-55 to 150
-55 to 150
GBU15M
1000
700
1000
-55 to 150
-55 to 150
Unit
V
V
V
°C
°C
Electrical characteristics at Tc = 25 °C, unless otherwise specified
Single phase, half sine wave, 60 Hz, resistive or inductive load.
For capacitive load derate current by 20%.
Parameter
Maximum average forward rectified
current
1,2
Peak forward surge current
Maximum instantaneous forward
voltage drop per leg
Maximum DC reverse current at
rated DC blocking voltage per leg
Typical junction capacitance per leg
3
Symbol
I
O
I
FSM
V
F
I
R
C
j
R
ΘJC
Conditions
T
c
= 100 °C
t
p
= 8.3 ms, half sine
I
F
= 15 A
T
a
= 25 °C
T
a
= 125 °C
GBU15J
15.0
240
1.1
5
500
80
2.2
GBU15K
15.0
240
1.1
5
500
80
2.2
GBU15M
15.0
240
1.1
5
500
80
2.2
Unit
A
A
V
μA
pF
°C/W
Typical thermal resistance per leg
1,2
1
2
- Device mounted on 100 mm x 100 mm x 1.6 mm Cu plate heatsink
- Recommended mounted position is to bolt down device on a heatsink with silicon thermal
compond for maximum heat transfer using #6 screw.
3
- Measured at 1.0 MHz and applied reverse bias of 4.0 V
Apr 2016
Latest version of this datasheet at: www.genesicsemi.com/silicon-products/bridge-rectifiers/
1
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