Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN (Four-Layer Board)
Junction-to-Ambient Thermal Resistance (B
JA
) ..........41NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................9NC/W
TDFN (Single-Layer Board)
Junction-to-Ambient Thermal Resistance (B
JA
) ..........54NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................9NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7. For detailed
information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
DD
= 8V to 36V, V
EN
= 0V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Supply Voltage Range
Supply Current
Disable Supply Current
V
DD
I
DD
I
DIS
R
OH
Driver Output Resistance
R
OL
Undervoltage-Lockout Threshold
V
UVLO
(Note 3)
V
EN
= 0V, V
CLK
= 0V, R
LIM
= 1000I,
ST1/ST2 not connected
V
EN
= 3.3V, V
CLK
= 0V
ST1 = ST2 = high, I
ST1, ST2
= +300mA,
R
LIM
= 1000I
ST1 = ST2 = low, I
ST1, ST2
= -300mA,
R
LIM
= 1000I
V
DD
rising
5.9
8
6
0.65
1
0.6
6.3
300
36
9
1.1
1.5
I
1.0
6.9
V
mV
V
mA
mA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Undervoltage-Lockout Threshold
V
UVLO_HYST
Hysteresis
Maxim Integrated
2
MAX13256
36V H-Bridge Transformer
Driver for Isolated Supplies
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= 8V to 36V, V
EN
= 0V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER
ST1, ST2 Current Limit
ST1, ST2 Leakage Current
LOGIC SIGNALS (CLK,
EN, FAULT)
Input Logic-High Voltage
Input Logic-Low Voltage
Input Leakage Current
FAULT
Output Logic-Low
Voltage
FAULT
Leakage Current
AC CHARACTERISTICS
Switching Frequency
CLK Input Frequency
ST1/ST2 Duty Cycle
ST1/ST2 Rise Time
ST1/ST2 Fall Time
Crossover Dead Time
Watchdog Timeout
Current-Limit Blanking Time
Current-Limit Autoretry Time
PROTECTION
Thermal-Shutdown Threshold
Thermal-Shutdown Hysteresis
T
SHDN
T
SHDN_HYS
+160
10
NC
NC
f
SW
f
EXT
D
TC
t
RISE
t
FALL
t
DEAD
t
WDOG
t
BLANK
t
RETRY
V
CLK
= 0V, measured at ST1/ST2 outputs
External clocking
Internal or external clocking
ST1/ ST2 = 20% to 80% of V
DD
, R
L
= 1kI,
C
L
= 50pF, Figure 1a
ST1/ST2 = 80% to 20% of V
DD
, R
L
= 1kI,
C
L
= 50pF, Figure 1a
R
L
= 200I, Figure 1b
(Note 4)
Figure 2
Figure 2
20
0.73
23.4
30
32
1.2
38.4
55
2.0
64.0
255
200
49
50
425
700
2000
51
100
100
kHz
kHz
%
ns
ns
ns
Fs
ms
ms
V
IH
V
IL
I
IL
V
OL
I
LKGF
V
CLK
= V
EN
= 5.5V or 0V
I
FAULT
= 10mA
V
FAULT
= 36V,
FAULT
deasserted
-1
2
0.8
+1
1
10
V
V
FA
V
FA
SYMBOL
I
LIM
I
LKG
R
LIM
= 1000I
R
LIM
= 3010I
V
EN
= 3.3V, V
CLK
= 0V,
V
ST1
= V
ST2
= 0V or V
DD
CONDITIONS
MIN
500
165
-1
TYP
650
215
MAX
800
265
+1
UNITS
mA
FA
Note 2:
All units are production tested at T
A
= +25NC. Specifications over temperature are guaranteed by design.
Note 3:
If V
DD
is greater than 27V, see the
Snubber
section.
Note 4:
See the
Watchdog
section.
Maxim Integrated
3
MAX13256
36V H-Bridge Transformer
Driver for Isolated Supplies
Test Circuits/Timing Diagrams
ST1/ST2
R
L
C
L
ST2
(A)
V
DD
80
%
ST1
20
%
0V
V
DD
ST2
0V
(C)
t
RISE
t
FALL
ST1
R
L
(B)
80
%
20
%
t
DEAD
Figure 1. Test Circuits (A and B) and Timing Diagram (C) for Rise, Fall, and Dead Times
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