DATASHEET
ACTS240MS
High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State
Rev X.00
Jan 13, 2017
Features
• Devices QML Qualified in Accordance with MIL-PRF-38535
• Detailed Electrical and Screening Requirements are
Contained in SMD# 5962-96717 and Intersil’s QM Plan
• 1.25 Micron Radiation Hardened SOS CMOS
• Total Dose >300K RAD (Si)
• Single Event Upset (SEU) Immunity: <1 x 10
Bit/Day (Typ)
• SEU LET Threshold>100 MEV-cm
2
/mg
• Dose Rate Upset>10
11
RAD (Si)/s, 20ns Pulse
• Dose Rate Survivability>10
12
-10
Pinouts
20 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T20,
LEAD FINISH C
TOP VIEW
AEN
AI1
1
2
3
4
5
6
7
8
9
20 VCC
19 BEN
18 AO1
17 BI4
16 AO2
15 BI3
14 AO3
13 BI2
12 AO4
11 BI1
Errors/
BO4
AI2
BO3
AI3
BO2
AI4
BO1
RAD (Si)/s, 20ns Pulse
• Latch-Up Free Under Any Conditions
• Military Temperature Range-55
o
C to +125
o
C
• Significant Power Reduction Compared to ALSTTL
Logic
• DC Operating Voltage Range 4.5V to 5.5V
• Input Logic Levels
- VIL = 0.8V Max
- VIH = VCC/2 Min
• Input Current
1A at VOL, VOH
• Fast Propagation Delay17.5ns (Max), 12ns (Typ)
GND 10
20 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP4-F20,
LEAD FINISH C
TOP VIEW
AEN
AI1
BO4
AI2
BO3
AI3
BO2
AI4
BO1
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
BEN
AO1
BI4
AO2
BI3
AO3
BI2
AO4
BI1
Description
The Intersil ACTS240MS is a Radiation Hardened High Reli-
ability, High-Speed CMOS/SOS having two active low enable
inputs.
The ACTS240MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of a
radiation hardened, high-speed, CMOS/SOS Logic Family.
The ACTS240MS is supplied in a 20 lead Ceramic Flatpack (K
suffix) or a Dual-In-Line Ceramic Package (D suffix).
Ordering Information
PART NUMBER
5962F9671701VRC
5962F9671701VXC
ACTS240D/Sample
ACTS240K/Sample
ACTS240HMSR
TEMPERATURE RANGE
-55
o
C to +125
o
C
-55
o
C to +125
o
C
25
o
C
25
o
C
25
o
C
SCREENING LEVEL
MIL-PRF-38535 Class V
MIL-PRF-38535 Class V
Sample
Sample
Die
PACKAGE
20 Lead SBDIP
20 Lead Ceramic Flatpack
20 Lead SBDIP
20 Lead Ceramic Flatpack
Die
Rev X.00
Jan 13, 2017
Page 1 of 3
ACTS240MS
Die Characteristics
DIE DIMENSIONS:
100 mils x 100 mils
2.54mm x 2.54mm
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125k
Å
1.125k
Å
Metal 2 Thickness: 9k
Å
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 8k
Å
1k
Å
WORST CASE CURRENT DENSITY:
< 2.0 x 10
5
A/cm
2
BOND PAD SIZE:
110m x 110m
4.4 mils x 4.4 mils
Metallization Mask Layout
ACTS240MS
AI1
(2)
AEN
(1)
VCC
(20)
VCC
(20)
BEN
(19)
(18) AO1
BO4 (3)
(17) BI4
AI2 (4)
(16) AO2
BO3 (5)
(15) BI3
AI3 (6)
(14) AO3
BO2 (7)
(13) BI2
AI4 (8)
BO1 (9)
AO4 (12)
(10) (10)
GND GND
(11)
BI1
© Copyright Intersil Americas LLC
1999
. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see
www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at
www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see
www.intersil.com
Rev X.00
Jan 13, 2017
Page 3 of 3
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