Interface - Specialized High-Efficiency Dual-Power-Supply Controller for Notebook Computers
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC24,.16SQ,20 |
针数 | 24 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 26 V |
最小输入电压 | 4 V |
标称输入电压 | 12 V |
JESD-30 代码 | S-XQCC-N24 |
JESD-609代码 | e0 |
长度 | 4 mm |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出电流 | 3.3 A |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC24,.16SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
表面贴装 | YES |
切换器配置 | PUSH-PULL |
最大切换频率 | 575 kHz |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
MAX8716ETG-T | MAX8756ETI+ | MAX8756ETI+T | MAX8717ETI | MAX8757ETG- | MAX8716ETG | MAX8717ETI-T | |
---|---|---|---|---|---|---|---|
描述 | Interface - Specialized High-Efficiency Dual-Power-Supply Controller for Notebook Computers | IC cntrl dual PS 28-tqfn | IC cntrl dual PS 28-tqfn | Current u0026 Power Monitors u0026 Regulators Dual Power-Supply Controller | Interface - Specialized High-Efficiency Dual-Power-Supply Controllers for Notebook Computers | Interface - Specialized | Current & Power Monitors & Regulators |
是否无铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | - | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 | - | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | QFN | QFN | - | QFN | - | QFN | QFN |
包装说明 | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC28,.2SQ,20 | , | 5 X 5 MM, 0.80 MM HEIGHT, MO-220WHHD-1, TQFN-28 | - | 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD-2, TQFN-24 | HVQCCN, LCC28,.2SQ,20 |
针数 | 24 | 24 | - | 28 | - | 24 | 28 |
Reach Compliance Code | not_compliant | unknow | unknow | not_compliant | - | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | - | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE | CURRENT-MODE | - | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | 26 V | 26 V | - | 26 V | - | 26 V | 26 V |
最小输入电压 | 4 V | 4 V | - | 4 V | - | 4 V | 4 V |
标称输入电压 | 12 V | 12 V | - | 12 V | - | 12 V | 12 V |
JESD-30 代码 | S-XQCC-N24 | S-XQCC-N24 | - | S-XQCC-N28 | - | S-XQCC-N24 | S-XQCC-N28 |
JESD-609代码 | e0 | e3 | e3 | e0 | - | e0 | e0 |
长度 | 4 mm | 4 mm | - | 5 mm | - | 4 mm | 5 mm |
功能数量 | 1 | 1 | - | 1 | - | 1 | 1 |
端子数量 | 24 | 24 | - | 28 | - | 24 | 28 |
最高工作温度 | 85 °C | 85 °C | - | 85 °C | - | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
最大输出电流 | 3.3 A | 3.3 A | - | 3.3 A | - | 3.3 A | 3.3 A |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | - | HVQCCN | - | HVQCCN | HVQCCN |
封装等效代码 | LCC24,.16SQ,20 | LCC28,.2SQ,20 | - | LCC28,.2SQ,20 | - | LCC24,.16SQ,20 | LCC28,.2SQ,20 |
封装形状 | SQUARE | SQUARE | - | SQUARE | - | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | - | 245 | - | 245 | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 0.8 mm | - | 0.8 mm | - | 0.8 mm | 0.8 mm |
表面贴装 | YES | YES | - | YES | - | YES | YES |
切换器配置 | PUSH-PULL | PUSH-PULL | - | PUSH-PULL | - | PUSH-PULL | PUSH-PULL |
最大切换频率 | 575 kHz | 460 kHz | - | 575 kHz | - | 575 kHz | 575 kHz |
技术 | BICMOS | BICMOS | - | BICMOS | - | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | - | NO LEAD | - | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | - | 0.5 mm | - | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | - | QUAD | - | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4 mm | 4 mm | - | 5 mm | - | 4 mm | 5 mm |
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