Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Absolute Maximum Ratings
SUP, SUPSW, LX, EN to PGND ...........................-0.3V to +42V
SUP to SUPSW ....................................................-0.3V to +0.3V
BIAS to AGND .........................................................-0.3V to +6V
SPS, FOSC, COMP to AGND ................-0.3V to (V
BIAS
+ 0.3V)
FSYNC, PGOOD, FB to AGND ..............-0.3V to (V
BIAS
+ 0.3V)
OUT to PGND .......................................................-0.3V to +12V
BST to LX ................................................................-0.3V to +6V
AGND to PGND....................................................-0.3V to +0.3V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........30°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................2°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
SUP
= V
SUPSW
= 14V, V
EN
= 14V, L1 = 2.2µH, C
IN
= 4.7µF, C
OUT
= 44µF, C
BIAS
= 2.2µF, C
BST
= 0.1µF, R
FOSC
= 12kΩ, T
A
= T
J
=
-40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
Supply Voltage
Load-Dump Event Supply
Voltage
Supply Current
Supply Current (5V)
Shutdown Supply Current
BIAS Regulator Voltage
BIAS Undervoltage Lockout
BIAS Undervoltage-Lockout
Hysteresis
Thermal-Shutdown Threshold
Thermal-Shutdown Threshold
Hysteresis
OUTPUT VOLTAGE
PWM-Mode Output Voltage
(Note 2)
V
OUT_5V
V
OUT_3.3V
V
F
B = V
BIA
S, 6V < V
SUPS
W < 36V,
fixed-frequency mode
4.9
3.23
5
3.3
5.1
3.37
V
SYMBOL
V
SUP
,
V
SUPSW
V
SUP_LD
STANDBY
STANDBY
CONDITIONS
MIN
3.5
TYP
MAX
36
42
UNITS
V
V
µA
µA
µA
V
V
mV
°C
°C
t
LD
< 1s
Standby mode, no load, V
OUT
= 3.3V,
V
FSYNC
= 0V
Standby mode, no load, V
OUT
= 5V,
V
FSYNC
= 0V
V
E
N = 0V
V
SUP
= V
SUPSW
= 6V to 42V,
I
BIA
S = 0 to 10mA
V
BIAS
rising
4.7
2.9
15
20
5
5
3.15
400
175
15
I
SUP_
I
SUP_
30
35
10
5.4
3.4
500
I
SHDN
V
BIAS
V
UVBIAS
www.maximintegrated.com
Maxim Integrated
│
3
MAX20002/MAX20003
36V, 220kHz to 2.2MHz, 2A/3A Fully
Integrated Step-Down Converters
with 15μA Operating Current
Electrical Characteristics (continued)
(V
SUP
= V
SUPSW
= 14V, VEN = 14V, L1 = 2.2µH, C
IN
= 4.7µF, C
OUT
= 44µF, C
BIAS
= 2.2µF, C
BST
= 0.1µF, R
FOSC
= 12kΩ, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
Skip-Mode Output Voltage
(Note 3)
Load Regulation
Line Regulation
BST Input Current
I
BST_ON
I
BST_OFF
SYMBOL
SKIP_5V
SKIP_3.3V
CONDITIONS
MIN
4.9
TYP
5
3.3
0.5
0.02
1.5
1.5
MAX
5.15
UNITS
V
OUT_
V
OUT_
No load, V
FB
= V
BIAS
, skip mode
3.23
V
FB
= V
BIAS
, 30mA < I
LOA
D < 3A
V
FB
= V
BIAS
, 6V < V
SUPSW
< 36V
High-side MOSFET on,
V
BST
- V
LX
= 5V
High-side MOSFET off,
V
BST
- V
LX
= 5V
MAX20003:
MAX20003C/DATPA/V+,
MAX20003C/DATPB/V+,
MAX20002, MAX20002C, MAX20002D
MAX20003CATPC/V+,
MAX20003CATPD/V+
V
OUT
= 5V, 3.3V
Spread spectrum enabled
3.75
2.5
5
4
FOSC
±3%
60
1
35
1
20
0.99
0.985
1
1
0.02
700
80
98
R
FOSC
= 73.2kΩ
R
FOSC
= 12kΩ
2.0
400
2.2
2.4
99
140
5
70
5
100
1.01
3.4
V
%
%/V
mA
µA
6.25
4.16
A
5
3.33
LX Current Limit
I
LX
LX Rise Time
Spread Spectrum
High-Side Switch On-
Resistance
High-Side Switch Leakage
Current
Low-Side Switch On-
Resistance
Low-Side Switch Leakage
Current
FB Input Current
I
FB
R
ON_L
R
ON_H
ns
I
LX
= 0.5A, V
BIA
S = 5V
High-side MOSFET off, V
SU
P = 36V,
V
LX
= 0V, T
A
= +25°C
I
LX
= 0.5A, V
BIA
S = 5V
Low-side MOSFET off, V
SUP
= 36V,
V
LX
= 36V, T
A
= +25°C
T
A
= +25°C
FB connected to an external resistive
divider, 6V < V
SUPSW
< 36V
FB connected to an external resistive
divider, 6V < V
SUPSW
< 36V
(MAX20002C/D, MAX20003C/D)
6V < V
SUPSW
< 36V
V
FB
= 1V, V
BIAS
= 5V
mΩ
µA
mΩ
µA
nA
FB Regulation Voltage
V
FB
V
1.015
%/V
µS
ns
%
kHz
MHz
FB Line Regulation
Transconductance (from FB to
COMP)
Minimum On-Time
Maximum Duty Cycle
Oscillator Frequency
∆V
LINE
g
M
t
ON_MIN
DC
MAX
www.maximintegrated.com
Maxim Integrated
│
4
MAX20002/MAX20003
36V, 220kHz to 2.2MHz, 2A/3A Fully
Integrated Step-Down Converters
with 15μA Operating Current
Electrical Characteristics (continued)
(V
SUP
= V
SUPSW
= 14V, V
EN
= 14V, L1 = 2.2µH, C
IN
= 4.7µF, C
OUT
= 44µF, C
BIAS
= 2.2µF, C
BST
= 0.1µF, R
FOSC
= 12kΩ, T
A
= T
J
=
-40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
External Input Clock Acquisition
Time
External Input Clock Frequency
External Input Clock High
Threshold
External Input Clock Low
Threshold
FSYNC Leakage Current
Soft-Start Time
Enable Input High Threshold
Enable Input Low Threshold
Enable Threshold Voltage
Hysteresis
Enable Input Current
Spread-Spectrum Input High
Threshold
Spread-Spectrum Input Low
Threshold
Spread-Spectrum Input Current
t
SS
V
EN_HI
V
EN_LO
V
EN_HYS
I
EN
V
SPS_HI
V
SPS_LO
I
SPS
V
RISING
V
FALLING
T
A
= +25°C
V
FB
rising, V
PGOOD
= high
V
FB
falling, V
PGOOD
= low
I
SINK
= 5mA
V
OUT
in regulation, T
A
= +25°C
V
OUT
rising (monitor FB pin)
V
OUT
falling (monitor FB pin)
107
104
93
90
0.1
95
92.5
25
0.4
1
T
A
= +25°C
2.0
0.4
1
97
95
0.2
0.1
1
SYMBOL
t
FSYN
C
R
FOSC
= 12kΩ (Note 4)
V
FSYNC_HI
V
FSYN
C rising
V
FSYNC_LO
V
FSYN
C falling
T
A
= +25°C
5.6
2.4
0.6
8
1.8
1.4
0.4
1
12
CONDITIONS
MIN
TYP
1
2.6
MAX
UNITS
Cycle
MHz
V
V
µA
ms
V
V
V
µA
V
V
µA
SYNC, EN, AND SPS LOGIC THRESHOLDS
POWER-GOOD AND OVERVOLTAGE-PROTECTION THRESOLDS
PGOOD Switching Level
PGOOD Debounce Time
PGOOD Output Low Voltage
PGOOD Leakage Current
Overvoltage-Protection
Threshold
%V
FB
µs
V
µA
%
Note 2:
Device not in dropout condition.
Note 3:
Guaranteed by design; not production tested.
Note 4:
Contact the factory for SYNC frequency outside the specified range.
Microchip MCU
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