LED Display Drivers 16-Output PWM LED Drivers for Message Boards
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 数据输入模式 | SERIAL |
| 接口集成电路类型 | LED DISPLAY DRIVER |
| JESD-30 代码 | S-XQCC-N32 |
| 长度 | 5 mm |
| 复用显示功能 | NO |
| 功能数量 | 1 |
| 区段数 | 16 |
| 端子数量 | 32 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |
| 最小 fmax | 33 MHz |
| MAX6973ATJ-T | MAX6972ATJ-T | MAX6972ATJ- | MAX6973ATJ | MAX6973ATJ+ | MAX6972ATJ | |
|---|---|---|---|---|---|---|
| 描述 | LED Display Drivers 16-Output PWM LED Drivers for Message Boards | LED Display Drivers 16-Output PWM LED Drivers for Message Boards | LED Display Drivers 16-Output PWM LED Drivers for Message Boards | LED Display Drivers | LED Display Drivers | LED Display Drivers 16-Output PWM LED Drivers for Message Boards |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | - | QCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | QCCN, LCC32,.2SQ,20 |
| Reach Compliance Code | not_compliant | not_compliant | - | not_compliant | compliant | not_compliant |
| JESD-30 代码 | S-XQCC-N32 | S-XQCC-N32 | - | S-PQCC-N32 | S-XQCC-N32 | S-PQCC-N32 |
| 端子数量 | 32 | 32 | - | 32 | 32 | 32 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | - | QCCN | HVQCCN | QCCN |
| 封装等效代码 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | - | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER |
| 电源 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | - | YES | YES | YES |
| 技术 | BICMOS | BICMOS | - | BICMOS | BICMOS | BICMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | - | QUAD | QUAD | QUAD |
微控制器 MCU
电源技术
微控制器 MCU
嵌入式系统
聊聊、笑笑、闹闹
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
