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PLZ16B-HG3-H

产品描述Zener Diodes Vz @Izt 15.25-16.04V AEC-Q101 Qualified
产品类别半导体    分立半导体   
文件大小149KB,共9页
制造商Vishay(威世)
官网地址http://www.vishay.com
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PLZ16B-HG3-H概述

Zener Diodes Vz @Izt 15.25-16.04V AEC-Q101 Qualified

PLZ16B-HG3-H规格参数

参数名称属性值
产品种类
Product Category
Zener Diodes
制造商
Manufacturer
Vishay(威世)
RoHSDetails
Vz - Zener Voltage16 V
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
DO-219AC-2
Pd-功率耗散
Pd - Power Dissipation
500 mW (1/2 W)
Zener Current200 nA
Zz - Zener Impedance18 Ohms
最小工作温度
Minimum Operating Temperature
- 55 C
最大工作温度
Maximum Operating Temperature
+ 150 C
ConfigurationSingle
资格
Qualification
AEC-Q101
系列
Packaging
Cut Tape
系列
Packaging
Reel
系列
Packaging
MouseReel
高度
Height
0.6 mm
Ir - Reverse Current200 nA
长度
Length
2.5 mm
产品
Product
Zener Diodes
工厂包装数量
Factory Pack Quantity
4500
Vf - Forward Voltage800 mV
宽度
Width
1.3 mm

文档预览

下载PDF文档
PLZ Series
www.vishay.com
Vishay Semiconductors
Zener Diodes Permitting 500 mW Power Dissipation
FEATURES
Sillicon planar Zener diodes, ultra small
Low profile DO-219AC (MicroSMF) package
Low leakage current
Excellent stability
High temperature soldering: 260 °C / 10 s at
terminals
Wave and reflow solderable (reflow as per
JPC / JEDEC
®
J-STD 020) (double wave as
per IEC 61760-1)
AEC-Q101 qualified available
Base P/N-G3 - RoHS-compliant, green, industrial grade
Base P/N-HG3 - RoHS-compliant, green, AEC-Q101 qualified
ESD immunity acc. IEC 61000-4-2 acc. to part table
Surge performance acc. to part table
Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
1
2
20278
PRIMARY CHARACTERISTICS
PARAMETER
V
Z
range nom.
Test current I
ZT
V
Z
specification
Int. construction
VALUE
2.0 to 39
5 to 20
Pulse current
Single
UNIT
V
mA
ORDERING INFORMATION
DEVICE NAME
PLZ-Series
PLZ-Series
ORDERING CODE
Part number-G3/H
Part number-HG3/H
TAPED UNITS PER REEL
4500 per 7" reel (8 mm tape)
MINIMUM ORDER QUANTITY
22 500 / box
PACKAGE
PACKAGE NAME
DO-219AC (MicroSMF)
WEIGHT
4.8 mg
MOLDING COMPOUND
FLAMMABILITY RATING
UL 94 V-0
MOISTURE SENSITIVITY LEVEL
MSL level 1 (according J-STD-020)
SOLDERING CONDITIONS
260 °C / 10 s at terminals
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Power dissipation
Power dissipation
Power dissipation
Non-repetitive peak surge power dissipation
Z-current
Junction temperature
Storage temperature range
TEST CONDITION
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, T
amb
= 85 °C
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm, T
amb
= 25 °C
Mounted on FR4 board with recommended soldering
footpads (reflow)
t
p
= 8/20 μs acc. IEC 61000-4-5 (PLZ5V1A to PLZ39D)
t
p
= 8/20 μs acc. IEC 61000-4-5 (PLZ2V0A to PLZ4V7C)
SYMBOL
P
tot
P
tot
P
tot
P
ZSM
P
ZSM
I
Z
T
j
T
stg
VALUE
500
960
340
100
70
P
tot
/V
Z
150
-55 to +150
W
W
mA
°C
mW
UNIT
THERMAL CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Typ. thermal resistance junction to ambient air
Typ. thermal resistance junction to lead
TEST CONDITION
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm
SYMBOL
R
thJA
R
thJL
VALUE
130
40
UNIT
K/W
K/W
ELECTRICAL SPECIFICATIONS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Forward Voltage
TEST CONDITION
I
F
= 10 mA
SYMBOL
V
F
MIN.
TYP.
0.8
MAX.
0.9
UNIT
V
Rev. 1.2. 29-Nov-16
Document Number: 84830
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

 
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