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MJE700G

产品描述Darlington Transistors 4A 60V Bipolar Power PNP
产品类别分立半导体    晶体管   
文件大小126KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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MJE700G概述

Darlington Transistors 4A 60V Bipolar Power PNP

MJE700G规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
厂商名称ON Semiconductor(安森美)
零件包装代码TO-225
包装说明FLANGE MOUNT, R-PSFM-T3
针数3
制造商包装代码77-09
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time4 weeks
其他特性BUILT IN BIAS RESISTOR
最大集电极电流 (IC)4 A
集电极-发射极最大电压60 V
配置DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
最小直流电流增益 (hFE)750
JEDEC-95代码TO-225
JESD-30 代码R-PSFM-T3
JESD-609代码e3
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式FLANGE MOUNT
峰值回流温度(摄氏度)260
极性/信道类型PNP
最大功率耗散 (Abs)40 W
认证状态Not Qualified
表面贴装NO
端子面层Matte Tin (Sn) - annealed
端子形式THROUGH-HOLE
端子位置SINGLE
处于峰值回流温度下的最长时间40
晶体管应用AMPLIFIER
晶体管元件材料SILICON
标称过渡频率 (fT)1 MHz
Base Number Matches1

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MJE700G, MJE702G,
MJE703G (PNP), MJE800G,
MJE802G, MJE803G (NPN)
Plastic Darlington
Complementary Silicon
Power Transistors
These devices are designed for general−purpose amplifier and
low−speed switching applications.
Features
http://onsemi.com
High DC Current Gain − h
FE
= 2000 (Typ) @ I
C
= 2.0 Adc
Monolithic Construction with Built−in Base−Emitter Resistors to
Limit Leakage − Multiplication
Choice of Packages − MJE700 and MJE800 Series
These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
MJE700G, MJE800G
MJE702G, MJE703G, MJE802G,
MJE803G
Collector−Base Voltage
MJE700G, MJE800G
MJE702G, MJE703G, MJE802G,
MJE803G
Emitter−Base Voltage
Collector Current
Base Current
Total Power Dissipation
@ T
C
= 25_C
Derate above 25_C
Operating and Storage Junction
Temperature Range
Symbol
V
CEO
60
80
V
CB
60
80
V
EB
I
C
I
B
P
D
40
0.32
T
J
, T
stg
–55 to +150
W
mW/_C
_C
5.0
4.0
0.1
Vdc
Adc
Adc
Vdc
Value
Unit
Vdc
4.0 AMPERE
DARLINGTON POWER
TRANSISTORS
COMPLEMENTARY SILICON
40 WATT
NPN
COLLECTOR 2, 4
BASE
3
PNP
COLLECTOR 2, 4
BASE
3
EMITTER 1
MJE800
MJE802
MJE803
EMITTER 1
MJE700
MJE702
MJE703
TO−225
CASE 77−09
STYLE 1
1 2
3
MARKING DIAGRAM
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
YWW
JEx0yG
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
Symbol
R
qJC
R
qJA
Max
3.12
83.3
Unit
_C/W
_C/W
Y
= Year
WW
= Work Week
JEx0y = Device Code
x = 7 or 8
y = 0, 2, or 3
G
= Pb−Free Package
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
1
December, 2013 − Rev. 12
Publication Order Number:
MJE700/D
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