MEPIC
www.vishay.com
Vishay Sfernice
Massive Electro-Pyrotechnic Initiator Chip Resistor
FEATURES
• Surface Mount Design for standard assembly
process
Available
• SMD version only
• Active area designed upon performances
Available
• Case size 0805
• Firing energy down to 1.0 mJ
(1)
• Firing time down to 250 μs
• Ohmic value: 1
to 8
± 10 % (typical)
(2)
• Joule effect ignition
• Easy set up by design of firing levels
• Very predictable, reproducible and reliable behavior
• Compatibility with pyrotechnic element has to be tested in
real environment
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Notes
* This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
(1)
Ignitor performances are dependent on both pyrotechnic primer
chemistry and active areas geometry
(2)
For ohmic value < 3
the tolerance will be discussed with Vishay
Sfernice
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
The Massive Electro-Pyrotechnic Initiator Chips (MEPIC) are
resistors dedicated to pyrotechnic applications. The MEPIC
resistors are the Surface Mount Device (SMD) variants from
the established NiCr on FR type substrate technology from
Vishay Sfernice. The standard case geometry (SMD)
enables the implementation of assembly process commonly
used in the electronic component industry (pick and place,
reflow soldering on flat PCB used as header) providing high
productivity. The principle of MEPIC is to convert electrical
energy into heat in a precise electro-thermal profile for the
purpose of initiating a series of pyrotechnic events in a
controlled energetic reaction. In the mining industry this
effect is commonly used for the ignition of electronic
detonators (digital blasting). Other industries such as
firework (e-match manufacturing) and demolition (various
electric detonators) are also focused applications.
The MEPIC design has been developed specifically to offer
an alternative to the Bridge Wire (BW) technology, insuring
at least the same level of performances, while providing cost
efficient assembly process and initiator design alternatives.
TECHNOLOGY
The MEPIC active area (heating zone) will be impregnated by the user with a primary pyrotechnic material (usually wet primer
followed by drying) in such way to ensure an intimate contact for an optimum heat transfer of thermal energy. The geometry of
the active area of the MEPIC, and both the primer chemistry and its impregnation method, will determine the global
performances. Note that the active area of MEPIC shall not be put in direct contact with explosive powder as grain size will not
ensure intimate contact and will induce non reproducible and non reliable performances.
The two main characteristics of a MEPIC resistor are their “All Fire” (AF) and “No Fire” (NF) performances:
- “All Fire” (AF) represents the command pulse where the major amount of the dissipated energy will be transferred to the primer
to generate the ignition. Customer will have to provide Vishay Sfernice with “All Fire” conditions, usually with capacitance
discharge parameters or with Minimum Current or Voltage and corresponding short pulse duration.
- “No Fire” (NF) represents the immunity of the resistor with primer to the environmental electro-magnetic pollution and electric
continuity test, where the major amount of the dissipated energy will be transferred to the substrate to ensure no ignition.
Customer will have to provide Vishay Sfernice with “No Fire” conditions, usually maximum current or voltage and
corresponding longest duration. In case of applicable capacitance discharge test the parameters shall also be provided.
ASSEMBLY PRECAUTIONS
In order to obtain reproducible ignition performances it is important that the assembly process fulfills the following criteria:
- Do not use iron soldering method to mount the MEPIC on its header because uncontrolled amount of solder could impact the
heat transfer (potential misfire or ignition delay) and local over heating may damage the MEPIC (deformation that may cause
active area cracks).
- Take specific precautions , such as no air bubble during preparation and application of primer, in order to ensure the intimate
contact of pyrotechnic primer and MEPIC active area (potential misfire).
- Take specific handling precaution in order not to damage MEPIC active area (ex: pickup head design for pick and place or
specific fixing tools in the entire assembly process.
- All along the assembly process, take specific care to extreme thermo-mechanic stress that could be applied to the MEPIC
(such as stress induced during over molding) because the active area of MEPIC is subjected to crack (and generate unstable
resistance value).
- The MEPIC reliability is only guaranteed for one single reflow profile.
- In case of necessity to dismantle a MEPIC, another MEPIC must be used (no rework is allowed).
- Pay specific attention to the cleaning process after reflow soldering in order not to damage the active area and to keep it clean
from various pollutions.
Revision: 17-Nov-17
Document Number: 53058
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MEPIC
www.vishay.com
Vishay Sfernice
RESISTANCE RANGE
1 to 8
RESISTANCE TOLERANCE
%
10 to 30
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
MEPIC (SMD)
SIZE / CASE
DESIGNATION
(1)
0805
Note
(1)
Detailed dimensions are specified in Dimensions and Tolerances table
RANGE OF IGNITION PERFORMANCES
MODEL
MEPIC (SMD)
“NO FIRE”
CURRENT
A
0.5 to 1.2
“NO FIRE”
DURATION
s
2 to 10
“ALL FIRE”
CURRENT
A
Down to 1
IGNITION
TIME
ms
Down to 0.25
“ALL FIRE”
ENERGY
μJ
Down to 1000
Note
• Ignition performances are dependent on both pyrotechnic primer chemistry and active area geometry
DIMENSIONS AND TOLERANCES
in millimeters (inches)
MODEL
SIZE / CASE
DESIGNATION
0805
WIDTH
W
2.00 ± 0.15
(0.080 ± 0.006)
LENGTH
L
1.25 ± 0.10
(0.050 ± 0.004)
THICKNESS
T
0.6 ± 0.1
(0.024 ± 0.004)
INSULATION
DISTANCE
I
-
BACK SIDE
PADS
P
0.45 ± 0.15
(0.018 ± 0.006)
ACTIVE AREA
WIDTH
TOLERANCE
A
± 0.01
(± 0.0004)
MEPIC (SMD)
CONSTRUCTION
NiCr active area
Tin or Silver
Copper
NiCr
Copper
Substrate
Tin or Silver
Substrate
• Substrate: epoxy based (FRx type)
• Resistive element: NiCr
• Terminations: SMD wraparound
• Tin plated copper or silver plated copper
Revision: 17-Nov-17
Document Number: 53058
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MEPIC
www.vishay.com
HOW TO GET THE RIGHT MEPIC
Each MEPIC will have to be adapted to customer pyrotechnic primer chemistry (energetic material). To reach the right MEPIC
design it is necessary to work by “iterations”. Upon receipt of the MEPIC Design Guide duly filled, an initial sampling lot is given
to customer (along with a MEPIC reference) so he can provide “No Firing” / “All Firing” performances obtained after first testing.
After the analysis of these first test results a new set of samples will be proposed (eventually tooling charges will be necessary)
in order to get closer to the customer requirements. It may be several iterations until the right design is found. It may also happen
that all requirements cannot be fulfilled simultaneously and then a compromise will be necessary between MEPIC design and
customer pyrotechnic primer chemistry or ignition parameters.
When the iterations are finished, which means that the design is validated with total or partial requirements fulfilled, Vishay
Sfernice will design a final set of photomasks for serial production.
Vishay Sfernice
ORDERING PROCEDURE
Global Part Numbering: MEPICxxxxWTT
M
E
P
I
C
x
x
x
x
W
T
T
MODEL
MEPIC
xxxx
Determined at design
step
TERMINATION
TYPE
W:
wraparound
TERMINATION
MATERIAL
(1)
T
= tin
S
= silver,
please consult
PACKAGING
(2)
T
= tape and reel
(plastic tape)
W
= waffle pack
B
= bag
Notes
• MEPIC being a semi-custom product, please fill EPIC / MEPIC Design Guide (www.vishay.com/doc?53045) and send to
sferthinfilm@vishay.com
to get appropriate part number
(1)
Silver termination finish valid for both reflow soldering and conductive gluing. Tin termination finish only valid for reflow soldering
(2)
Customer assembly process requirement:
- Waffle pack for manual placing on PCB
- Tape and reel for automatic pick and place
- Bag for bowl feeding
Revision: 17-Nov-17
Document Number: 53058
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
1
Document Number: 91000
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