电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-B0202AA-00-2430-G

产品描述Resistor Networks u0026 Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
下载文档 详细参数 全文预览

WBC-B0202AA-00-2430-G在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-B0202AA-00-2430-G - - 点击查看 点击购买

WBC-B0202AA-00-2430-G概述

Resistor Networks u0026 Arrays

WBC-B0202AA-00-2430-G规格参数

参数名称属性值
产品种类
Product Category
Resistor Networks & Arrays
制造商
Manufacturer
TT Electronics plc

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
stm32 usart不能发数,使用查询方法
公司的板子是,485 通讯,使用stm32f103re,USART1通讯,485使用端口GPIOA PIN11,USART_RX对应GPIOA PIN10,USART_TX 对应GPIOA PIN9不知为什么,我现在只是做了一个要放数据的程序,可是就是无 ......
paperhappy stm32/stm8
运放加MOS组成的恒流源原理?
如下图一,运放加MOS管组成的恒流源,调节电阻器R4的阻值,改变运放U1A的3脚的电压值(不大于2V),运放2脚的电压值随之变动,运放的输出也在变化。问题:运放的正向反向端的电压相同,这运放的输 ......
平漂流 模拟电子
Understanding MIMO Antennas: Part 2
With MIMO, systems use multiple transmit and multiple receive antennas. Looking at various MIMO techniques (specifically the receive techniques) that use different approaches to an ......
tmily 无线连接
STM8S+ULN2003+5VDC 4相5线电机 只抖动不转动
程序如: INT8U F_Rotation={0x02,0x04,0x08,0x10};//正转表格 GPIO_Init( GPIOB, GPIO_PIN_4|GPIO_PIN_1|GPIO_PIN_2|GPIO_PIN_3, GPIO_MODE_OUT_PP_HIGH_SLOW ); //PB的1234作为输出接UN ......
geyang1111 stm32/stm8
C语言中的求2幂次的函数
如题,C语言中有没有那样的函数,比如我给出16,2的4次方是16,4就是我想要的,有没有函数能帮我把4算出来的?...
huangl53 编程基础
微指令操作流程
问个微指令操作流程的 ADD Rd,disp.指令为双子长指令。disp为位移量。指令的操作流程图如下: 1.pc->MAR,M->MDR,MDR->IR,PC+1; 2.pc->MAR,M->MDR,MDR->MAR,PC+1; 3.M->MDR,MDR->A, ......
wzp9999 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2660  1876  434  621  1231  5  25  7  39  28 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved