MLCC
Non-magnetic Surface Mount Standard
MLC Capacitors
Electrical Details
Capacitance Range
Temperature Coefficient of
Capacitance (TCC)
C0G/NP0
& HiQ
X7R
C0G/NP0
& HiQ
X7R
Insulation Resistance (IR)
Dielectric Withstand Voltage (DWV)
C0G/NP0
& HiQ
X7R
0.1pF to 6.8µF
0 ± 30ppm/˚C
±15% from -55
o
C to +125
o
C
Cr > 50pF ≤0.0015
Cr ≤ 50pF = 0.0015(15÷Cr+0.7)
≤ 0.025
100G or 1000secs (whichever is the less)
Voltage applied for 5 ±1 seconds, 50mA
charging current maximum
Zero
<2% per time decade
Non-magnetic MLCC Ranges
The use of a copper barrier instead of a nickel barrier,
with a tin finish on top is the solution Syfer has
developed for non-magnetic applications.
This Non-magnetic termination is offered with selected
non-magnetic C0G/NP0, High Q and X7R dielectrics,
providing a fully non-magnetic component (μr=1.0000).
To meet high temperature 260ºC soldering reflow
profiles as detailed in J-STD-020, C0G/NP0 dielectrics
are supplied with FlexiCap™ or sintered termination and
X7R dielectrics are supplied with Syfer’s award winning
FlexiCap™ termination. HighQ dielectrics are supplied
with sintered termination.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.0 ± 0.10
0.04 ± 0.006
1.6 ± 0.2
0.063 ± 0.008
1.4 ± 0.38
0.055 ± 0.015
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.03
0.126 ± 0.012
2.79 +0.51 -0.25
0.110 +0.020 -0.010
3.2 ± 0.03
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
Width
(W)
mm/inches
0.5 ± 0.10
0.02 ± 0.003
0.8 ± 0.2
0.031 ± 0.008
1.4 ± 0.38
0.055 ± 0.015
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.79 ± 0.38
0.110 ± 0.015
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
Max. Thickness
(T)
mm/inches
0.60
0.024
0.8
0.031
1.27
0.050
1.3
0.051
1.6
0.063
2.54
0.100
2.0
0.08
2.0
0.08
2.5
0.1
4.2
0.16
4.2
0.16
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.10
0.004
0.13
0.005
0.13
0.005
0.25
0.01
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
max
0.40
0.015
0.40
0.015
0.50
0.020
0.75
0.03
0.75
0.03
0.63
0.025
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
Size
0402*
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
Ordering Information – Non-magnetic capacitors
1210
Chip Size
0402*
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
3
Termination
2
= Sintered silver
base with copper
barrier (100% matte
tin plating). RoHS
compliant. (Available
on C0G/NP0 & High Q
only)
3
= FlexiCap
base with copper
barrier (100% matte
tin plating). RoHS
compliant (Available
on C0G/NP0 & X7R
only)
TM
100
Rated Voltage
016
= 16V
025
= 25V
050
= 50V
063
= 63V
100
= 100V
150
= 150V
200
= 200V
250
= 250V
500
= 500V
630
= 630V
1K0
= 1kV
1K2
=1.2kV
1K5
=1.5kV
2K0
= 2kV
3K0
=3kV
0103
Capacitance in Pico
farads (pF)
<10pF
Insert a P for the decimal
point as the second
character.
e.g.,
P300
= 0.3pF
8P20
= 8.2pF
≥10pF
First digit is 0.
Second and third digits are
significant figures of
capacitance code.
The fourth digit is the
number of zeros following.
e.g.,
0103
= 10000 pF
Values <1pF in 0.1pF steps,
above this values are E24
series
J
Capacitance
Tolerance
<4.7pF
H:
± 0.05pF
B:
± 0.10pF
C:
± 0.25pF
D:
± 0.5pF
≥4.7pF <10pF
B:
± 0.10pF
C:
± 0.25pF
D:
± 0.5pF
≥10pF
F:
± 1%
G:
± 2%
J:
± 5%
K:
± 10%
X
Dielectric
Codes
C
= C0G/NP0
(1B)
Q
= High Q
X
= X7R
(2R1)
T
Packaging
T
= 178mm
(7”) reel
R
= 330mm
(13”) reel
B
= Bulk pack
– tubs or trays
Suffix Code
Used for specific
customer
requirements
4
= Sintered silver
base with copper
barrier (tin/lead
plating). Non RoHS
compliant. (Available
on C0G/NP0 & High Q
only)
5
= FlexiCap
TM
base with copper
barrier (tin/lead
plating). Non RoHS
compliant (Available
on C0G/NP0 & X7R
only)
*0402 – please consult the sales office for availability
© Knowles 2014
Non-magneticDatasheet Issue 5 (P110717) Release Date 02/12/15
Page 1 of 8
Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer
C0G/NP0 & High Q - minimum/maximum capacitance values
Chip Size
Min Cap
Min Cap
Tolerance
50V/63V
100V
150V
200V/250V
300V
500V
630V
1000V
2000V
3000V
22pF
15pF
10pF
6.8pF
-
-
-
-
-
-
100pF
68pF
47pF
33pF
27pF
-
-
-
-
-
220pF
150pF
100pF
56pF
47pF
-
-
-
-
-
0402*
0.1pF
0603
0.1pF
0505
0.2pF
0805
0.2pF
1206
0.5pF
1111/
1210
0.3pF
1808
1.0pF
1812
1.0pF
2220
2.0pF
2225
2.0pF
±0.05pF (<4.7pF), 0.1pF (≥4.7pF & <10pF) and ±1% (≥10pF)
470pF
330pF
220pF
150pF
120pF
68pF
-
-
-
-
1.5nF
1.0nF
680pF
470pF
390pF
270pF
150pF
82pF
18pF
-
-
2.2nF
1.5nF
1.0nF
820pF
680pF
390pF
220pF
68pF
-
-
2.2nF
1.5nF
1.0nF
820pF
680pF
390pF
220pF
68pF
-
-
4.7nF
3.3nF
2.2nF
1.8nF
1.5nF
1.0nF
680pF
150pF
68pF
-
10nF
6.8nF
4.7nF
3.9nF
3.3nF
2.2nF
1.5nF
470pF
150pF
-
15nF
10nF
6.8nF
5.6nF
4.7nF
3.3nF
2.2nF
560pF
220pF
For values < than 0.3pF please consult the Sales Office for availability.
*0402 - please consult the sales office for availability.
X7R - minimum/maximum capacitance values
Chip Size
MinCap
Min Cap
Tolerance
16V
25V
50V63V
100V
200V250V
500V
630V
1000V
1200V
1500V
2000V
10nF
6.8nF
4.7nF
1.5nF
680pF
-
-
-
-
-
-
100nF
68nF
47nF
10nF
5.6nF
1.5nF
-
-
-
-
-
330nF
220nF
150nF
47nF
27nF
8.2nF
4.7nF
3.3nF
-
-
-
1.0μF
820nF
470nF
150nF
100nF
33nF
10nF
4.7nF
3.3nF
2.7nF
2.2nF
0402*
47pF
0603
100pF
0805
330pF
1206
680pF
1111/
1210
1.5nF
±5%
1.5μF
1.2μF
1.0μF
470nF
220nF
100nF
27nF
15nF
10nF
6.8nF
4.7nF
1.5μF
1.2μF
680nF
330nF
180nF
100nF
33nF
18nF
10nF
6.8nF
4.7nF
3.3μF
2.2μF
1.5μF
1.0μF
470nF
270nF
150nF
56nF
33nF
22nF
10nF
5.6μF
4.7μF
3.3μF
1.5μF
1.0μF
560nF
330nF
120nF
82nF
47nF
27nF
6.8μF
5.6μF
3.3μF
1.5μF
1.0μF
680nF
390nF
150nF
100nF
68nF
33nF
1808
2.2nF
1812
3.3nF
2220
6.8nF
2225
10nF
*0402 - please consult the sales office for availability.
Reeled Quantities
Chip Size
7” Reel
13” Reel
0402*
5000
0603
4000
0505
2500
0805
3000
1206
2500
11111210
10002000
1808
2000
8000
1812
500/1000
2000/4000
2220
500/1000
2000/4000
2225
500/1000
2000/4000
13” reel quantities available on request
*0402 - please consult the sales office for availability.
Note: Other capacitance values may become available, please contact our Sales Office if you need values other than those shown
in the above tables.
For dimensions and soldering information, please go to our website (www.syfer.com) or see our MLC catalogue.
© Knowles 2014
Non-magneticDatasheet Issue 5 (P110717) Release Date 02/12/15
Page 2 of 8
Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer
Typical performance data - 0805 chip size
Typical performance data - 1111 chip size
© Knowles 2014
Non-magneticDatasheet Issue 5 (P110717) Release Date 02/12/15
Page 3 of 8
Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer
Soldering Information
Syfer MLCCs are compatible with all recognised
soldering/mounting methods for chip capacitors. A detailed
application note is available at syfer.com
Reflow Soldering
Syfer recommend refloe soldering as the preferred method for
mounting MLCCs. Syfer MLCCs can be reflow soldered using a
reflow profile generally defined in IPC/FEDEC J-STD-020. Sn
plated termination chip capacitors are compatible with both
conventional and lead free soldering with peak temperatures of
260º to 270ºC acceptable.
The heating ramp rate should be such that components see a
temperature rise of 1.5º to 4ºC per second to maintain
temperature uniformity through the MLCC.
The time for which the solder is molten should be maintained
at a minimum, so as to prevent solder leaching. Extended
times above 230ºC can cause problems with oxidation of Sn
plating. Use of an inert atmoshere can help if this problem is
encountered. Palladium/Silver (Pd/Ag) terminations can be
particularly susceptible to leaching with free lead, tin rich
solders and trials are recommended for this combination.
Cooling to ambient temperature should be allowed to occur
naturally, particularly if larger chip sizes are being soldered.
Natural cooling allows a gradual relaxation of thermal
mismatch stresses in the solder joints. Forced cooling should
be avoided as this can induce thermal breakage.
Wave Soldering
Wave soldering is generally acceptable, but the thermal
stresses caused by the wave have been shown to lead to
potential problems with larger or thicker chips. Particular care
should be taken when soldering SM chips larger than size 1210
and with a thickness greater than 1.0mm for this reason.
Maximum permissable wave temperature is 270ºC for SM
chips.
The total immersion time in solder should be kept to a
minimum. It is strongly recommended that Sn/Ni plated
terminations are specified for wave soldering applications.
Solder Leaching
Leaching is the term for the dissolution of silver into the solder
causing a failure of the termination system which causes
increased ESR, tan δ and open circuit faults, including
ultimately the possibility of the chip becoming detached.
Leaching occurs more readily with higher temperature solders
and solders with a high tin content. Pb free solders can be very
prone to leaching certain termination systems. Ro prevent
leaching, exercise care when choosing solder allows and
minimize both maximum temperature and dwell time with the
molten solder.
Plated terminations with nickel or copper anti-leaching barrier
layers are available in a range of top coat finishes to prevent
leaching occurring. These finishes also include Syfer FlexiCap
TM
for improved stress resistance post soldering.
Multilayer ceramic chip with nickel or copper barrier
termi
natio
n
Rework of Chip Capacitors
Syfer recommend hot air/gas as the preferred method of
applying heat for rework. Apply even heat surrounding the
component to minimise internal thermal gradients. Soldering
irons or other techniques that apply direct heat to the chip or
surrounding area, should not be used as these can result in
micro cracks being generated.
Minimise the rework heat duration and allow components to
cool naturally after soldering.
Use of Silver Loaded Epoxy Adhesives
Chip capacitors can be mounted to circuit boards using silver
loaded adhesive provided the termination material of the
capacitor is selected to be compatible with the adhesive. This
is normally PdAg. Standard tin finishes are often not
recommended for use with silver loaded epoxies as there can
be electrical and mechanical issues with the joint integrity due
to material mismatch.
Handling & Storage
Components should never be handled with fingers;
perspiration and skin oils can inhibit solderability and will
aggravate cleaning.
Chip capacitors should never be handled with metallic
instruments. Metal tweezers should never be used as theses
can chip the product and leave abraded metal tracks on the
product surface. Plastice or plastic coated metal types are
readily available and recommended – these should be used
with an absolute minimum of applied pressure.
Incorrect storage can lead to problems for the user. Rapid
tarnishing of the terminations, with an associated degradation
of solderability, will occur if the product comes into contact
with industrial gases such as sulphur dioxide and chlorine.
Storage in free air, particularly moist or polluted air, can result
in termination oxidation.
Packaging should not be opened until the MLCs are required
for use. If opened, the pack should be re-sealed as soon as
practicable. Alternatively, the contents could be kept in a
sealed container with an envirinmental control agent.
Long term storage conditions, ideally, should be temperature
controlled between -5º and +40ºC and humidity controlled
between 40 and 60% R.H.
Taped product should be stored out of direct sunlight, which
might promote deterioration in tape or adhesive performance.
Product, store under the conditions recommended above, in its
“as received” packaging, has a minimum shelf life of 2 years.
SM Pad Design
Syfer conventional 2-terminal chip capacitors can generally be
mounted using pad designs in accordance with IPC-7351,
Generic Requirements for Surface Mount Design and Land
Pattern Standards, but there are some other factors that have
been shown to reduce mechanical stress, such as reducing the
pad width to less than the chip width. In addition, the position
of the chip on the board should also be considered.
3-terminal components are not specifically covered by IPC-
7351, but recommended pad dimensions are included in the
Syfer catalogue/website for these components.
© Knowles 2014
Non-magneticDatasheet Issue 5 (P110717) Release Date 02/12/15
Page 4 of 8
Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer
FlexiCap
TM
Termination
FlexiCap
TM
has been developed as a result of listening to
customer’s experiences of stress damage to MLCCs fom many
manufacturers, often caused by variations in production
processes.
Our answer is a proprietary flexible epoxy polymer termination
material, that is applied to the device under the usual nickel
barrier finish. FlexiCap
TM
will accommodate a greater degree of
boardbending than conventional capacitors.
REACH (Registration, Evaluation, Authorisation and
restriction of Chemicals) Statement
The main purpose of REACH is to improve the protection of
human health and the environment from the risks arising from
the use of chemicals.
Syfer Technology Ltd maintains both ISO 14001,
Environmental Management System and OHSAS 18001 Health
& Safety Management System approvals that require and
ensure compliance with corresponding legislation such as
REACH.
For further information, please contact the sales office at
SyferSales@knowles.com
All ranges are available with FlexiCap
TM
termination material
offering increased reliability and superior mechanical
performance (board flex and temperature cycling) when
compared with standard termination materials. Refer to Syfer
application note reference AN0001. FlexiCap
TM
capacitors
enable the board to be bent almost twice as much as before
mechanical cracking occurs. Refer to application note AN0002.
FlexiCap
TM
is also suitable for space applications having passed
thermal vacuum outgassing tests. Refer to Syfer application
note reference AN0026.
RoHS Compliance
Syfer routinely monitors world wide material restrictions (e.g.,
EU/China and Korea RoHS mandates) and is actively involved
in shaping future legislation.
All standard C0G/NPO, X7R, X5R and High Q Syfer MLCC
products are compliant with the EU RoHS directive (see below
for special exemptions) and those with plated terminations are
suitable for soldering common lead free solder alloys (refer to
‘Soldering Information’ for more details on soldering
limitations). Compliance with EU RoHS directive automatically
signifies compliance with some other legislation (e.g., Korea
RoHS). Please refer to the Sales Office for details of
compliance with other materials legislation.
Breakdown of material content, SGS analysis reports and tin
whisker test results are available on request.
Most Syfer MLCC components are available with non-RoHS
compliant tin/lead (SnPb) Solderable termination finish for
exempt applications and where pure tin is not acceptable.
Other tin free termination finishes may also be available –
please refer to the Sales Office for further details.
X8R ranges <250Vdc are not RoHS 2011/65/EU compliant.
Syfer has delivered millions of FlexiCap
TM
components and
during that time has collected substantial test and reliability
data, working in partnership with customers world wide, to
eliminate mechanical cracking.
An additional benefit of FlexiCap is that MLCCs can withstand
temperature cycling from -55
o
to 125
o
C in excess of 1,000
times without cracking.
TM
Check the website, www.knowlescapacitors.com/syfer for
latest RoHS update.
Export Controls and Dual-use Regulations
Certain Syfer catalogue components are defined as ‘dual-use’
items under international export controls – those that can be
used for civil and military purposes which meet certain
specified technical standards.
The defining criteria for a dual-use component with respect to
Syfer products is one with a voltage rating of >750V and a
capacitance value >250nF and a series inductance <10nH.
Components defined as ‘dual-use’ under the above criteria
automatically require a licence for export outside the EU, and
may require a licence for export with the EU.
The application for a licence is routine, but customers for these
products will be asked to supply further information.
Please refer to the sales office if you require any further
information on export restrictions.
Other special components may additionally need to comply
with export regulations.
FlexiCap
TM
termination has no adverse effect on any electrical
parameters, nor affects the operation of the MLCC in any way.
Application Notes
FlexiCap
TM
may be handled, stored and transported in the
same manner as standard terminated capacitors. The
requirements for mounting and soldering FlexiCap
TM
are the
same as for standard SMD capacitors.
For customers currently using standard terminated capacitors
there should be requirement to change the assembly process
when converting to FlexiCap
TM
.
Based upon the board bend tests in accordance with IEC
60384-1 the amount of board bending required to
mechanically crack a FlexiCap
TM
terminated capacitor is
significantly increased compared with standard terminated
capacitors.
Product: X7R
Standard
Termination
FlexiCap
TM
Typical bend performance under
AEC-Q200 test conditions
2mm to 3mm
Typically 8mm to 10mm
© Knowles 2014
Non-magneticDatasheet Issue 5 (P110717) Release Date 02/12/15
Page 5 of 8
Tel: +44 1603 723300 | Email SyferSales@knowles.com | www.knowlescapacitors.com/syfer
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