TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-100
REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
1 of 13
AUTHORIZED BY
DATE
R
14 Oct 2013
D. Horchler
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality, and reliability requirements of the MEG-Array , FCI’s
1.27mm x 1.27mm Grid High Density Connector System
2.0
SCOPE
This specification applies to the MEG-Array 1.27mm x 1.27mm Grid High Density Connector System which
provides for parallel interconnection of printed wiring boards in low power applications. It covers product
offerings of Eutectic SnPb BGA as well as Lead Free BGA that meets the requirements of the European Union
Directive of Restrictions for Hazardous Substances (Directive 2002/95/EC). On the contact interface end, it
covers precious metal plating thicknesses of 0.4 microns (15µ”), 0.8 microns (30µ”) and 1.27 microns (50µ”)
3.0
GENERAL
PARAGRAPH
1.0
2.0
3.0
4.0
5.0
5.1
5.2
5.3
5.4
6.0
7.0
8.0
9.0
9.1
9.2
9.3
TITLE
Objective
Scope
General
Applicable Documents
Requirements
Qualification
Material
Finish
Design and Construction
Electrical Characteristics
Mechanical Characteristics
Environmental Conditions
Quality Assurance Provisions
Equipment Calibration
Inspection Conditions
Sample Quantities and Description
And Qualification Testing Sequences
4.0
APPLICABLE DOCUMENTS
4.1 DRAWINGS & APPLICATION NOTE
4.1.3
81
Position
4.0mm
mated height
4.1.4
100
Position
4.0mm
mated height
4.1.5
200
Position
4.0mm
mated height
4.1.6
200
Position
6.0mm
mated height
4.1.7
200
Position
8.0mm
mated height
4.1.8
200
Position
10.0mm
mated
height
4.1.9
200
Position
12.0mm
mated
height
4.1.10
200
Position
14.0mm
mated
height
4.1.11
240
Position
4.0mm
mated height
55714 Plug
84512 Plug
84516 Plug
84516 Plug
84516 Plug
84530 Plug
84530 Plug
84530 Plug
74213 Plug
55715 Receptacle
84513 Receptacle
84517 Receptacle
55724 Receptacle
84535 Receptacle
84517 Receptacle
55724 Receptacle
84535 Receptacle
74217 Receptacle
GS-01-001
PDS: Rev :R
STATUS:Released
Printed: Oct 16, 2013
Copyright
Form E-3334
Rev E
FCI
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-100
REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
2 of 13
AUTHORIZED BY
DATE
R
14 Oct 2013
D. Horchler
CLASSIFICATION
UNRESTRICTED
4.1.12
4.1.13
4.1.14
4.1.15
4.1.16
4.1.17
4.1.18
4.1.19
4.1.20
4.1.21
4.1.22
4.1.23
4.1.24
4.1.25
4.1.26
4.1.27
4.2
240
Position
6.0mm
mated height
300
Position
4.0mm
mated height
300
Position
5.50mm
mated
height
300
Position
8.0mm
mated height
300
Position
10.0mm
mated
height
300
Position
11.5mm
mated
height
300
Position
14.0mm
mated
height
320
Position
4.0mm
mated height
400
Position
4.0mm
mated height
400
Position
6.0mm
mated height
400
Position
8.0mm
mated height
400
Position
10.0mm
mated
height
400
Position
12.0mm
mated
height
400
Position
14.0mm
mated
height
528
Position
6.0mm
mated height
Application Spec
GS-20-033
74213 Plug
84500 Plug
84500 Plug
84500 Plug
84578 Plug
84578 Plug
84578 Plug
10123981 Plug
84740 Plug
84740 Plug
84740 Plug
84520 Plug
84520 Plug
84520 Plug
10022671 Plug
55755 Receptacle
84501 Receptacle
84502 Receptacle
84553 Receptacle
84501 Receptacle
84502 Receptacle
84553 Receptacle
10123982 Receptacle
74221 Receptacle
74388 Receptacle
74390 Receptacle
74221 Receptacle
74388 Receptacle
74390 Receptacle
10026846 Receptacle
OTHER STANDARDS AND SPECIFICATIONS
4.2.1 UL-94: Flammability
4.2.2 EIA 364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
4.2.3 ASTM B122: Copper-Nickel-Tin Alloy
4.2.4 ASTM B194: Beryllium Copper Alloy
4.2.5 ASTM D5138: Std Specification for Liquid Crystal Polymers
4.2.6 ANSI/J-STD-005: Requirements for Soldering Pastes
4.2.7 ANSI/J-STD-004: Requirements for Soldering Fluxes
4.2.8 IEC 68-2-60 Ke: Flowing mixed gas Corrosion Test
4.2.9 ANSI-J-002: Solderability Tests for Component Leads, Terminations, Lugs, Terminals & Wires
(paragraph 3.4.2 Steam Aging)
4.2.10 EIA-638 - Surface Mount Solderability Test
4.2.12 Telcordia GR-1217-Core
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDS: Rev :R
STATUS:Released
Printed: Oct 16, 2013
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-100
REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
3 of 13
AUTHORIZED BY
DATE
R
14 Oct 2013
D. Horchler
CLASSIFICATION
UNRESTRICTED
4.3
FCI SPECIFICATIONS
4.3.1
4.3.2
4.3.3
4.3.5
GS-15-0111: Nickel Plating
GS-15-012: Gold Plating
GES-14-455: Packaging of MEG-Array Product
BUS-19-125; MEG-Array Conn. 3 Point Bend Test Procedure
4.3.4 BUS-19-124: Solderball to Terminal Tensile Test Procedure
4.3.11 GS-18-015: Product Quality Plan
4.3.12 BUS-03-601: Current Rating
4.4
FCI LAB REPORTS - SUPPORTING DATA
4.4.1 EL-97-12-057: MEG Array Connector Qualification
4.4.3 EL-98-03-007A: 400 Pos. MEG Array Recept. Development Testing
4.4.4 EL-98-02-072: 3.4mm 240 Pos Recept. Durability & Hi Temp Life
4.4.5 EL-98-02-102: 4.0mm 400 Pos Recept. 3-Point Bend
4.4.6 EL-98-04-031
CR
: 4.0mm 240 Pos Temp Cycle
4.4.7 EL-98-05-079: 240, 4.0mm Zipper Mating Forces
4.4.8 EL-98-12-069: 4.0mm, 400 Position Temp Cycling
4.4.9 EL-2003-10-09: Mating/Unmating Forces of 80, 81, 100 & 528 Positions
4.4.10 EL-2004-01-003C Lead Free BGA Temperature cycling
4.4.11 EL2012-03-007 Qualification of GXT Plating on MEG-Array
4.4.12 EL2012-03-008 Qualification of GXT Plating on MEG-Array
5.0
REQUIREMENTS
5.1
QUALIFICATION Connectors furnished under this specification shall be products that are capable of
meeting the qualification test requirements specified herein.
MATERIAL The material for each part shall be as specified herein, or equivalent. Substitute material
shall meet the performance requirements of this specification.
5.2.1 Receptacle Terminal. The base material shall be beryllium copper alloy strip.
5.2.2 Plug Terminal. The base material shall be copper-nickel-tin alloy strip.
5.2.3 Plug and Receptacle Insulator Housing. The insulators shall be molded of liquid crystal polymer
that is rated 94V-0 or better in accordance with UL-94.
5.2
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDS: Rev :R
STATUS:Released
Printed: Oct 16, 2013
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-100
REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
4 of 13
AUTHORIZED BY
DATE
R
14 Oct 2013
D. Horchler
CLASSIFICATION
UNRESTRICTED
5.2.4 Solder Balls. Solder alloy 63 Tin/37 Lead or Lead Free 95.5Sn/4Ag/.5Cu
5.2.5 Solder Paste. Modified low resin content, no clean, with 63SN/37PB solder or Lead Free
95.5Sn/4Ag/.5Cu solder.
5.3
FINISH The plug and receptacle terminals have several plating options including Au and GXT over
Ni and in various thicknesses from 0.4 µm min. to 1.27µm. See table paragraphs 8.4 and 8.5 for correlation of
plating thicknesses to test performances.
5.4 DESIGN AND CONSTRUCTION. The connector shall be a multi-piece assembly having an array of
contacts with solder balls attached, for installation on surface mount printed wiring boards or flexible
circuits.
5.4.1 Mating. The connector shall be capable of mating and unmating manually without the use of
special tools.
6.0
Electrical Characteristics
6.1 Contact Resistance, Low Level (LLCR) - The initial low level contact resistance shall not exceed (See List)
milliohms, with a max.10 milliohms change after environmental exposure, when measured in accordance
with EIA 364-23. The following details shall apply:
a) Initial Resistance for each mated height:
Mated Height
3.4mm
4.0mm
5.5mm
6.0mm
8.0mm
10.0mm
12.0mm
14.0mm
b)
c
d)
6.2
Initial LLCR
20mΩ
20mΩ
22mΩ
23mΩ
25mΩ
30mΩ
33mΩ
37mΩ
Attach current and voltage leads as shown in
Figure.
20 millivolts DC max open circuit
Not to exceed 100 milliamperes.
Method of Connection:
Test Voltage:
Test Current:
Insulation Resistance – The insulation resistance of mated connectors shall not be less than 1000
megohms (1000 megohms after environmental exposure) when measured in accordance with EIA
364-21. The following details shall apply:
a)
b)
c)
Test Voltage – 200 volts DC.
Electrification Time – 2 minutes, unless otherwise specified.
Points of Measurement – Between adjacent and opposing contacts.
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDS: Rev :R
STATUS:Released
Printed: Oct 16, 2013
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-100
REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
5 of 13
AUTHORIZED BY
DATE
R
14 Oct 2013
D. Horchler
CLASSIFICATION
UNRESTRICTED
6.3
Dielectric Withstanding Voltage – There shall be no evidence of arc-over, insulation breakdown, or
excessive leakage current (> 1 milliamp) when mated connectors are tested in accordance with EIA
364-20. The following details shall apply:
a)
b)
c)
d)
Test Voltage – 200 volts (DC RMS or AC, 60Hz).
Test Duration – 60 seconds.
Test Condition – 1 (760 Torr – sea level).
Points of Measurement – Between adjacent and opposing contacts.
6.4
Current Rating – The temperature rise above ambient shall not exceed 30
°C
at any point in the
system when all contacts are powered at 0.45 ampere(s) or one contact is powered at 2.0 amperes.
The following details shall apply:
a) Ambient Conditions – Still air at 25
°C.
b) Reference – BUS-03-601.
c) A plug and receptacle were soldered to 38mm x 82 mm single sided board with solid layer of 3 oz.
Copper. Power applied to connectors through wires screwed to corner of boards. Thermocouple
located in center of connectors. See Figure 2.
FIGURE 1
Termination Resistance Measurement Points
Note: If ambient temperature varies by more than 4º between measurements, all values shall be corrected to a
standard ambient temperature.
FIGURE 2
Maximum Current Set-up
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDS: Rev :R
STATUS:Released
Printed: Oct 16, 2013
Microchip MCU
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