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AM29LV256MH101EF

产品描述Flash, 16MX16, 100ns, PDSO56, MO-142EC, TSOP-56
产品类别存储    存储   
文件大小150KB,共10页
制造商SPANSION
官网地址http://www.spansion.com/
标准
下载文档 详细参数 全文预览

AM29LV256MH101EF概述

Flash, 16MX16, 100ns, PDSO56, MO-142EC, TSOP-56

AM29LV256MH101EF规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SPANSION
零件包装代码TSOP1
包装说明MO-142EC, TSOP-56
针数56
Reach Compliance Codecompliant
ECCN代码3A991.B.1.A
最长访问时间100 ns
备用内存宽度8
JESD-30 代码R-PDSO-G56
JESD-609代码e3
长度18.4 mm
内存密度268435456 bit
内存集成电路类型FLASH
内存宽度16
湿度敏感等级3
功能数量1
端子数量56
字数16777216 words
字数代码16000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织16MX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
编程电压3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
类型NOR TYPE
宽度14 mm
Base Number Matches1

文档预览

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ADVANCE INFORMATION
Am29LV256M
256 Megabit (16 M x 16-Bit/32 M x 8-Bit) MirrorBit 3.0 Volt-only
Uniform Sector Flash Memory with VersatileI/O Control
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
s
Single power supply operation
— 3 volt read, erase, and program operations
s
VersatileI/O control
— Device generates and tolerates voltages on CE# and
DQ I/Os as determined by the voltage on the V
IO
pin;
operates from 1.65 to 3.6 V
s
Manufactured on 0.23 µm MirrorBit process
technology
s
SecSi (Secured Silicon) Sector region
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
— May be programmed and locked at the factory or by
the customer
s
Flexible sector architecture
— Five hundred twelve 32 Kword (64 Kbyte) sectors
s
Compatibility with JEDEC standards
— Provides pinout and software compatibility for
single-power supply flash, and superior inadvertent
write protection
s
Minimum 100,000 erase cycle guarantee per sector
s
20-year data retention at 125°C
PERFORMANCE CHARACTERISTICS
s
High performance
— 90 ns access time
— 25 ns page read times
— 0.4 s typical sector erase time
— 5.9 µs typical write buffer word programming time:
16-word/32-byte write buffer reduces overall
programming time for multiple-word updates
— 4-word/8-byte page read buffer
— 16-word/32-byte write buffer
s
Low power consumption (typical values at 3.0 V, 5
MHz)
— 30 mA typical active read current
— 50 mA typical erase/program current
— 1 µA typical standby mode current
s
Package options
— 56-pin TSOP
— 64-ball Fortified BGA
SOFTWARE & HARDWARE FEATURES
s
Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-word or byte programming time
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
s
Hardware features
— Sector Group Protection: hardware-level method of
preventing write operations within a sector group
— Temporary Sector Unprotect: V
ID
-level method of
changing code in locked sectors
— WP#/ACC input accelerates programming time
(when high voltage is applied) for greater throughput
during system production. Protects first or last sector
regardless of sector protection settings
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) detects program or
erase cycle completion
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication#
25263
Rev:
A
Amendment/+4
Issue Date:
April 26, 2002
Refer to AMD’s Website (www.amd.com) for the latest information.

 
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