D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
80960JA/JF/JD/JS/JC/JT 3.3 V
Embedded 32-Bit Microprocessor
Datasheet
Product Features
s
s
s
s
s
Code Compatible with all 80960Jx
Processors
High-Performance Embedded Architecture
— One Instruction/Clock Execution
— Core Clock Rate is:
1x the Bus Clock for 80960JA/JF/JS
2x the Bus Clock for 80960JD/JC
3x the Bus Clock for 80960JT
— Load/Store Programming Model
— Sixteen 32-Bit Global Registers
— Sixteen 32-Bit Local Registers (8 sets)
— Nine Addressing Modes
— User/Supervisor Protection Model
Two-Way Set Associative Instruction
Cache
— 80960JA - 2 Kbyte
— 80960JF/JD - 4 Kbyte
— 80960JS/JC/JT - 16 Kbyte
— Programmable Cache-Locking
Mechanism
Direct Mapped Data Cache
— 80960JA - 1 Kbyte
— 80960JF/JD - 2 Kbyte
— 80960JS/JC/JT - 4 Kbyte
— Write Through Operation
On-Chip Stack Frame Cache
— Seven Register Sets May Be Saved
— Automatic Allocation on Call/Return
— 0-7 Frames Reserved for High-Priority
Interrupts
s
s
s
s
s
s
s
s
On-Chip Data RAM
— 1 Kbyte Critical Variable Storage
— Single-Cycle Access
3.3 V Supply Voltage
— 5 V Tolerant Inputs
— TTL Compatible Outputs
High Bandwidth Burst Bus
— 32-Bit Multiplexed Address/Data
— Programmable Memory Configuration
— Selectable 8-, 16-, 32-Bit Bus Widths
— Supports Unaligned Accesses
— Big or Little Endian Byte Ordering
High-Speed Interrupt Controller
— 31 Programmable Priorities
— Eight Maskable Pins plus NMI#
— Up to 240 Vectors in Expanded Mode
Two On-Chip Timers
— Independent 32-Bit Counting
— Clock Prescaling by 1, 2, 4 or 8
— Internal Interrupt Sources
Halt Mode for Low Power
IEEE 1149.1 (JTAG) Boundary Scan
Compatibility
Packages
— 132-Lead Pin Grid Array (PGA)
— 132-Lead Plastic Quad Flat Pack
(PQFP)
— 196-Ball Mini Plastic Ball Grid Array
(MPBGA)
Order Number: 273159-006
August
2004
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel’s website at http://www.intel.com.
AlertVIEW, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, CT Connect, CT Media, Dialogic, DM3, EtherExpress,
ETOX, FlashFile, i386, i486, i960, iCOMP, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Create & Share,
Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel Play, Intel Play logo, Intel
SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation, Intel Xeon, Intel XScale, IPLink, Itanium, LANDesk, LanRover, MCS, MMX, MMX
logo, Optimizer logo, OverDrive, Paragon, PC Dads, PC Parents, PDCharm, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your
Command, RemoteExpress, Shiva, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside., The Journey Inside,
TokenExpress, Trillium, VoiceBrick, Vtune, and Xircom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United
States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © Intel Corporation, 2002,
2004
2
Datasheet
Contents
Contents
1.0
2.0
Introduction....................................................................................................................................
7
80960Jx Overview..........................................................................................................................
9
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
3.0
3.1
3.2
80960 Processor Core........................................................................................................ 10
Burst Bus ............................................................................................................................11
Timer Unit ...........................................................................................................................11
Priority Interrupt Controller..................................................................................................11
Instruction Set Summary ....................................................................................................12
Faults and Debugging.........................................................................................................12
Low Power Operation ......................................................................................................... 12
Test Features......................................................................................................................12
Memory-Mapped Control Registers ....................................................................................13
Data Types and Memory Addressing Modes......................................................................13
Available Processors and Packages ..................................................................................15
Pin Descriptions ..................................................................................................................16
3.2.1 Functional Pin Definitions ......................................................................................16
3.2.2 80960Jx 132-Lead PGA Pinout .............................................................................23
3.2.3 80960Jx 132-Lead PQFP Pinout ...........................................................................27
3.2.4 80960Jx 196-Ball MPBGA Pinout ..........................................................................30
Absolute Maximum Ratings ................................................................................................35
Operating Conditions ..........................................................................................................35
Connection Recommendations...........................................................................................36
VCC5 Pin Requirements (VDIFF) .......................................................................................36
VCCPLL Pin Requirements ................................................................................................37
D.C. Specifications .............................................................................................................38
A.C. Specifications..............................................................................................................42
4.7.1 A.C. Test Conditions and Derating Curves ............................................................45
4.7.1.1 Output Delay or Hold vs. Load Capacitance..........................................46
4.7.1.2 T
LX
vs. AD Bus Load Capacitance.........................................................47
4.7.1.3 ICC Active vs. Frequency ......................................................................49
4.7.2 A.C. Timing Waveforms .........................................................................................53
80960JS/JC/JT Device Identification Register....................................................................60
80960JD Device Identification Register ..............................................................................61
80960JA/JF Device Identification Register .........................................................................62
Thermal Management Accessories ....................................................................................68
6.1.1 Heatsinks ...............................................................................................................68
Basic Bus States.................................................................................................................79
Boundary-Scan Register.....................................................................................................80
Packaging Information................................................................................................................15
4.0
Electrical Specifications
.............................................................................................................35
4.1
4.2
4.3
4.4
4.5
4.6
4.7
5.0
Device Identification....................................................................................................................59
5.1
5.2
5.3
6.0
Thermal Specifications
...............................................................................................................63
6.1
7.0
Bus Functional Waveforms
........................................................................................................69
7.1
7.2
Datasheet
3
Contents
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
80960Jx Microprocessor Package Options .................................................................................. 7
80960Jx Block Diagram.............................................................................................................. 10
132-Lead Pin Grid Array Top View-Pins Facing Down............................................................... 23
132-Lead Pin Grid Array Bottom View-Pins Facing Up .............................................................. 24
132-Lead PQFP - Top View ....................................................................................................... 27
196-Ball Mini Plastic Ball Grid Array Top View-Balls Facing Down ............................................ 30
196-Ball Mini Plastic Ball Grid Array Bottom View-Balls Facing Up ........................................... 31
VCC5 Current-Limiting Resistor ................................................................................................. 36
VCCPLL Lowpass Filter ............................................................................................................. 37
A.C. Test Load............................................................................................................................ 45
Output Delay or Hold vs. Load Capacitance–80960JS/JC/JT (3.3 V Signals) .......................... 46
Output Delay or Hold vs. Load Capacitance–80960JS/JC/JT (5 V Signals) ............................. 46
Output Delay or Hold vs. Load Capacitance–80960JA/JF/JD .................................................... 47
T
LX
vs. AD Bus Load Capacitance–80960JS/JC/JT (3.3 V Signals) ......................................... 47
T
LX
vs. AD Bus Load Capacitance–80960JS/JC/JT (5 V Signals) ............................................ 48
T
LX
vs. AD Bus Load Capacitance–80960JA/JF/JD................................................................... 48
I
CC
Active (Power Supply) vs. Frequency–80960JA/JF ............................................................. 49
80960JA/JF I
CC
Active (Thermal) vs. Frequency ....................................................................... 49
80960JD I
CC
Active (Power Supply) vs. Frequency ................................................................... 50
80960JD I
CC
Active (Thermal) vs. Frequency ............................................................................ 50
80960JC I
CC
Active (Power Supply) vs. Frequency ................................................................... 51
80960JC I
CC
Active (Thermal) vs. Frequency ............................................................................ 51
80960JS I
CC
Active (Power Supply) vs. Frequency ................................................................... 52
80960JS I
CC
Active (Thermal) vs. Frequency ............................................................................ 52
CLKIN Waveform........................................................................................................................ 53
T
OV1
Output Delay Waveform .................................................................................................... 53
T
OF
Output Float Waveform ....................................................................................................... 54
T
IS1
and T
IH1
Input Setup and Hold Waveform .......................................................................... 54
T
IS2
and T
IH2
Input Setup and Hold Waveform .......................................................................... 54
T
IS3
and T
IH3
Input Setup and Hold Waveform .......................................................................... 55
T
IS4
and T
IH4
Input Setup and Hold Waveform .......................................................................... 55
T
LX
, T
LXL
and T
LXA
Relative Timings Waveform ........................................................................ 56
DT/R# and DEN# Timings Waveform......................................................................................... 56
TCK Waveform ........................................................................................................................... 57
T
BSIS1
and T
BSIH1
Input Setup and Hold Waveforms................................................................. 57
T
BSOV1
and T
BSOF1
Output Delay and Output Float Waveform ................................................. 57
T
BSOV2
and T
BSOF2
Output Delay and Output Float Waveform ................................................. 58
T
BSIS2
and T
BSIH2
Input Setup and Hold Waveform................................................................... 58
80960JS/JC/JT Device Identification Register Fields ................................................................. 60
80960JD Device Identification Register Fields ........................................................................... 61
80960JA/JF Device Identification Register Fields ...................................................................... 62
Non-Burst Read and Write Transactions Without Wait States, 32-Bit Bus................................. 69
Burst Read and Write Transactions Without Wait States, 32-Bit Bus ........................................ 70
Burst Write Transactions With 2,1,1,1 Wait States, 32-Bit Bus .................................................. 71
Burst Read and Write Transactions Without Wait States, 8-Bit Bus .......................................... 72
Burst Read and Write Transactions With 1, 0 Wait States
and Extra Tr State on Read, 16-Bit Bus ..................................................................................... 73
47 Double Word Read Bus Request, Misaligned One Byte From
Quad Word Boundary, 32-Bit Bus, Little Endian ........................................................................ 74
4
Datasheet
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
