HSMS-8101, 8202, 8207, 8209
Data Sheet
Surface Mount Microwave Schottky Mixer Diodes
Description/Applications
These low cost microwave Schottky diodes are specifically
designed for use at X/Ku‑bands and are ideal for DBS and
VSAT downconverter applications. They are available in
SOT‑23 and SOT‑143 standard package configurations.
Note that Avago's manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of
match.
Features
•
Optimized for use at 10‑14 GHz
•
Low Capacitance
•
Low Conversion Loss
•
Low RD
•
Low Cost Surface Mount Plastic Package
•
Lead‑free
Plastic SOT-23 Package
Package Lead Code Identification
(Top View)
SINGLE
3
SERIES
3
1
Plastic SOT-143 Package
3
#1
RING
QUAD
2
1
#2
2
4
CROSS-OVER
QUAD
3
4
1
#7
2
1
#9
2
Absolute Maximum Ratings
[1]
, T
A
= +25°C
Symbol
P
T
P
IV
T
J
T
STG
, T
op
Parameter
Total Device Dissipation
[2]
Peak Inverse Voltage
Junction Temperature
Storage and Operating
Temperature
Unit
mW
V
°C
°C
Min.
—
—
—
‑65
Max.
75
4
+150
+150
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. Measured in an infinite heat sink at T
CASE
= 25°C. Derate linearly to
zero at 150°C per diode.
DC Electrical Specifications, T
A
= 25°C
HSMS-8101
Symbol
V
BR
C
T
DC
T
R
D
DR
D
V
F
DV
F
HSMS-8202
Min.
4
HSMS-8207
Min.
4
HSMS-8209
Min.
4
Parameters and Test Conditions
Breakdown Voltage
I
R
= 10 µA
Total Capacitance
V
R
= 0 V, f = 1 MHz
Capacitance Difference
V
R
= 0 V, f = 1 MHz
Dynamic Resistance
I
F
= 5 mA
Dynamic Resistance Difference
I
F
= 5 mA
Forward Voltage
I
F
= 1 mA
Forward Voltage Difference
I
F
= 1 mA
Lead Code
Package Marking Code
where x is date code
Units
V
pF
pF
Ω
Ω
mV
mV
Min.
4
Max.
Max.
Max.
Max.
0.26
—
14
—
250
350
—
1
R1x
2
2Rx
250
0.26
0.04
14
2
350
20
7
R7x
250
0.26
0.04
14
2
350
20
9
R9x
250
0.26
0.04
14
2
350
20
RF Electrical Parameters, T
A
= 25°C
Symbol
L
c
Z
IF
SWR
Linear Equivalent Circuit
Units
dB
Ω
Parameter
Conversion Loss at 12 GHz
IF Impedance
SWR at 12 GHz
Typical
6.3
150
1.2
0.08 pF
Note:
DC Load Resistance = 0 Ω; LO Power = 1 mW.
1.0 nH
1.3 nH
6
0.17 pF
R
j
SPICE Parameters
I
S
= 4.6 E‑8
R
S
= 6
N = 1.09
B
V
= 7.3
I
BV
= 10E‑5
E
G
= 0.69
C
JO
= 0.18 E‑12
P
B
(V
J
) = 0.5
M = 0.5
FC = 0.5
TT = 0
Self Bias
1 mA
R
j
256
2.5 mA
142
2
Typical Performance, T
C
= 25°C
100
30
I
F
(Left Scale)
I
F
- FORWARD CURRENT (mA)
FORWARD CURRENT (mA)
30
V
F
- FORWARD VOLTAGE DIFFERENCE (mV)
9
10
10
10
1
T
A
= +125 C
T
A
= +25 C
T
A
= –55 C
0
0.2
0.4
FORWARD VOLTAGE (V)
0.6
0.8
V
F
(Right Scale)
1
1
CONVERSION LOSS (dB)
8
7
0.1
0.01
0.3
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.3
0.55
6
–7 –5 –3 –1
1
3
5
7
9
11 13
V - FORWARD VOLTAGE (V)
LOCAL OSCILLATOR POWER (dBm)
Figure 1. Typical Forward Current vs. Forward
Voltage at Three Temperatures.
Figure 2. Typical VF Match, HSMS-820X Pairs and
Quads.
Figure 3. Typical Conversion Loss vs. Local Oscillator
Power.
Ordering Information
Specify part number followed by option. For example:
HSMS ‑ 8101 ‑ XXXG
Bulk or Tape and Reel Option
Part Number
Surface Mount Schottky
Profile Option Descriptions
‑BLKG = Bulk
‑TR1G = 3K pc. Tape and Reel, Device Orientation
Figures 4, 5
‑TR2G = 10K pc. Tape and Reel, Device Orientation
Figures 4, 5
Tape and Reeling conforms to Electronic Industries RS‑
481, “Taping of Surface Mounted Components for Auto‑
mated Placement.”
Device Orientation
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
4 mm
END VIE W
TOP VIEW
4 mm
END VIEW
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
Figure 4. Option -TR1G/-TR2G for SOT-23 Packages.
Figure 5. Option -TR1G/-TR2G for SOT-143 Packages.
3
ABC
ABC
ABC
ABC
8 mm
ABC
ABC
ABC
ABC
8 mm
Package Characteristics
Lead Material
Lead Finish
Maximum Soldering Temperature
Minimum Lead Strength
Typical Package Inductance
Typical Package Capacitance
Alloy 42
Tin 100% (Lead‑free option)
260°C for 5 seconds
2 pounds pull
2 nH
0.08 pF (opposite leads)
Package Dimensions
Outline 23 (SOT-23)
e2
e1
Recommended PCB Pad Layout for Avago’s SOT-23
Products
0.039
1
0.039
1
E
XXX
e
E1
L
B
D
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
C
DIMENSIONS (mm)
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
0.079
2.0
0.035
0.9
0.031
0.8
Dimensions in inches
mm
A
A1
Notes:
XXX-package marking
Drawings are not to scale
Outline 143 (SOT-143)
e2
e1
B1
Recommended PCB Pad Layout for Avago’s SOT-143
Products
0.112
2.85
0.079
2
0.033
0.85
0.081
2.05
0.048
1.2
0.114
2.9
E
XXX
E1
L
B
C
DIMENSIONS (mm)
SYMBOL
A
A1
B
B1
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
0.071
1.8
e
0.033
0.85
0.047
1.2
0.031
0.8
0.033
0.85
inches
mm
D
A
Dimensions in
A1
Notes:
XXX-package marking
Drawings are not to scale
4
Tape Dimensions and Product Orientation
For Outline SOT-23
P
D
P
2
E
P
0
F
W
t1
D
1
9
°
MAX
Ko
8
°
MAX
13.5
°
MAX
A
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
8.00 +0.30 - 0.10
0.229
±
0.013
3.50
±
0.05
2.00
±
0.05
B
0
SIZE (INCHES)
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315 +0.012 - 0.004
0.009
½
0.0005
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
5
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