Microwave MLC’s
AQ Series
These porcelain and ceramic dielectric multilayer capacitor
(MLC) chips are best suited for RF/ Microwave applications
typically ranging from 10 MHz to 4.2 GHz. Characteristic is a
fine grained, high density, high purity dielectric material imper-
vious to moisture with heavy internal palladium electrodes.
These characteristics lend well to applications requiring:
1) high current carrying capabilities;
2) high quality factors;
3) very low equivalent series resistance;
4) very high series resonance;
5) excellent stability under stresses of changing volt-
age, frequency, time and temperature.
MECHANICAL DIMENSIONS:
W
T
L
inches (millimeters)
Width (W)
.055±.015
(1.40±.381)
.055±.015
(1.40±.381)
.110±.020
(2.79±.508)
.110±.010
(2.79±.508)
Case
AQ11
AQ12
Length (L)
.055±.015
(1.40±.381)
.055 + .015 - .010
(1.40+ .381 - .254)
.110±.020
(2.79±.508)
.110 + .020 - .010
(2.79 +.889 -.254)
Thickness (T)
.020/.057
(.508/1.45)
.020/.057
(.508/1.45)
.030/.102
(.762/2.59)
.030/.102
(.762/2.59)
Band Width (bw)
.010 + .010 -.005
(.254 +.254 -.127)
.010 + .010 -.005
(.254 +.254 -.127)
.015±.010
(.381±.254)
.015±.010
(.381±.254)
A 1J
10
bw
AQ13
AQ14
HOW TO ORDER
AQ
11
E
M
100
J
A
1
ME
Case
Size
AVX Style
AQ11, AQ12,
AQ13, AQ14
(See Chart)
Capacitance
EIA Capacitance Code in pF.
Failure Rate
Code
A = Not
Applicable
Packaging*
Code
3A = 13" Reel Unmarked
ME = 7" Reel Marked
RE = 13" Reel Marked
WE = Waffle Pack Marked
BE = Bulk Marked
Voltage
Code
5 = 50V
1 = 100V
E = 150V
2 = 200V
9 = 300V
7 = 500V
First two digits = significant
figures or “R” for decimal
place.
Third digit = number of zeros
or after “R” significant figures.
Temperature
Coefficient Code
M = +90±20ppm/°C (AQ11/12/13/14)
A = 0±30ppm/°C (AQ11/12/13/14)
C = 15% (“J” Termination only) (AQ12/14)
Capacitance
Tolerance
Code
B = ±.1 pF
C = ±.25 pF
D = ±.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
N = ±30%
Termination
Style Code
1 = Pd/Ag (AQ11/13 only)
7 = Ag/Ni/Au (AQ11/13 only)
J = Nickel Barrier Sn/Pb
(60/40) - (AQ12/14 only)
T = 100% Tin (AQ12/14 only)
9
PACKAGING
Standard Packaging = Waffle Pack (maximum quantity is 80)
Not RoHS Compliant
TAPE & REEL:
All tape and reel specifications are in compliance with EIA RS481
(equivalent to IEC 286 part 3).
LEAD-FREE COMPATIBLE
COMPONENT
Sizes SQCA through SQCB, CDR11/12 through 13/14.
—8mm carrier
—7" reel: ≤0.040" thickness = 2000 pcs
≤0.075" thickness = 2000 pcs
—13" reel: ≤0.075" thickness = 10,000 pcs
For RoHS compliant products,
please select correct termination style.
156
Microwave MLC’s
AQ Series
ELECTRICAL SPECIFICATIONS
AQ11, AQ12, AQ13, AQ14
M&A
Temperature Coefficient (TCC)
(M) +90 ± 20 PPM/ºC ( -55ºC to +125ºC)
(M) +90 ± 30 PPM/ºC ( +125ºC to +175ºC)
(A)
0 ± 30 PPM/ºC
(M) 0.1 pF to 1000 pF
(A) 0.1 pF to 5100 pF
0.1 pF to 330 pF: from -55ºC to +175ºC
360 pF to 5100 pF: from -55ºC to +125ºC
Greater than 10,000 at 1 MHz
Greater than 10,000 at 1 MHz
Greater than 2,000 at 1 MHz
Greater than 2,000 at 1 KHz
Greater than 10,000 at 1 MHz
Greater than 2,000 at 1 MHz
0.1 pF to 470 pF
10
6
Megohms min. @ 25ºC at rated WVDC
10
5
Megohms min. @ 125ºC at rated WVDC
510 pF to 5100 pF
10
5
Megohms min. @ 25ºC at rated WVDC
10
4
Megohms min. @ 125ºC at rated WVDC
See Capacitance Values table
250% of rated WVDC for 5 secs
(for 500V rated 150% of rated voltage)
None
None
± (0.02% or 0.02 pF), whichever is greater
C
±15% (-55ºC to 125ºC)
Capacitance Range
Operating Temperature
Quality Factor (Q) M Dielectric A & B Case
A Dielectric B Case
0.001μF to 0.1μF
-55°C to +125°C
2.5% @ 1kHz
0.1 - 200 pF
220 - 1000 pF
1100 - 5100 pF
0.1 - 100 pF
110 - 1000 pF
10
4
Megohms min. @ 25ºC at rated WVDC
10
3
Megohms min. @ 125ºC at rated WVDC
A Dielectric A Case
Insulation Resistance (IR)
Working Voltage (WVDC)
Dielectric Withstanding Voltage (DWV)
Aging Effects
Piezoelectric Effects
Capacitance Drift
See Capacitance Values table
250% of rated WVDC for 5 secs
<3% per decade hour
None
Not Applicable
ENVIRONMENTAL CHARACTERISTICS
AVX SQLB will meet and exceed the requirements of EIA-198, MIL-PRF-55681 and MIL-PRF-123
Themal Shock
Moisture Resistance
Low Voltage Humidity
Mil-STD-202, Method 107, Condition A
Mil-STD-202, Method 106
Mil-STD-202, Method 103, condition A, with 1.5 VDC
applied while subjected to an environment of 85ºC with
85% relative humidity for 240 hours
Mil-STD-202, Method 108, for 2000 hours at 125ºC
Mil-STD-202, Method 213, Condition J
Mil-STD-202, Method 204, Condition B
Mil-STD-202, Method 104, Condition B
Mil-STD-202, Method 101, Condition B
Mil-STD-202, Method 208
Mil-STD-202, Method 211
Mil-STD-202, Method 102, Condition C
Mil-STD-202, Method 105, Condition B
Mil-STD-202, Method 210, Condition C
Life Test
Shock
Vibration
Immersion
Salt Spray
Solderability
Terminal Strength
Temperature Cycling
Barometric Pressure
Resistance to Solder Heat
9
157
Microchip MCU
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